Your SlideShare is downloading. ×

Thanks for flagging this SlideShare!

Oops! An error has occurred.

×
Saving this for later? Get the SlideShare app to save on your phone or tablet. Read anywhere, anytime – even offline.
Text the download link to your phone
Standard text messaging rates apply

Market & Technology Trends in Materials and Equipement for Printed and Flexible Electronics 2014 Report by Yole Developpement

1,646
views

Published on

Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple applications are driving growth! …

Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple applications are driving growth!


TECHNICAL CHALLENGES ARE CLOSE TO BEING OVERCOME TO REACH US$1B MARKET BY 2020
Today flexible & printed electronics create a lot of hope. And a supply chain is being created to support an industrial infrastructure. In our report, we have identified and tracked the five main functionalities of flexible & printed electronics: displaying, sensing, lighting, energy generating and substrates. The different degrees of freedom in flexibility that can be obtained can be divided into:

- Conformable substrate: the flexible substrate will be shaped in a definitive way after processing
- “Bendable” substrate: they can be rolled and bent many times (even if we consider it will not be a key feature coming from customer needs)
- “Unused” flexibility: in the end, the flexibility is not an added value to the customer


We believe some applications will be more likely than other to be successful – for example, bendable applications will undergo tough stress during use and technological challenges will be hard to overcome. Our report shows the distinction between the functions (displaying, lighting, energy conversion, sensing & substrates) and the seek flexibility “degree of freedom”. We do not make the distinction in our report between organic and inorganic substrates as semiconductors can also be used as flexible substrates.
However, we believe over the next several years, the number of applications using printing processes for flexible electronics will grow (Figure on page 2).
We estimate the printed & flexible electronics market will grow from ~ $176M in 2013 to ~$950M in 2020 with a 27% CAGR in market value. Printed OLED displays for large size (TVs) are likely to become the largest market. For OLED lighting, we believe it will grow but remain a niche market for automotive and/ or office lighting. For PV, the market demand by 2020 will remain very low compared to the demand for rigid PV, largely below 1% of the global market demand by 2020. Sensor, smart system & polytronic applications will include sensors, touchless / touch screens, RF ID applications.


A WIDE, EXCITING RANGE OF NEW APPLICATIONS
Printed & flexible electronics is a new exiting technology with large potential market expectations. Indeed, as semiconductors move to the very small with 22nm critical dimension, printed electronics moves to the other end of the spectrum with its own material, equipment, process challenges and supply chain. Printed electronics will not kill semiconductor electronics as it will not be a replacement for CMOS silicon.

More info at http://www.i-micronews.com/reports/Flexible-Based-Printed-Electronics-Technologies/6/367/

Published in: Technology, Business

0 Comments
1 Like
Statistics
Notes
  • Be the first to comment

No Downloads
Views
Total Views
1,646
On Slideshare
0
From Embeds
0
Number of Embeds
8
Actions
Shares
0
Downloads
84
Comments
0
Likes
1
Embeds 0
No embeds

Report content
Flagged as inappropriate Flag as inappropriate
Flag as inappropriate

Select your reason for flagging this presentation as inappropriate.

Cancel
No notes for slide

Transcript

  • 1. Market & Technology Trends in Materials & Equipement for Printed & Flexible Electronics © 2014 Copyrights © Yole Développement SA & Daydream. All rights reserved.
  • 2. Key Objectives of the Report • This report, done in collaboration by Yole Développement and DayDream companies, aims at giving insights on: – The market and applications for Printed & Flexible electronics – The timeline by applications (displays, lighting, solar cells, sensors, system-in-foil) – The different production processes and technical challenges – Equipment forecast – Technical requirements & challenges for materials – Cost structure material – Material forecast – Main players status © 2014• 2 Copyrights © Yole Développement SA & Daydream . All rights reserved.
  • 3. Who Should Be Interested in This Report? • Chemical & tools companies – • Devices makers – Identify what the technical hurdles Identify and evaluate printed for printed electronics are – electronics markets with market size Analyze the threads and & growth – opportunities – opportunities Quantify the market opportunities for – tools and chemistry – • – Understand the potentialities of the Monitor and benchmark your competitor’s advancements Benchmark your competitors Systems makers Analyze the threads and • Financial & Strategic investors – Understand the main market printed electronics market – dynamics and main technological Understand the technical challenges trends – © 2014• 3 Copyrights © Yole Développement SA & Daydream . All rights reserved. Get the list of the key players
  • 4. Introduction • Flexible Electronics using printing processes is a new field of technologies with great expectations in terms of market and business. However, it also means a whole new supply chain and industrial infrastructure needs to be set up. • Our report describes for Flexible Electronics the applications, market trends and technologies used today, as well as printing processes that could be used in the future. • Today flexible applications exist, but not using printing processes. However, we believe this will change in the future and that printing processes for flexible electronics will be a growing market sector. • The main motivations to go flexible are to achieve better shock resistance (e.g. for a display), and to allow new applications. Printing processes will bring lower manufacturing costs and possibly aid growth in some market sectors. © 2014• 4 Copyrights © Yole Développement SA & Daydream . All rights reserved.
  • 5. Application Landscape • Market drivers for flexible and printed electronics are different, even though manufacturing processes and end applications share similarities. • Main market drivers for flexible electronics are: – The possibility to add new functionalities: • • Conformability for OPV (energy harvesting) • – Conformability for OLED lighting (for the automotive industry), Robustness for small OLED displays (for smart phones & tablets) The possibility to create new applications: • – Wearable electronics. Flexible electronics is NOT meant to be low-cost, and usually uses expensive processes (MOCVD, evaporation) • The main market driver for printed electronics is: – Cost reduction due to high volume (roll-to-roll) manufacturing or by using fewer expensive manufacturing processes (MOCVD, evaporation): • Potentially lower cost OLED TVs could be built if solution-based manufacturing is mastered and potentially low cost OPV could appear if technical challenges are leveraged © 2014• 5 Copyrights © Yole Développement SA & Daydream . All rights reserved.
  • 6. Time to market Legend Flexible Roadmaps below show the time-to-market for the different applications with the split Flex vs. Print functionalities. Printed E-Paper DISPLAYS Small OLED Diplays Large OLED Diplays ? ? LIGTHING OLED lighting for automotive & luxury lighting OLED lighting for general lighting 2013 © 2014• 6 2014 Copyrights © Yole Développement SA & Daydream . All rights reserved. 2016 2018 2020+
  • 7. Time to Market Legend Flexible Printed PV Inorganic Photovoltaic OPV SUBSTRATES SENSING Sensors Systems on Foils / Polytronics 2013 © 2014• 7 2014 2016 Copyrights © Yole Développement SA & Daydream . All rights reserved. 2018 2020+
  • 8. Example of process roadmap Printed OLED Lighting: What Is to Be Printed? Current Material / technology Structure Glass Encapsulation Current status Short / Midterm evolution Long-term evolution Printed organic barrier Not Printed Cathode Different materials (metal etc.) Electron Injection Layer (EIL) Evaporation Printed Electron Transport Layer (ETL) Emissive Layer (EML) Organic materials Hole Transport Layer (HTL) Evaporation Printed Both printed / not printed Printed Hole Injection Layer (HIL) ITO / Organic materials Anode Glass Substrate / Encapsulation © 2014• 8 Copyrights © Yole Développement SA & Daydream . All rights reserved. Not Printed Printed organic barrier
  • 9. Example of process roadmap Not flexible OLED Lighting: What Is to Be Flexible? Current Material / technology Structure Current status Short / Midterm evolution Long-term evolution Glass Encapsulation Rigid glass / rigid metal foil Flexible glass / flexible metal foil Flexible organic barrier Cathode Different materials (metal etc.) Electron Injection Layer (EIL) Flexible evaporated material Flexible and Solution based Electron Transport Layer (ETL) Emissive Layer (EML) Organic materials Hole Transport Layer (HTL) Flexible evaporated material Flexible and Solution based material Hole Injection Layer (HIL) ITO / Organic materials Anode Rigid ITO / Flexible Organic material Glass Substrate / Encapsulation Rigid glass Flexible and Printed organic material / graphene / Metal grid / carbon nanotube / silver nanowire etc… Flexible glass Flexible organic barrier Encapsulation is the limiting factor for flexible OLED lighting © 2014• 9 Copyrights © Yole Développement SA & Daydream . All rights reserved.
  • 10. Equipment forecast 2013-2020 in value (Million USD) © 2014• 10 Copyrights © Yole Développement SA & Daydream . All rights reserved.
  • 11. Material value for printed and/or flexible electronics © 2014• 11 Copyrights © Yole Développement SA & Daydream . All rights reserved.
  • 12. About the Authors of This Report Dr. Eric Mounier, Senior Analyst, YOLE DEVELOPPEMENT Since 1998, he is a cofounder of Yole Développement. Eric is in charge of market analysis for MEMS, equipment & material, photonics and Printed Electronics. He is Chief Editor of MEMSTrends & Micronews magazines. Before joining Yole Développement, Eric worked as a market analyst at CEA Leti. He has a PhD in microelectronics from the INPG in Grenoble. Contact: mounier@yole.fr Antoine Bonnabel, Market & Technology Analyst, YOLE DEVELOPPEMENT Antoine works as market & technology analyst for MEMS devices and technologies at Yole Développement. He holds a M.Sc. in microelectronics and microsystems from Grenoble Institute of Technologies and a M.Sc. in marketing and business management from Grenoble Graduate School of Business. Contact: bonnabel@yole.fr Wenquan Zhang, Business Analyst, DAYDREAM Wenquan works as business analyst for Daydream in Shanghai. He holds two Masters of Science, one in Engineering from the Tongji University (China) and one in Sustainable Development from the Uppsala University (Sweden). Before joining Daydream, Wenquan has worked at the Stockholm Environment Institute and the Asian Development Bank. Contact: wenquan.zhang@daydream.eu Dr. Fabrice Lacombe, Associate Director, DAYDREAM Fabrice joined Daydream in 2005 and is Associate Director in charge of the German subsidiary since 2010. Fabrice has performed and managed over 40 projects in chemistry, materials and life science and has a PhD in Chemistry from the Dortmund University (Germany). Contact: fabrice.lacombe@daydream.eu © 2014• 12 Copyrights © Yole Développement SA & Daydream . All rights reserved.
  • 13. Our latest market reports… MEMS Front End Manufacturing Emerging Non Volatile Memories MEMS Packaging Market & Technology Trends Deep RIE 3D Glass & Silicon interposers - 2012 Report N o k i a 6 & 6 mm © 2010 6 & 6 mm Copyrights © Yole Développement SA. All rights reserved. ~100 sq mm ~25 sq mm ~125 sq mm ~100 sq mm ~25 sq mm 1999 - today 2006 1995 1996-2002 1999 - today 2006 SMT SOIC & Die Down Stacked Die QFN Sidebraze DIP Plastic PDIP SMT SOIC & Die Down Stacked Die QFN © 2014• 13 Thin Wafer Handling Flexible & Printed Electronics Copyrights © Yole Développement SA & Daydream . All rights reserved. Ferro-Electric Thin Films Permanent Wafer Bonding Flip-chip 2013 Report
  • 14. Yole Activities MEDIA REPORTS CONSULTING News portal/Technology magazines/ Webcasts/Communication services Market & technology/Patent Investigation/Reverse costing Market research/Technology & Strategy/Patent Investigation/ Reverse costing www.yole.fr YOLE FINANCE M&A/ Due Diligence/ Fundraising/ Technology brokerage www.yolefinance.fr SISTER COMPANY Reverse engineering & costing/ Cost simulation tools © 2014• 14 Copyrights © Yole Développement SA & Daydream . All rights reserved.
  • 15. For More Information… Please take a look at our websites: www.yole.fr Yole Développement corporate website www.i-micronews.com News Portal - free online registration to our publications www.systemplus.fr Sister company; expert in teardown & reverse costing analysis www.yolefinance.com Separate Yole business unit dedicated to financial services Follow us on © 2014• 15 Copyrights © Yole Développement SA & Daydream . All rights reserved.
  • 16. Our Offices & Contact Information Europe Office • Yves Devigne, Europe Business Development Manager, Cell: 33 6 75 80 08 25 - Email: devigne@yole.fr • David Jourdan, Headquarter Sales Coordination & Customer Service, Tel: 33 472 83 01 90, Email: jourdan@yole.fr USA Office • Michael McLaughlin, Business Development Manager, Phone: (650) 931 2552 - Cell: (408) 839 7178 - Email: mclaughlin@yole.fr • Jeff Edwards, Sales Associate, Yole Inc., Cell: (972) 333 0986- Email: edwards@yole.fr Japan Office • For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K. Phone: (81) 362 693 457 - Cell: (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: katano@yole.fr • For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K. Email: onozawa@yole.fr Korea Office • Hailey Yang, Business Development Manager Phone : (82) 2 2010 883 - Cell: (82) 10 4097 5810 - Fax: (82) 2 2010 8899 - Email: yang@yole.fr © 2014• 16 Copyrights © Yole Développement SA & Daydream . All rights reserved.