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    L293d L293d Document Transcript

    • L293, L293D QUADRUPLE HALF-H DRIVERS SLRS008B – SEPTEMBER 1986 – REVISED JUNE 2002 D Featuring Unitrode L293 and L293D N, NE PACKAGE Products Now From Texas Instruments (TOP VIEW) D Wide Supply-Voltage Range: 4.5 V to 36 V 1,2EN 1 16 VCC1 D Separate Input-Logic Supply 1A 2 15 4A D Internal ESD Protection 1Y 3 14 4Y D Thermal Shutdown HEAT SINK AND 4 13 HEAT SINK AND GROUND D High-Noise-Immunity Inputs GROUND 2Y 5 6 12 11 3Y D Functional Replacements for SGS L293 and 2A 7 10 3A SGS L293D VCC2 8 9 3,4EN D Output Current 1 A Per Channel (600 mA for L293D) DWP PACKAGE D Peak Output Current 2 A Per Channel (TOP VIEW) (1.2 A for L293D) 1,2EN VCC1 D 1 28 Output Clamp Diodes for Inductive 1A 2 27 4A Transient Suppression (L293D) 1Y 4Y 3 26 NC 4 25 NCdescription NC 5 24 NC The L293 and L293D are quadruple high-current NC 6 23 NC half-H drivers. The L293 is designed to provide HEAT SINK AND 7 22 HEAT SINK AND bidirectional drive currents of up to 1 A at voltages GROUND 8 21 GROUND from 4.5 V to 36 V. The L293D is designed to 9 20 provide bidirectional drive currents of up to NC 10 19 NC 600-mA at voltages from 4.5 V to 36 V. Both NC 11 18 NC devices are designed to drive inductive loads such 2Y 12 17 3Y as relays, solenoids, dc and bipolar stepping 2A 13 16 3A motors, as well as other high-current/high-voltage VCC2 14 15 3,4EN loads in positive-supply applications. All inputs are TTL compatible. Each output is a complete totem-pole drive circuit, with a Darlington transistor sink and a pseudo-Darlington source. Drivers are enabled in pairs, with drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4 enabled by 3,4EN. When an enable input is high, the associated drivers are enabled and their outputs are active and in phase with their inputs. When the enable input is low, those drivers are disabled and their outputs are off and in the high-impedance state. With the proper data inputs, each pair of drivers forms a full-H (or bridge) reversible drive suitable for solenoid or motor applications. On the L293, external high-speed output clamp diodes should be used for inductive transient suppression. A VCC1 terminal, separate from VCC2, is provided for the logic inputs to minimize device power dissipation. The L293and L293D are characterized for operation from 0°C to 70°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PRODUCTION DATA information is current as of publication date. Copyright  2002, Texas Instruments IncorporatedProducts conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1
    • L293, L293DQUADRUPLE HALF-H DRIVERSSLRS008B – SEPTEMBER 1986 – REVISED JUNE 2002block diagram VCC1 1 0 1 16 2 15 M 1 1 0 0 1 4 3 14 4 13 M 5 12 6 11 2 3 1 1 7 10 0 0 9 1 M 8 0 VC NOTE: Output diodes are internal in L293D. TEXAS INSTRUMENTS AVAILABLE OPTIONS PACKAGE TA PLASTIC DIP (NE) L293NE 0°C to 70°C L293DNE AVAILABLE OPTIONS PACKAGED DEVICES TA SMALL PLASTIC OUTLINE DIP (DWP) (N) L293DWP L293N 0°C to 70°C L293DDWP L293DN The DWP package is available taped and reeled. Add the suffix TR to device type (e.g., L293DWPTR).2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
    • L293, L293D QUADRUPLE HALF-H DRIVERS SLRS008B – SEPTEMBER 1986 – REVISED JUNE 2002 FUNCTION TABLE (each driver) INPUTS† OUTPUT A EN Y H H H L H L X L Z H = high level, L = low level, X = irrelevant, Z = high impedance (off) † In the thermal shutdown mode, the output is in the high-impedance state, regardless of the input levels.logic diagram 1A 2 ÁÁ 3 1Y 1,2EN 1 ÁÁ 2A 7 ÁÁ 6 2Y ÁÁ 3A 10 ÁÁ ÁÁ 11 9 ÁÁ 3Y 3,4EN ÁÁ 4A 15 ÁÁ 14 4Y ÁÁschematics of inputs and outputs (L293) EQUIVALENT OF EACH INPUT TYPICAL OF ALL OUTPUTS VCC1 VCC2 Current Source Input Output GND GND POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3
    • L293, L293DQUADRUPLE HALF-H DRIVERSSLRS008B – SEPTEMBER 1986 – REVISED JUNE 2002schematics of inputs and outputs (L293D) EQUIVALENT OF EACH INPUT TYPICAL OF ALL OUTPUTS VCC2 VCC1 Current Source Input Output GND GNDabsolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VCC1 (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V Output supply voltage, VCC2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Output voltage range, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –3 V to VCC2 + 3 V Peak output current, IO (nonrepetitive, t ≤ 5 ms): L293 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2 A Peak output current, IO (nonrepetitive, t ≤ 100 µs): L293D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 1.2 A Continuous output current, IO: L293 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1 A Continuous output current, IO: L293D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 600 mA Continuous total dissipation at (or below) 25°C free-air temperature (see Notes 2 and 3) . . . . . . . 2075 mW Continuous total dissipation at 80°C case temperature (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . 5000 mW Maximum junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.NOTES: 1. All voltage values are with respect to the network ground terminal. 2. For operation above 25°C free-air temperature, derate linearly at the rate of 16.6 mW/°C. 3. For operation above 25°C case temperature, derate linearly at the rate of 71.4 mW/°C. Due to variations in individual device electrical characteristics and thermal resistance, the built-in thermal overload protection may be activated at power levels slightly above or below the rated dissipation.4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
    • L293, L293D QUADRUPLE HALF-H DRIVERS SLRS008B – SEPTEMBER 1986 – REVISED JUNE 2002recommended operating conditions MIN MAX UNIT VCC1 4.5 7 Supply voltage V VCC2 VCC1 36 VCC1 ≤ 7 V 2.3 VCC1 V VIH High-level High level input voltage VCC1 ≥ 7 V 2.3 7 V VIL Low-level output voltage –0.3† 1.5 V TA Operating free-air temperature 0 70 °C† The algebraic convention, in which the least positive (most negative) designated minimum, is used in this data sheet for logic voltage levels.electrical characteristics, VCC1 = 5 V, VCC2 = 24 V, TA = 25°C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT L293: IOH = –1 A VOH High-level output voltage VCC2–1.8 VCC2–1.4 V L293D: IOH = – 0.6 A L293: IOL = 1 A VOL Low-level output voltage 1.2 1.8 V L293D: IOL = 0.6 A VOKH High-level output clamp voltage L293D: IOK = – 0.6 A VCC2 + 1.3 V VOKL Low-level output clamp voltage L293D: IOK = 0.6 A 1.3 V A 0.2 100 IIH High-level High level input current VI = 7 V µA EN 0.2 10 A –3 –10 IIL Low-level Low level input current VI = 0 µA EN –2 –100 All outputs at high level 13 22 ICC1 Logic supply current IO = 0 All outputs at low level 35 60 mA All outputs at high impedance 8 24 All outputs at high level 14 24 ICC2 Output supply current IO = 0 All outputs at low level 2 6 mA All outputs at high impedance 2 4switching characteristics, VCC1 = 5 V, VCC2 = 24 V, TA = 25°C L293NE, L293DNE PARAMETER TEST CONDITIONS UNIT MIN TYP MAX tPLH Propagation delay time, low-to-high-level output from A input 800 ns tPHL Propagation delay time, high-to-low-level output from A input 400 ns CL = 30 pF pF, See Figure 1 tTLH Transition time, low-to-high-level output 300 ns tTHL Transition time, high-to-low-level output 300 nsswitching characteristics, VCC1 = 5 V, VCC2 = 24 V, TA = 25°C L293DWP, L293N PARAMETER TEST CONDITIONS L293DDWP, L293DN UNIT MIN TYP MAX tPLH Propagation delay time, low-to-high-level output from A input 750 ns tPHL Propagation delay time, high-to-low-level output from A input 200 ns CL = 30 pF pF, See Figure 1 tTLH Transition time, low-to-high-level output 100 ns tTHL Transition time, high-to-low-level output 350 ns POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5
    • L293, L293DQUADRUPLE HALF-H DRIVERSSLRS008B – SEPTEMBER 1986 – REVISED JUNE 2002 PARAMETER MEASUREMENT INFORMATION tf tr 3V 90% 90% Input 5 V 24 V Input 50% 50% 10% 10% 0 VCC1 VCC2 Pulse tw Generator A tPHL tPLH (see Note B) Y Output VOH 90% 90% CL = 30 pF 3V EN 50% 50% (see Note A) Output 10% 10% VOL tTHL tTLH TEST CIRCUIT VOLTAGE WAVEFORMSNOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: tr ≤ 10 ns, tf ≤ 10 ns, tw = 10 µs, PRR = 5 kHz, ZO = 50 Ω. Figure 1. Test Circuit and Voltage Waveforms6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
    • L293, L293D QUADRUPLE HALF-H DRIVERS SLRS008B – SEPTEMBER 1986 – REVISED JUNE 2002 APPLICATION INFORMATION 5V 24 V VCC2 VCC1 16 3 10 kΩ 1,2EN 1 1A 1YControl A 2 3 Motor 2A 2Y 7 6 3,4EN 9 3A 3YControl B 10 11 4A 4Y 15 14 Thermal Shutdown 4, 5, 12, 13 GND Figure 2. Two-Phase Motor Driver (L293) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7
    • L293, L293DQUADRUPLE HALF-H DRIVERSSLRS008B – SEPTEMBER 1986 – REVISED JUNE 2002 APPLICATION INFORMATION 5V 24 V VCC1 VCC2 10 kΩ 16 3 1,2EN 1 1A 1Y Control A 2 3 Motor 2A 2Y 7 6 3,4EN 9 3A 3Y Control B 10 11 4A 4Y 15 14 Thermal Shutdown 4, 5, 12, 13 GND Figure 3. Two-Phase Motor Driver (L293D)8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
    • L293, L293D QUADRUPLE HALF-H DRIVERS SLRS008B – SEPTEMBER 1986 – REVISED JUNE 2002 APPLICATION INFORMATIONVCC2 SES5001 M1 SES5001 M2 3A 4A EN 3A M1 4A M2 10 11 15 14 H H Fast motor stop H Run 16 H L Run L Fast motor stop VCC1 8 Free-running motor Free-running motor L X X stop stop 1/2 L293 9 EN L = low, H = high, X = don’t care 4, 5, 12, 13 GND Figure 4. DC Motor Controls (connections to ground and to supply voltage)VCC2 2 × SES5001 M 2 × SES5001 EN 1A 2A FUNCTION H L H Turn right 2A 1A 7 6 3 2 H H L Turn left 16 H L L Fast motor stop VCC1 8 H H H Fast motor stop 1/2 L293 1 L X X Fast motor stop EN L = low, H = high, X = don’t care 4, 5, 12, 13 GND Figure 5. Bidirectional DC Motor Control POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9
    • L293, L293DQUADRUPLE HALF-H DRIVERSSLRS008B – SEPTEMBER 1986 – REVISED JUNE 2002 APPLICATION INFORMATION IL1/IL2 = 300 mA C1 L293 16 1 VCC1 0.22 µF 2 15 D5 D1 + + D8 D4 3 14 4 13 L1 IL1 5 12 L2 IL2 VCC2 6 11 + + 7 10 D7 D3 8 9 D6 D2 D1–D8 = SES5001 Figure 6. Bipolar Stepping-Motor Controlmounting instructions The Rthj-amp of the L293 can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board or to an external heatsink. Figure 9 shows the maximum package power PTOT and the θJA as a function of the side of two equal square copper areas having a thickness of 35 µm (see Figure 7). In addition, an external heat sink can be used (see Figure 8). During soldering, the pin temperature must not exceed 260°C, and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground.10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
    • L293, L293D QUADRUPLE HALF-H DRIVERS SLRS008B – SEPTEMBER 1986 – REVISED JUNE 2002 APPLICATION INFORMATION Copper Area 35-µm Thickness Printed Circuit BoardFigure 7. Example of Printed Circuit Board Copper Area (used as heat sink) 17.0 mm 11.9 mm 38.0 mm Figure 8. External Heat Sink Mounting Example (θJA = 25°C/W) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11
    • L293, L293DQUADRUPLE HALF-H DRIVERSSLRS008B – SEPTEMBER 1986 – REVISED JUNE 2002 APPLICATION INFORMATION MAXIMUM POWER AND JUNCTION MAXIMUM POWER DISSIPATION vs vs THERMAL RESISTANCE AMBIENT TEMPERATURE 4 80 5 P TOT – Power Dissipation – W θ JA – Thermal Resistance – °C/W P TOT – Power Dissipation – W θJA With Infinite Heat Sink 3 60 4 3 Heat Sink With θJA = 25°C/W 2 40 PTOT (TA = 70°C) 2 Free Air 1 20 1 0 0 0 0 10 20 30 40 50 –50 0 50 100 150 Side – mm TA – Ambient Temperature – °C Figure 9 Figure 1012 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
    • IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. To minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third–party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright  2002, Texas Instruments Incorporated
    • This datasheet has been download from: www.datasheetcatalog.comDatasheets for electronics components.