Quick overview of customized interconnect solutions for high reliability electronic applications - featuring IC Sockets and Adapters, as well as Board-to-Board Connectors, for surface mount and through hole applications in test, development, validation, and production.

1. The Advanced Difference
®
Customized Interconnect Solutions
Rev. 1

2. Company Overview
• Vertically integrated manufacturer of
customized PC board connectors, IC
sockets, and adapters for development,
test, and production applications
• Focus on developing optimum
mechanical and electrical solutions for
challenging, high performance
interconnection applications
• ISO 9001:2008 Certified
• Founded in 1982
• Valued supplier to leading OEMs and
contract manufacturers worldwide

3. Precision Technology
• Robust screw-machined pins &
terminals for superior performance
and durability
• Socket contact features redundant
mating beams
• Substrate materials include injection
molded plastic (LCP), drilled FR-4,
polyimide film, and PC boards
• Extensive offering of termination
styles includes thru-hole, SMT,
solder preforms, press-fit, and right
angle and cable-to-board mount

4. Vertical Integration
• Screw-machine and CNC equipment for long-
term durability
• High speed injection molding, precision
drilling/routing, and polyimide film stamping
• Surface Mount Technology Center - certified
ESD protected
– Extensive convection reflow capability; solder
ball attach
– Pick & place device attach, tape & reel
packaging, and electrical shorts/open test
capabilities

5. Complete Process Control
• Automated optical inspection, laser scan
microscope, and other attribute (i.e. solder
paste thickness) measurement and verification
• Collaborative design with SolidWorks &
AutoCAD, mechanical FEA (Cosmos) &
Moldflow analysis, signal integrity (SI) and
other design & test capabilities

6. Solving Your Design Challenges
• Protect delicate or expensive devices by
plugging them in after board processing
• Plan for field replacement, repair, or
programmability
• Board mounting and stacking
• Test, development, and validation
• Package conversion
• Allow visibility of solder joints on
both sides of the PCB
• Overcome device obsolescence
• Low profile, surface mount, and lead-free
interconnect

7. BGA Socketing Systems
• 0.50mm to 1.27mm pitch solutions
– BGA Socket Adapter System
– Flip-Top™ BGA Socket
– Lead-free to leaded BGA Interposers
– Micro BGA (0.50mm) fan-out to BGA
(1.0mm)
• Patented solder ball technology for superior
processing results and proven reliability
• Lead-free and eutectic Tin/Lead solder ball
options
• Prototype to production volumes
• Thousands of footprints

8. IC Socket & Adapters
• Surface mount and thru-hole designs all
featuring screw-machined terminals with
multi-finger contacts for long-term
reliability
• RoHS Compliant insulators and terminals
• Peel-A-Way® Removable Terminal
Carriers
• Standard and custom designs
– BGA & PGA Sockets and Adapters
– DIP & SIP Sockets and Adapters

9. Board to Board Connectors
• PCB SMT and thru-hole, as well
as cable mount designs
• Standard and customized linear
and non-linear configurations
• Molded, FR-4, and Peel-A-Way®
insulators
• High I/O and high density B2B®
SMT Connectors for board
stacking
• Mezza-pede® Low Profile 1.0mm
Pitch SMT Connectors

10. Customized Connector Solutions
APPLICATION: MILITARY APPLICATION: MILITARY
• Robust custom 80-position B2B® SMT
• Custom FR-4 connector system connects
Connector solution
3 boards together in a defined space
• Drilled and routed FR-4
• Reduced connector count from 6 to 4
while reducing assembly costs • 6mm, keyed and polarized
• Customer needed robust solution; 3- • Customizable by pin count and pitch
finger contact increased the redundancy • Solution for robust, low-profile board to
per position
board or cable to board

11. Typical Applications
• Mezza-pede® Low Profile SMT Connectors APPLICATION: TELECOM
have been used to connect micro PC boards,
mezzanine and daughter cards, and as power
connectors in tunable lasers
• Proven screw-machined, robust pin-in-socket
design on 1.00mm pitch
• Passes 20-Day Mixed Flowing Gas (MFG) test
• Mezza-pede® Low Profile
• Designed with pick-and-place covers to SMT Connectors
protect delicate pin field and facilitate • Flex cable-to-board power
connector for a tunable laser
automated board assembly
• Standard and custom designs available

12. Adapters & Interposers
• Standard and custom IC package
conversion
• Thru-hole to thru-hole, SMT to thru-hole,
and SMT to SMT
– SOIC to DIP; QFP to PGA; micro-BGA to
BGA; PLCC to PGA; etc.
– Lead-free to Tin/Lead BGA Interposers
• Application-specific designs
• Adapters can include multiple devices
and components

13. Customized Solutions
• Our custom interconnect designs
range from one-time “quick fixes” to
solutions that have been designed-in
for decades
– Low profile interface connector for the
gyro in the head of a missile
– LED socket for field replacement
– BGA connector with external interface
for engine control unit test board
– SOIC to DIP Adapter array panel
– Package conversion adapter with
functionality enhancements

14. Your Trusted Design Partner
• Advanced Interconnections specializes in
developing customized socketing and
connector solutions for high reliability
applications
• Dedicated product engineers and sales
support team provide personalized design and
application support AEROSPACE
AUTOMOTIVE
• Vertical integration and 30 years of design COMPUTERS
experience make us a trusted partner of CONSUMER
DATA/STORAGE
industry leading OEMs worldwide INDUSTRIAL
INSTRUMENTATION
MEDICAL
MILITARY
SECURITY
SEMICONDUCTOR
TELECOM

15. “Interconnect solutions with superior reliability
and technologically advanced features,
customized to solve difficult design problems.”
That’s the Advanced Difference.
®
© 2009-2013