Smartphone Hardware Architecture

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Smartphone Hardware Architecture

  1. 1. Mokwon University Yong Heui CHO(조용희) yhcho@mwu.ac.kr Smartphone Hardware Architecture
  2. 2. Definition  Smartphone  Mobile phone + computer + sensors + wireless I/O  Mobile OS: speed vs. battery life 2 ←inbritech.com
  3. 3. Computer of Tomorrow Devoid of CPU and memory 3
  4. 4. Smartphone HW: AP  Application Platform Chip        AP: Application Processor Flash memory Mobile Dynamic RAM PMU: Power Management Unit Audio Codec Bluetooth WiFi 4
  5. 5. Smartphone HW: CP  Connectivity Platform Chip  CPU: Central Processing Unit  DSP: Digital Signal Processing  RF baseband processing  Voice processing  PA: Power Amplifier  Tx-Rx switch  DAC + ADC 5
  6. 6. World Phone Capability  UMTS/HSDPA/HSUPA  850, 900, 1900, 2100 MHz  GSM/EDGE  850, 900, 1800, 1900 MHz  CDMA EV-DO Rev. A  800, 1900 MHz -UMTS: Universal Mobile Telecommunications System -HSDPA: High Speed Downlink Packet Access -GSM: Global System for Mobile communication -EDGE: Enhanced Data rates for GSM Evolution -EV-DO: Evolution-Data Optimized 6
  7. 7. Openmoko Project  Open source mobile phone project UART: Universal Asynchronous Rx/Tx SDIO: Secure Digital I/O GPIO: General Purpose I/O I2C: Inter-Integrated Circuit 7
  8. 8. Apple iPhone 5S  Apple released iPhone 5S in Sept. 2013.  A7 dual-core processor: the first 64-bit processor for a smartphone  M7 motion coprocessor  Touch ID: fingerprint recognition system 8 ←ifixit.com
  9. 9. Breakdown of iPhone 5S Without battery 326 ppi Retina display ←ifixit.com 9 Mother-Board
  10. 10. Li-ion Battery  3.8 [V]: used for bias of active devices (amplifiers, mixers, …)  This voltage should be small to consume smaller power (P = I x V)  5.92 [Whr]: unit for energy (W x hour)  1,560 [mAhr]: unit for current duration 10
  11. 11. Apple A7 Processor  SoC (System on Chip): 64 bits, 1.3 GHz, 1GB(?)  Instruction set (architecture): ARMv8-A (many registers)  Core: Cortex-A53/A57(?)  Designed by Apple (licensed from ARM) and manufactured by Samsung NEON: Multimedia Instruction SIMD: Single Instruction Multiple Data 11 Data
  12. 12. Home Button & Touch ID  Fingerprint scanner  CMOS chip and bunch of capacitors  Detection by very small capacitors  Developed by AuthenTec 12
  13. 13. WiFi Module  Murata 339S0205 Wi-Fi module based on the Broadcom BCM4334  Dual-band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi-Fi connectivity  Bluetooth 4.0 + HS (High Speed)  Integrated FM radio receiver  5G WiFi(?): 2x2 MIMO WiFi Module 13
  14. 14. Mother-Board M7 Motion Coprocessor A7 Processor Qualcomm MDM9615M Baseband Modem Qualcomm WTR1605L LTE/HSPA+/CDMA2K/TDSCDMA/EDGE/GPS Transceiver 14
  15. 15. Samsung Galaxy S4  Samsung released Galaxy S4 in April 2013.  Samsung Exynos 5 Octa: big.LITTLE 15 ←ifixit.com
  16. 16. Li-ion Battery  3.8 [V]: used for bias of active devices (amplifiers, mixers, …)  This voltage should be small to consume smaller power (P = I x V)  9.88 [Whr]: unit for energy (W x hour)  2,600 [mAh]: unit for current duration 16
  17. 17. Exynos 5 Octa  1.6 GHz quad-core ARM Cortex-A15 and 1.2 GHz quad-core ARM CortexA7 (ARM big.LITTLE), 2GB RAM  Designed by Samsung (licensed from ARM) and manufactured by Samsung ←electronicsweekly.com 17 ←howchip.com
  18. 18. Sensors 18 ←androidheadlines.com
  19. 19. Antennas ←raymaps.com 19
  20. 20. Nexus5 Block Diagram 20

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