Matrix 105 r plasma descum asher description peter
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Matrix 105 r plasma descum asher description peter

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Allwin21 Corp. focuses on and professionally provides the following fully refurbished and customized Matrix Plasma Asher/Stripper/Descum/Etcher equipment with high Quality,right Cost,quick Delivery ...

Allwin21 Corp. focuses on and professionally provides the following fully refurbished and customized Matrix Plasma Asher/Stripper/Descum/Etcher equipment with high Quality,right Cost,quick Delivery and excelent Service for Semiconductor industry,MEMS, Biomedical, Nanotechnology,Solar,LEDs etc.

Matrix 105R | Matrix 105/205/106 | Matrix 303

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Matrix 105 r plasma descum asher description peter Matrix 105 r plasma descum asher description peter Document Transcript

  • Matrix 105R Plasma Descum Asher Systems Address: 3521 Leonard Court, Santa Clara, CA95054 U.S.A. Website: http://www.allwin21.comAllwin21 Corp. Tel.: +1-408-988-5188 Fax.: +1-408-904-7168 E-mail: sales@allwin21.com All Specification and information here are subject to change without notice and can not be used for purchase and facility planning.
  • Matrix 105R System Overview Matrix 105R is a photo-resist removal system that reduces carbon-chain polymer resists in a Typical Applications non-damaging environment. Each wafer is processed  GaAs wafer Stripping and Descum individually by means a chemical reaction induced by a gas plasma. Matrix 105R provides high  Thin Film Head Resist Cleaning and Surface Treatment throughput in a single wafer system capable of  MEMS (Micro Electro- Mechanical Systems handling wide variety of wafers from 2” up to 6”  Photoresist Stripping with solid robot wafer transfer. By maintaining independent closed-loop system controls, the system High dose implant (As+, B+, P+) optimizes vital device parameters. The system Post-polysilicon etch consists of the following major assemblies: Post-metal etch  Process Model assembly  Touch screen PC controller Model Post-oxide etch  Wafer centralization station Rework  Solid robot with one arm  Controlled Resist Removal  Fixed Cassette Station Post-develop descum (pre-etch)  1 main control board and 1 distribution board  RF Generator and matching network Dry/wet process capability  AC/DC/Temperature control Assembly Resist planarization  Gas pressure control system (CDA or N2) Uniformity capability (5% 1)  Gas Distribution panel ( 2 gas lines, 3 gas lines maximum )  Vacuum pump(Optional) Key Features  More reliable Solid Robot wafer transfer  Comparable integrated real time process control system with PC controller, Touch screen, GUI interface. and Programmable diagnostic.  Single wafer, Multi-Step processing  Closed-loop process with accurate control  Wafer chuck precise temperature control loop, providing temperatures of up to 200 C for process stability  Modular design  Butterfly-Type pressure controller  Pins up-down to heat wafer  2inch to 6 inch wafer capability  Especially for GaAs descum process. Address: 3521 Leonard Court, Santa Clara, CA95054 U.S.A. Website: http://www.allwin21.comAllwin21 Corp. Tel.: +1-408-988-5188 Fax.: +1-408-904-7168 E-mail: sales@allwin21.com
  • Matrix 105R System Specification Principles of Operation Electrical Specification The Matrix 105R is process driven by user friendly Total AC power: Single phase: 208/220V, 30A for main commands. It functions in the following sequence: console, 3-wire (2-main,1-ground); 3 Phase 380V/208V: 1) Loading Transport One wafer at a time is 10A for vacuum pump (optional). robotically picked from a cassette, transported to and deposited in the reaction chamber. The a) Main Console Chamber is automatically sealed from the atmosphere. b) RF power and AC and DC voltages are supplied 2) Through a series of PC controlled operating steps, Powered by input voltage 208/220 VAC , 50/60 the wafer is processed, i.e., the desired material is Hz, single phase, main circuit breaker rating 30 AMPS. Actual voltage must be specified at the time etched. The processing steps include the of PO . following: a) The chamber is evacuated to a preset c) Vacuum Pump pressure. Vacuum pump (optional) 3 phases 208/380V, b) Gas flow to the chamber is initiated at a 50/60Hz. predetermined and process-selected controlled rate, and process-selected d) Water Temperature Controller (optional) pressure is maintained. Heat re-circulator, 200-220VAC, 50/60 Hz, 8Amps, c) A gas plasma is produced by exposing the single phase. 3/8” swagelok for the machine, ½” appropriate gases to radio frequency water hose for the city water. energy from a RF generator operating at a frequency of 13.56 MHz. e) Solid Robot d) The gas plasma reacts with the material to This power supply consists of two separate power be etched to form gaseous byproducts. supplies. The switching power supply is for the These byproducts are then removed from AT–bus +5, –5, +12 and –12 VDC. The linear power the chamber by the vacuum pump. supply is for the amplifiers (36 VDC) and 24 VDC 3) Process deactivation. for the robot. The power supply for the motor output is controlled from the I/O Control board. (All When the processing of the wafer is complete, these DC voltage are provided by robot controller. the power and the gas flow are stopped. AC power line of robot controller will be set as Nitrogen is then used to restore the chamber to 208/220V and connected to AC/DC/Temperature atmospheric pressure. control Assembly before shipment.) . 4) Unloading Transport The Wafer is robotically returned to its original position and orientation in the Butterfly Pressure Specification cassette. Subsequent wafers are similarly Throttle valve is connected to distribution board and selected, transported, processed and returned controlled by AW hardware/software to the cassette. Address: 3521 Leonard Court, Santa Clara, CA95054 U.S.A. Website: http://www.allwin21.comAllwin21 Corp. Tel.: +1-408-988-5188 Fax.: +1-408-904-7168 E-mail: sales@allwin21.com
  • Matrix 105R System Specification(Cont.) RF Generator Specification Process Gases Specification Frequency: 13.56 MHz. Gas Type: Nitrogen Rated. Frequency stability: ±0.005% Max Gas Flow Rate: RF Output Impedance: 50 Ohms Gas 1- O2 MFC 3000 sccm Power line: power supply taps provided Gas 2- O2 MFC 1000 sccm 190/208/220/240 volts, single phase, 50/60Hz, at 10 Gas 3- optional Amps or less at full power output. There are two Gases flow range can meet the customer requirement. separate power relay coils – one for 190 AC Pressure: Proof: 1500 psig operation and one for 208-240 VAC operation. AC Output Indication: 0 to 5.0 VDC power line will be set as 208/220V and connected to Input power: +15 VDC (±4%), 25 mApms, -15 VDC (±4%), AC/DC/Temperature control Assembly before 125mAmps (2.25Watts) shipment. Leak Integrity: 1X10-7 SCCS He For ACG-6B, the AC power supply will be works on Fittings: ¼” VCR 100-240V without setup. RF power Control: Automatically forward power leveled. Maximum power Output: 600 Watts. Eurotherm Temperature Controller Harmonic Distortion: All harmonics are more than 55dB below the fundamental. Noise, hum and ripple: It is assembled in AC/DC/Temperature control Assembly. more than 30dB down at maximum power output. Sample frequency:8 times per second AC line to power regulation: 0.25% maximum Supply voltage:80 to 264VAC change in output power for 7.5% change in the AC Power consumption:5.0 watts line voltage. Operating temperature:0 - 50 °C Power output meter: 0 to 750 Watts with accuracy of Temperature control range from 20 degree C to 500 4% of full scale. Forward and reverse power by degree C switch selection. Relative humidity:0 to 95% non-condensing Auto. Forward power leveling: 1 to 650 watts Inputs choose from: 11 Different sensor linearization or internally or externally controlled. linear Power folds back protection: Automatic. Occurs Outputs choose from: Relay, logic, triac, or DC analogue when reverse power reaches 150 Watts, or power (808/847 only) amplifier current exceeds preset limit. Cooling: water flow at 0.8 Gal. /min. Minimum. Connections provided accept 3/8” swagelok. For ACG-6B, cooling water is not necessary. Dimensions and Weight Maximum water inlet temperature +35 degree C WIDTH 27" (685cm) Wafer Temperature Controller DEPTH 50" (127 cm) Temperature range: 60 degree C to 200 degree C with HEIGHT 64” (165 cm) (include feet) heat re-circulator. Chamber Capacity: 1.5 Gals (5.7 liters) WEIGHT 750lbs. (340 Kg.) Heater capacity: 2000 Watts Address: 3521 Leonard Court, Santa Clara, CA95054 U.S.A. Website: http://www.allwin21.comAllwin21 Corp. Tel.: +1-408-988-5188 Fax.: +1-408-904-7168 E-mail: sales@allwin21.com