Packaging cost reduction is driving new technology and design adoption, and fuelling a booming equipment and material market
EMERGENCE OF NEW DESIGN AND TECHNOLOGIES
Depending on the device type, packaging can represent 40% to 60% of LED total cost. As such, packaging represents the single-largest opportunity for cost reduction, which is required in order for the industry to access the “Holy Grail” that is General Lighting. However, if you’re expecting this cost reduction to come from standardization, you can abandon all hope. The creativity of LED engineers and specificities of each application have led to an infinite number of package type and formats: Single or multiple chips, low and middle-power Plastic Leaded Chip Carrier (PLCC), ceramic-based high-power LED, small and large arrays, Chip On Board (COB), etc. This profusion of styles is inhibiting LED manufacturing cost reduction by multiplying the Stock Keeping Unit (SKU), thus preventing standardization of the manufacturing process and the associated economies of scale.
In this context, LED manufacturers are reacting by developing new manufacturing philosophies/ concepts, such as:
- “Design for manufacturing”, which consists of trying to simplify and standardize elements whenever possible, and push differentiation as far downstream as possible in the manufacturing process.
- “Design for cost”, which consists of favoring cost of ownership or cost per lumen over end performance.
This report represents a comprehensive overview of all technological aspects of LED packaging. It describes each step of the packaging process flow, discusses the associated technological breakthroughs, provides a summary of key players, and much more!
OBJECTIVES OF THE REPORT
- To better understand process flow and technological trends in LED packaging
- To better understand the importance of cost reduction in LED packaging
- To better understand who is doing what
- To provide market metrics both at LED and material/equipment levels
3M, A-Bright, ACC Silicon, Accretech, ADT Dicing, Advanced Photoelectronic, ALSI, AM Technology, Amceram, American bright, American Opto Plus, AOT, Apeax, APT, Asahi Glass, ASM Pacific, Assymtec, Autec, Avago, Axxon, Bayer, Bergquist, Brightled, Brightview, BYD, Cascade Microtech, Century Epitech, Ceramtec, CETC, Chroma, Citizen, CMO, Cofan PCB, Cree, CS Bright, Curamik, Daitron, Datacon, Delphi Laser, Denka, Dian, Disco, Dominant Semiconductor, Doosan, Dow Chemical, Dow Corning, Dowa, Dupont, Dynatex, Edison Opto, Photon Star, Epistar, Epitex, Epoxy Technology, epworks, ESEC, ESI, Essemtec, Everlight, EV-Group, Evident Technologies, Excellence, Fangda, Fittech, Formosa Epitaxy, Friatec, GE, Gia Tzoong, Golden Valley, Han’s Laser, Harvatek, Hauman, Heesung, Heptagon, Hilight, Holy Stone, Huixin, huiyuan, Hybond, Hysol (Henkel)...
More information on http://www.i-micronews.com/reports/LED-Packaging/14/342/
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