Yole Infineon automotive Power Module Report

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Yole Infineon automotive Power Module Report

  1. 1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Electronic Costing & Technology Experts www.systemplus.fr 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr September 2013 Version 1 – Written by Sylvain HALLEREAU
  2. 2. Infineon – F600R07A2E3 HybridPACK Return to TOC © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 2 Glossary 1. Overview / Introduction 4 – Executive Summary – Reverse Costing Methodology 2. Company Profile 8 3. Physical Analysis 14 – Synthesis of the Physical Analysis – Package analysis – Characteristics and marking – Housing – Base Plate Cross-Section – DBC Cross-Section – IGBT Analysis – Dimension – Guard Ring – Trench Gate Cross-Section – Revelation – Diode Analysis – Dimension – Guard Ring – Revelation 4. Manufacturing Process Flow 54 – Overview – IGBT and Diode Process Flow – Description of the Wafer Fabrication Units – IGBT Process Flow – Diode Process Flow – Package Process Flow 5. Cost Analysis 66 – Synthesis of the Cost Analysis – Main Steps of Economic Analysis – Yields Explanation – Cost Analysis IGBT – Wafer Cost Hypothesis – IGBT Wafer Cost – Breakdown per process step – IGBT Equipment Cost per Family – IGBT Material Cost per Family – IGBT Probe Cost – IGBT Die cost – Cost Analysis Diode – Cost Analysis FS600R07A2E3 – Assessing BOM – DBC Cost – FS600R07A2E3 Module Cost – Yield Synthesis 6. Estimated Manufacturer Price Analysis 101 – Manufacturers ratios – Estimated manufacturer Price Contact
  3. 3. Infineon – F600R07A2E3 HybridPACK Return to TOC © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 3 The reverse costing analysis is conducted in 3 phases: Teardown analysis • Module is analyzed and measured. • The dies are extracted in order to get overall data: dimensions, pad number, die marking. • Set up of the manufacturing process. Costing analysis • Setup of the manufacturing environment. •Cost simulation of the process steps with different year scenarios. Selling price analysis • Supply chain analysis. • Analysis of the selling price.
  4. 4. Infineon – F600R07A2E3 HybridPACK Return to TOC © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 4 The FS600R07A2E3 power module is a 3-phase Six-Pack configuration of 650V 600A. Pin-Fin baseplate for direct liquid cooling which significantly improves the thermal cycles capability and extends the lifetime of the power module. The Pin-Fin baseplate with its excellent cooling properties enables a very high power density of the HybridPACK™ 2 package. (Infineon Datasheet)
  5. 5. Infineon – F600R07A2E3 HybridPACK Return to TOC © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 5 Aluminum layer Thickness: xxµm Oxide layer 1 Thickness: xxµm Oxide layer 2 Thickness: xxµm Polysilicon layer Thickness: XXµm Guard Ring : Cross-Section SEM view Guard Ring : Cross-Section SEM view Aluminum layer Thickness: xxµm Polyimide layer Thickness: xxµm Silicon
  6. 6. Infineon – F600R07A2E3 HybridPACK Return to TOC © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 6 • The final IGBT die cost is between $xx and $xx according to yield variations. • The test and yield losses costs represent xx% of the total manufacturing cost. – The die cost includes the rejects at probe test and dicing. – The yield losses represent the rejected finished dies cost.
  7. 7. Return to TOC © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 7 Power-One TRIO-27.6-TL • The Reverse costing analysis represents the best cost/price evaluation given the publically available data, completed with industry expert estimates. • These results are open for discussion. We can re-evaluate this circuit with your information. Please contact us:

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