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L Foundry Gmb H Rev1.7.1

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  • 1. LFoundry … the customer-specific manufacturer of choice for analog, mixed-signal and specialized technologies © 2010 LFoundry GmbH. All rights reserved.
  • 2. Outline Company & Business Update Foundry Service Manufacturing Technology2 © 2010 LFoundry GmbH. All rights reserved.
  • 3. LFoundry FactsBusiness Model Providing dedicated foundry capacity and services for  Specialized analog, mixed signal designs  Customer specific technologies  Joint technology developments Offering worldwide customers advanced process technologies and a robust portfolio of IP, innovative technology extensions and certifications. LFoundry “Sicherheit” for  Reliable supply and delivery  Superior-price performance  Protection of Customer Design and IP  Stay leading-edge in analog mixed signal and customized technologies  Sustainable, dedicated technology and foundry partner3 © 2010 LFoundry GmbH. All rights reserved.
  • 4. LFoundry Profile … the customer-specific manufacturer of choice … featuring unparalleled flexibility,  … ensuring “Sicherheit” speed and reliability, security and reliability to meet protection for customers, aggressive on-time their designs and their IP delivery demands  … offering worldwide customers advanced process technologies and a robust portfolio of IP, innovative technology extensions and certifications 4 © 2010 LFoundry GmbH. All rights reserved.
  • 5. LFoundry Organisation CFO CTO COO CEO Dr. H.- M. G. Spitzlsperger G. Ernst M. Lehnert Dudenhausen V.P. Sales&Marketing V.P. Quality President France T.D. / R&D Operations Michael Hösl Gerhard Weindl Jean-Pierre Delesse Finance Purchasing I.T. H.R. Landshut LFoundry Silicon Rousset Foundry GmbH S.A.S.5 © 2010 LFoundry GmbH. All rights reserved.
  • 6. LFoundry Worldwide Organization Headquarter Fabs Sales Fabs Landshut 330 employees Rousset 750 employees SalesForce UK 2 Germany 4 France 2 USA 4 Korea/Taiwan 1 Israel 1 Japan 16 © 2010 LFoundry GmbH. All rights reserved.
  • 7. LFoundry at a Glance Landshut, Germany Rousset, France LFoundry Corporate Headquarter  LFoundry Rousset Landshut Silicon Foundry wafer size: 200 mm wafer size: 200 mm capacity 8“: >20k wspm capacity 8“: up to 12k wspm cleanroom area: 11000 m² cleanroom area (CR): 5000 m²  750 employees, >10y experience 330 employees, >18y experience  Technology Technology 0.15µm/0.11µm PDK i.D. 0.35µm, 0.15µm PDK, 0.11µm i.D. 0.18/ 0.15/ 0.13/ 0.11µm customer specific 0.35µm … 0.13µm customer specific Path to 0.08µm (tools available) MEMS, Opto processes7 © 2010 LFoundry GmbH. All rights reserved.
  • 8. LFoundry Milestones  Development  Acquisition of Atmel’s cooperation with IHP Fab in Rousset (F) Microelectronics  Ramp RF MEMS for  150nm CMOS PDK EPCOS release and MPW  Collaboration with start TESAT SpacecomLFoundry 2H 2008 1H 2009 2H 2009 1H 2010 2H 2010 1H 2011Foundation  Development of open  Open UK office  Development access based PDK  Join IPL Alliance to start of 110nm develop iPDK  SST Flash in 150nm  Start manufacturing of Automotive design for MAS Oy8 © 2010 LFoundry GmbH. All rights reserved.
  • 9. LIFE (LFoundry integrated Foundry Ecosystem) LFoundry wants to interact with the customer9 © 2010 LFoundry GmbH. All rights reserved.
  • 10. LFoundry Revenue Shareby Region European market dominated by Germany and France Overall healthy worldwide share Our Customers serve the global market Germany 32,2% France 12,0% Europe United Kingdom 3,4% USA Israel 3,0% Asia Europe 4,1% USA 30,0% Asia 15,2% LFoundry Customers Target Market [%] Worldwide Market [%]10 © 2010 LFoundry GmbH. All rights reserved.
  • 11. LFoundry Revenue by Market Security Aerospace Communication Medical Utilisation of Radiation hard RF applications New CMOS security and IP 150nm with high integration applications protection strength Customer specific CMOS Opto processes Automotive Automotive Certified Communication 26,6% High Voltage LDMOS Consumer 51,6% Industry/ Energy 1,7% Automotive 2,1% Medical 6,3% Industry/Energy Security 11,4% CMOS Opto Aerospace 0,3% Power management Consumer Customer specific processes SoC, Technology Extensions Various fabless companies LFoundry markets reflects worldwide analog/mixed signal market11 © 2010 LFoundry GmbH. All rights reserved.
  • 12. Outline Company & Business Update Foundry Service Manufacturing Technology12 © 2010 LFoundry GmbH. All rights reserved.
  • 13. Prototyping ServicesFlexible Manufacturing options with superior price performance Full Mask Set  Full flexibility in timing and volume  Reasonable NRE cost MLM (Multi Layer Mask)  Full flexibility in timing for small volume production  Significantly reduced NRE costs MPW (Multi Project Wafer)  Ideal solution for prototyping and low volume production  Lowest NRE costs Monthly MPW runs for every PDK technology13 © 2010 LFoundry GmbH. All rights reserved.
  • 14. LFoundry Customers TimingAdvantage14 © 2010 LFoundry GmbH. All rights reserved.
  • 15. LFoundry EDA15 © 2010 LFoundry GmbH. All rights reserved.
  • 16. Outline Company & Business Update Foundry Service Manufacturing Technology16 © 2010 LFoundry GmbH. All rights reserved.
  • 17. Manufacturing Facts 16000 m² class 1 clean-room  32000 wafer starts per month  Automatic transportation system  Automatic Recipe Download  EDP Lot Dispatch System  98% yield performance  fast cycle time: 1.2dpm17 © 2010 LFoundry GmbH. All rights reserved.
  • 18. Key Performance Data  Benchmark line speed as key enabler for time to market  Excellent process yield performance as key enabler for cost efficiency18 © 2010 LFoundry GmbH. All rights reserved.
  • 19. Quality AssuranceCertification: QMS & Automotive QS9000 (TS 16949) Environment (ISO 14001) Smart Card Security ISO15408Standard: JEDEC JP001.01  Level 1 wafer level reliability performed by LFoundry (<10ppm fails; 10 years; max. temp. 125°C)  Level 2 device level reliability performed by our customers AEC Automotive Electronics Council Q100 Ref-F Grade 0 -40°C to 150°C  under preparation Grade 1 -40°C to 125°C  prepared Grade 2 -40°C to 105°CInitially LFoundry developed the LF150 (0.15µm) technology, which is againbased on the long time experienced similar RENESAS process (Secure MCU / Automotive).19 © 2010 LFoundry GmbH. All rights reserved.
  • 20. Outline Company & Business Update Foundry Service Manufacturing Technology20 © 2010 LFoundry GmbH. All rights reserved.
  • 21. Foundry Technology Roadmap Strong development force for innovative technology applications21 © 2010 LFoundry GmbH. All rights reserved.
  • 22. Voltage domains 5V >100V 3.3V 80V 2.5V 60V 1.2V low Vt 40V 1.2V core 8V 5V 1.2V high Vt HVMOS – LDMOS 3.3V 1.8V high speed •Industrial •Power devices 1.8V low leak •Energy Harvesting Common voltage •Aerospace Core MOS •Automotive Electronics characterised at 1.2V •Consumer Electronics •Home Entertainment •Medical appliancesultra low leak •Mobile Systems digital lib(in discussion) 22 © 2010 LFoundry GmbH. All rights reserved.
  • 23. LF150 Modularisation23 © 2010 LFoundry GmbH. All rights reserved.
  • 24. 0.15µm Foundry Technology … integrated into the user-friendly, all-in-one Process Design Kit (PDK) LF150 is a 0.15µm modular CMOS process:  Poly-, Metal- and Diffusion Resistors - 19 Mask for standard Process  MIM Capacitors - shallow trench isolation (STI)  Diodes - deep N-Well (NISO) - 1-2 Poly layers  NPN-Bipolartransistor (within the standard CMOS - gate oxide thickn.[nm]: 2.8/6.8/16.0 Process), PNP with C on ground - cobalt salicidation  RF-Devices like Transistors, Resistors, - up to 6 level of Al (330nm, 800nm) Capacitors, Inductors and Varactors - extra Thick Top Metal (2-6µm Al)  GPIO library 3.3V, 1.8V and 5V intermetal dielectric: HDP  Full Analog PDK for Cadence Virtuoso 6.1.x Core voltage: 1.8V  Full Analog PDK for Tanner including >20 digital Design rules: standard cells - Physical Gate length: 150nm  Digital standard cells library (>400 cells for low - Contact/Via size: 180/240nm power and high performance applications) - Metal pitch: 0.48µm prepared for Cadence, Mentor and Synopsys MOS Transistors: Gate-Density 110 kGates/mm² - 1.8V low leakage NMOS/PMOS  Variety of memory options: SRAM, OTP, NVM - 1.8V high speed NMOS/PMOS - 3.3V NMOS/PMOS  Constantly incrasing IP Portfolio: µController, - 5V NMOS/PMOS ADC, LDO, POR, OTA, Bandgap, Charge Pump, Interface buses, …24 © 2010 LFoundry GmbH. All rights reserved.
  • 25. 0.15µm Foundry Technology25 © 2010 LFoundry GmbH. All rights reserved.
  • 26. IP PortfolioLFoundry and our worldwide partners offer a top class Intellectual Property (IP) Portfolio tosupport the design needs of our customers. With our long time experience we offer on the oneside proven IP to accelerate customers time-to-market, on the other side LFoundry support bycreating customised IP in time with outstanding quality. Mixed-signal IPs ADC, DAC, LDO, PLL, Bandgap, Bias Generator, Charge Pump, Oscillator, OP Amps, OTA, POR, ... Cores Memory IP 8051 until high end SRAM (Mobile Semi) 8b to 32b also as RISC EEPROM (LFoundry) low leak to high performance Flash (SST) well known partners as OTP (NSCore) COrtus, Ensilica, Evatronix, MTP (NSCore) Innopower, ... Interfaces GPIO library, Serial, SPI Interface bus, I2C, Cell Library USB, ... low leak standard library high speed standard library elements such as Buffer, Latches, Flip-Flop, Physical Delay, Tristate, ... Detectors / Security temperature sensor, AES/DES, ... ... whatever you need for your SOC, we have it26 © 2010 LFoundry GmbH. All rights reserved.
  • 27. LFoundry Technology Extensions - CMOS-based MEMS Processing Thick layer processing (AlCu up to 7µm, resist up to10µm) Thick metal Special Polymer processing (IVD, PBO, …) 5µm Stress engineering (for various materials: nitrides, …) Strongly tapered processing / etching profiles Sacrificial layer process (oxide, a-silicon) Tapered processing Backside processing (PVD, PECVD, Implant, …) aSi27 © 2010 LFoundry GmbH. All rights reserved.
  • 28. LFoundry Technology Extensions -Opto CMOS Processing High sensitivity photosensors, integrated in CMOS  light exposure from backside, enabled through LFoundry backside & thin wafer processing CMOS based Optofilter  customized wavelenth filter thru modified structured layers integrated in CMOS  for i.e. multi spectral cameras, ambient light sensors, … Light sensors CMOS Imager for special applications  MBPD (modified buried photo-diode) for l = 450-1100nm  Focus on spezialized applications, i.e. large image sensors with Standard, high volume stitching requirements28 © 2010 LFoundry GmbH. All rights reserved.
  • 29. ConclusionLFoundry is the reliable, fast and flexible customer-specific manufacturer of choice, providing leading-edge specialized technology capacity, advanced analog and mixed- signal process technologies and “Sicherheit” reliability, security and protection for customers, their designs and IP.29 © 2010 LFoundry GmbH. All rights reserved.

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