• Like

Inertial MEMS Manufacturing Trends 2014 Report by Yole Developpement

  • 1,747 views
Uploaded on

The shift from stand-alone devices to integrated inertial measurement units and combos will come from optimization of current technologies and the introduction of disruptive approaches. …

The shift from stand-alone devices to integrated inertial measurement units and combos will come from optimization of current technologies and the introduction of disruptive approaches.

6 AND 9-AXIS DOF SENSORS ARE CREATING A NEW PARADIGM IN THE COMBOS BUSINESS
Current technological developments are motivated by several market drivers. For example, integrators for consumer products apply strong price pressure on component manufacturers, thus motivating die size reduction in order to lower manufacturing costs and change the manufacturing platform. Other industry requirements include low-power consumption for mobile applications, better performance and higher integration of functionalities.

These required improvements have been the same for some time now. The difference mainly lies in the way that technology adapts in order to meet these increasingly stringent specifications. Over the past several years, the tendency was to increase the number of axes for stand-alone components while decreasing size. Now, the industry favors complete integration of 9+ axis sensors and platform standardization.

Indeed, in term of detection principle, and in terms of physical concepts in general, we haven’t seen many disruptive approaches reach the market, aside from Qualtré BAW-based inertial sensors. Nevertheless, strong efforts have been made to develop standardized platforms - for example, Teledyne DALSA now offers a generic platform for accelerometers and gyroscopes, as does STMicroelectronics via its THELMA process. Moreover, a very innovative approach in terms of standardization can be seen in CEA-LETI’s M&NEMS platform, in which the company intends to use silicon nanogauges as detection principle for their accelerometers, gyroscopes and magnetometers. The concept lies in using nanoscale gauges for detection, thus increasing sensitivity and reducing size, while keeping a microscale mass for better detection reliability. M&NEMS technology allows for the integration of 9-axis sensors with small form factor. This process is expected to enter production through Tronics Microsystems within the next few years.

Innovation also comes from back-end processing. Packaging issues had to be leveraged in order to attain the high integration required by advanced inertial combos. Key packaging developments and innovative front-end approaches are analyzed in this report.

FOR THE FIRST TIME EVER, OUR ANALYSIS IS ILLUSTRATED BY MORE THAN 40 REVERSE ENGINEERING STUDIES OF DIVERSE COMMERCIAL COMPONENTS!
46+ inertial MEMS components have been reverse engineered to provide insights and data regarding accelerometers, gyros and combos. In our report, a reverse costing simulation of the MEMS, ASIC and packaging parts of these devices has also been made. These tasks were performed by System Plus Consulting, Yole Développement’s sister company. The report compares performance, cost, size (MEMS, ASIC and package)...
More information on that report at

More in: Technology
  • Full Name Full Name Comment goes here.
    Are you sure you want to
    Your message goes here
    Be the first to comment
    Be the first to like this
No Downloads

Views

Total Views
1,747
On Slideshare
0
From Embeds
0
Number of Embeds
5

Actions

Shares
Downloads
105
Comments
0
Likes
0

Embeds 0

No embeds

Report content

Flagged as inappropriate Flag as inappropriate
Flag as inappropriate

Select your reason for flagging this presentation as inappropriate.

Cancel
    No notes for slide

Transcript

  • 1. © 2014 Inertial MEMS Manufacturing Trends 2014 The shift from standalone devices to integrated inertial measurement units will come through both optimization of current technologies and introduction of disruptive approaches SAMPLE REPORT
  • 2. © 2014• 2 Introduction • The inertial sensor market has been very active in the past few years and innovation is still ongoing. Those sensors today represent the largest MEMS market – accounting for more than $3.5B in 2012 – and this should not change in the near future. • Several market drivers motivate current technological developments. – For example integrators for consumer products apply a strong price pressure on component manufacturers thus motivating die size reduction in order to lower manufacturing costs. – Other industry requirements include low power consumption for mobile applications, better performances and higher integration of functionalities. • Those required improvements have not changed for quite some time now. The difference mainly lies in the way technology adapts in order to meet these more and more stringent specifications. In the past several years, the tendency was at increasing the number of axis for standalone components while decreasing size; now the industry looks at complete integration of 9+ axis sensors and standardization of platforms. • In order to have a comprehensive understanding of the most recent commercial solutions and technical trends, more than 20 inertial MEMS components have been reverse engineered. • A reverse costing simulation of the MEMS, ASIC and packaging parts of those devices has also been made. Those tasks were performed by SYSTEMPlus Consulting which is a sister company from Yole Développement. A comparison of the results has been made for performances, costs, size (MEMS, ASIC and package), ASIC lithography node, and manufacturing approach. • This factual analysis underlines well the previously mentioned trends and permits a concrete visualization of the current status of different companies in term of integration
  • 3. © 2014• 3 What’s new since 2011 for inertial MEMS • Over the past 3 years, we saw interesting technical evolutions for inertial sensors: – The coming of 9 DOF – The different approaches of players (STM, Bosch and Invensense) for 6 and 9 DOF: • For accelero/gyro combos, Bosch and STM use two-dies approach while Invensense uses monolithic integration • For 9 axis IMUs, both STM and Invensense use integrated accelerometer and gyro on the same die – New wafer bonding approaches for higher integration, e.g.: • AlGe for Invensense • Gold-Gold bonding for STM – Players are coming with really innovating approach: e.g. mcube. • Significant size reduction can be achieved with this new disruptive technology. Mcube has reduced packaging cost because of no need of bond pads and eutectic bonding for reduced bonding area. – … and more in our report!
  • 4. © 2014• 4 • Inertial sensors is a $4B market in 2013! – Growing to $5.4B soon, driven by the growth of the mobile market • Volumes are booming: 9B units predicted in 2018! – As combo solutions are adopted in consumer and automotive, the added value of each device is increasing Inertial MEMS Market Forecast 2 011 2 012 2 013 2 014 2 015 2 016 2 017 2 018 Total $M 3 297 3 565 3 972 4 384 4 743 5 042 5 288 5 420 Total M units 2 553 3 544 4 607 5 709 6 668 7 585 8 398 8 946 0 1 000 2 000 3 000 4 000 5 000 6 000 7 000 8 000 9 000 10 000 0 1000 2000 3000 4000 5000 6000 Market(MUnits) Market($M) Global MEMS Inertial Sensor Market - 2011 - 2018 market Yole développement © Oct. 2013
  • 5. © 2014• 5 Technical solutions adopted in the inertial industry Divergence of approaches by the main players Techno solution Combo sensors become mainstream Optimization of front-end manufacturing Very specialized ASICs New business models: Bare die, software… Standardization initiatives Market drivers Proliferation of motion sensing among a wide range of applications  e.g. InvenSense (new applications emerge with compact 9-axis solutions such as wearable electronics: Google Glass…)  e.g. AKM, Melexis (for 9- axis solutions: InvenSense partners with AKM and Melexis for magnetometer die) Component size still decreasing  e.g. ST (3x3.5mm² 6- axis IMU integrated in Samsung Galaxy S4)  e.g. ST (gold eutectic bonding instead of glass frit for smaller sealing frame)  e.g. ICSense (very small capacitance need to be detected. ST partners with ICSense) Price dropping quarter after quarter  e.g. Murata (ESC combo now cheaper than discrete accel + gyro)  e.g. ST (smaller sensing area to have more sensors per wafer)  e.g. Kionix / Aichi MI (new business models as only few players can sustain price competition)  e.g. Qualcomm and Intel (working on sensor parameter standardization for datasheets) Low power consumption  e.g. Kionix (6-axis e- compass + software to simulate the gyro function with low power)  e.g. Bosch Sensortec (intelligent power management with the IMUs) Better inertial performance  Dalsa (single crystal silicon, use of TSV in MIDIS platform…)  e.g. Epson (calibrations for high-end applications) Sensor fusion adopted by the market  e.g. Bosch Sensortec (Application Specific Sensor Nodes include sensors and sensor fusion in a single package)  e.g. InvenSense (MPU line of product integrates smart functions at the ASIC level)  e.g. Movea (delivers software solution for indoor navigation…)  e.g. Khronos (« Stream Input » sensor fusion API expected to be offered for augmented reality)
  • 6. © 2014• 6 Combo sensors become mainstream Combo sensor roadmap for mobile devices Level of integration 2011 2012 2013 2014 2015 2016 2017 2018 + RF + sensor fusion +…
  • 7. © 2014• 7 Accelerometer MEMS size evolution 2008 2009 2010 2011 MEMSSize(mm²) 4 2 3 $0.05-0.075 $0.075-0.1 >$0.1 ST LIS331DLH ST LIS3DH BOSCH BMA180 BOSCH BMA250 / BMC050 Kionix KXTE9 5 ADI ADXL346 VTI CMA3000 n.a. All are 3-axis accelerometers US$ values are Production Cost 2007 ST LIS3L02AE12 2012 2013 ADI ADXL362 ST LIS302DL MCube BI3L BOSCH SMI540 ST LSM330 ST LSM303D AUTO CONSUMER
  • 8. © 2014• 8 Combo package size 2010 2011 ComboSize(mm²) 10 15 150 50 SensorDynamics SD746 InvenSense MPU-6000 VTI SCC1300 2012 Bosch SMI540 InvenSense MPU-6500 Bosch Sensortec BMC050 ST LSM303D InvenSense MPU-9150 ST LSM333D ST LSM330 $0.5 $1 $3 US$ Production Cost Auto / Industrial IMU 6-axis consumer IMU 6-axis e- compass 9-axis
  • 9. © 2014• 9 • Information in this report can be completed with the companion report “ Inertial MEMS Manufacturing Trends – ANALYSIS”.
  • 10. © 2014• 10 InvenSense MPU-9150 9-Axis IMU (2012) Overview • Specificities of this component: – Small package: 4x4mm² – MEMS part is single chip: single ASIC & MEMS monolithic structure bonded to the ASIC – Single die for magnetometer. Rather large: 3.76mm² – Accelerometer: separate structures for the 3 axis. Gyro: single structure for the 3 axis (smaller than accel part) – Advanced ASIC technology node (MEMS): 0.18um – Rather old ASIC technology node (Magnetometer): 0.35um
  • 11. © 2014• 11 MEMS Cross-Section • The mechanical layer of the MEMS accelerometer is constituted of a silicon layer fusion bonded on top of the metal layers of the CMOS IC. The silicon layer is patterned by DRIE to form the mechanical structure.  MEMS silicon thickness: 30µm • The electrical connection between the MEMS silicon layer and the IC metal layers is realized with tungsten. Monolithic CMOS-MEMS Cross-Section – SEM View mCube single-chip 3D silicon MEMS cross-section (source: mCube) IC substrate (Silicon) Cap MEMS Sensor (Silicon) W via IC Metal Layers Cavity
  • 12. © 2014• 12 Available MEMS Reports MEMS Cosim+ MEMS Manufacturing Cost Simulation Tool Ferro-Electric Thin Films MEMS Microphone Thin Wafer Handling Technology Trends for Inertials MEMS RF Filters, PAs, Antenna Switches & Tunability for Cellular Handsets Trends in MEMS Manufacturing & Packaging Ferro-Electric Thin Films Motion Sensors for Consumer & Mobile applications Uncooled Infrared Imaging Techology & Market Trends IMU & Gyro for Defense, Aerospace & Industrial Status of the CMOS Image Sensors New!New! Sensor fusion of acceleros, gyros & magnetometers Infrared Detectors Technology & Market Trends New! New! MEMS Front-End Manufacturing Trends MEMS for Cell Phones and Tablets MEMS Pressure Sensor Status of the MEMS Industry New! New! Emerging MEMS New!
  • 13. © 2014• 13 Yole activities in MEMS www.yolefinance.com YOLE FINANCE M&A/ Due Diligence/ Fundraising/ Technology brokerage PARTNERS CONSULTING Market research/Technology & Strategy/Patent Investigation/ Reverse costing www.yole.fr MEDIA News portal/Technology magazines/ Webcasts/Communication services REPORTS Market & technology/Patent Investigation/Reverse costing Status of the MEMS Industry
  • 14. © 2014• 14 Our Offices & Contact Information USA Office • Michael McLaughlin, Business Development Manager, Phone: (650) 931 2552 - Cell: (408) 839 7178 - Email: mclaughlin@yole.fr • Jeff Edwards, Sales Associate, Yole Inc., Cell: (972) 333 0986- Email: edwards@yole.fr Japan Office • For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K. Phone: (81) 362 693 457 - Cell : (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: katano@yole.fr • For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K. Email: onozawa@yole,fr European Office • Yves Devigne, Europe Business Development Manager, Cell : +33 6 75 80 08 25 - Email : devigne@yole.fr • Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service, Tel: +33 472 83 01 90, Email: jourdan@yole.fr Korea Office • Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 - Cell: (82) 10 4097 5810 - Fax: (82) 2 2010 8899 – Email: yang@yole.fr
  • 15. © 2014• 15 For More Information… Take a look at our websites www.yole.fr Yole Développement corporate website www.i-micronews.com News Portal - online free registration to our publications www.systemplus.fr Sister company expert in teardown & reverse costing analysis www.yolefinance.com Separate business unit of Yole dedicated to financial services Follow us on