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Ultrasonic energy harvester
 

Ultrasonic energy harvester

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    Ultrasonic energy harvester Ultrasonic energy harvester Presentation Transcript

    • Guided by, Done by,Muhzina M H LIJINRAJ.T.V
    • CONTENTS INTRODUCTION DESIGN FABRICATION EXPERIMENTAL RESULTS CONCLUSION REFERENCES
    • INTRODUCTION NEED OF ENERGY HARVESTERS EXISTING HARVESTERS DRAWBACKS
    • ULTRASONIC ENERGYHARVESTERTWO METHODS. USING MEMS. USING PIEZOELECTRIC CANTILEVER.
    • ULTRASONIC ENERGYHARVESTER USING MEMS ULTRA SONIC TRANSDUCERS MEMS CHIP STORAGE DEVICES
    • BLOCK DIAGRAM
    • ULTRASONICTRANSDUCER A SQ -40T ULTRASONIC TRANSDUCER WAS USED. IT TRANSMITS ULTRASONIC WAVES. IT HAS A RESONANCE FREQUENCY OF 40 KHZ. DRIVEN BY A 10Vpp AC SIGNAL.
    • MEMS MEMS(Micro Electro Mechanical System). CONSISTS OF MICRO ACTUATORS MICRO SENSORS,MICROELECTRONICS SIZE IS IN µm RANGE.
    • DESIGN A 2 DOF MOTION MECHANISM . VIBRATION ENERGY. SEISMIC MASS MOVES. CHANGES THE CAPACITANCE OF THE X&Y FRAMES. CONITRIBUTE THE CHARGING OF THE LOAD. 3-D VIEW OF MEMS MECHANISM
    • MOTION MECHANISM TOHARVEST VIBRATIONENERGY TO A PLANE
    •  TWO MODES. TWO RESONANCE FREQUENCIES. MECHANICAL COUPLING IN THE COMBS FROM ONE MODE TO ANOTHER IS LESS THAN 2%. VIBRATION IN Z-DIRECTION CAN BE IGNORED. RESONANCE FREQUENCY DEPENDS ON THE STIFFNESS OF THE BEAMS AND MASS,
    • MECHANICALSTRUCTURE DESIGNSHOWING THEMOVEMENT ALONGTHE X-AXIS
    • MECHANICALSTRUCTURE DESIGNSHOWING THEMOVEMENT ALONGTHEY-AXIS
    • DESIGN PARAMETERS FOR 2-DOF ENERGYHARVESTER
    • FABRICATION MEMS FOUNDRY PROCESS SURFACE METALPADS ARE DRIE IS PERFORMED FROM PATTERNED FOR OHMIC CONTACT THE FRONT SIDE OF THE WAFER
    •  A PROTECTIVE POLYMIDE  A DEEP TRENCH UNDERNEATH LAYER IS APPLIED TO THE THE MOVABLE STRUCTURES FRONT SIDE IS CREATED
    •  THE EXPOSED BURIED OXIDE  THE POLYMIDE COAT IS REMOVED USING A WET HF IS REMOVED BY OXYGEN ETCH PLASMA
    • SEM IMAGE OF THE PHOTOGRAPH OF THEFABRICATED ENERGY PACKAGED DEVICEHARVESTER
    • ENERGY HARVESTING CIRCUIT DIAGRAM
    •  ULTRASONIC ENERGY IS CONVERTED INTO ELECTRICAL ENERGY. A RECTIFYING CIRCUIT IS USED. DIODES (1N5711). CAPACITOR CHARGED(1µF).
    • ULTRASONIC TRANSDUCER & PACKAGED MEMS CHIP
    • MAGNITUDE CURVES OF THE OUTPUT VOLTAGE V/S FREQUENCY
    • COMPARISON BETWEEN EXPERIMENTAL RESULTS &STIMULATION RESULTS
    • USING PIEZOELECTRICCANTILEVER
    • MEMS V/S PIEZOELECTRICCANTILEVER
    • ADVANTAGES SMALL SIZE. BETTER SENSITIVITY. COST EFFECTIVE. LESS HARM TO PATIENT.
    • APPLICATIONS A BETTER APPLICATION IS IN POWERING THE IMPLANTABLE BIOSENSORS.
    • CONCLUSION THESE CAN EXTRACT ULTRASONIC ENERGY FROM ALL DIRECTIONS IN THE DEVICE PLANE. INCREASES EFFICIENCY OF THE ENERGY SCAVENGING. A POWER LEVEL OF 21.4nw CAN BE OBTAINED. BETTER SENSITIVITY.
    • REFERENCES Yong Zhu, S. O. Reza Moheimani, Mehmet Rasit Yuce, “A 2-DOF MEMS Ultrasonic Energy Harvester”, IEEE SENSORS JOURNAL, VOL. 11, NO. 1, JANUARY 2011 WWW.WIKIPEDIA .COM
    • THANKS
    • QUERIES???