glass substrates for semiconductor manufacturing 2013 Report by Yole Developpement

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glass substrates for semiconductor manufacturing 2013 Report by Yole Developpement

  1. 1. © 2013Glass Substratesfor Semiconductor ManufacturingThe first REPORT analyzing in detail the glass wafer for wafer–level –packaging and micro structuring technologies applications
  2. 2. © 2013• 2Copyrights © Yole Developpement SA. All rights reservedContent of the report (1/2)• Table of contents……………………………...2• Glossary…………………………………….…..3• Report Scope………………………………......4• Companies Cited in the Report…………..…5• Executive Summary…………………….…….6– Glass Wafer Market Forecast (in $M,wspy)………………………………..……...........…7– Breakdown by Functionality……………………9– Breakdown by End-Application……………….12– Breakdown by Wafer Size………………………14– Glass Substrate Players’ Market Share andRevenue …………………………………………..16• Introduction, Definitions & ReportScope………………………………………..….23• 2012 - 2018 Glass Wafer Market Status &Evaluation Breakdown by End-Application…………………………………….34– Glass Substrate Market Forecast (in wspy) .36• 2012 Shipment Forecast…………………..39• 2018 Shipment Forecast…………………..42– Glass Substrate Market Forecast (in $M)…..49• 2012 Revenue Forecast………………….51• 2018 Revenue Forecast………………….54• 2012-2018 Detailed Glass Market Forecastby End-Application…………………………..57– MEMS Application Opportunities ………59– CIS ApplicationOpportunities………………………….……71– RF/Analog ICOpportunities…………………………….…77– LED ApplicationOpportunities…………………………….…83– Memory Opportunities……………………88– Logic IC Opportunities……………………93– Power Opportunities………………………98– Optoelectronic ComponentOpportunities………………………………106– µbattery Opportunities……………………112• 2012 - 2018 Glass Wafer Market Status &Evaluation: Breakdown byFunctionnalities…………………………..…114– Glass Substrate Market Forecasts (in wspy)……………………………………………….115• 2012 Shipment Forecast………………….116• 2018 Shipment Forecast…………………..118• Glass Substrate Market Forecasts (in$M)……………………………………………..122• 2012 Revenue Forecast…………………….123• 2018 Revenue Forecast…………………….125
  3. 3. © 2013• 3Copyrights © Yole Developpement SA. All rights reservedContent of the report (2/2)• Detailed Glass Market Forecast byFunction/Platform……………………………123– Focus on SupportSubstrate……………………………….….125– Focus on WLCapping……………………141– Focus on WLOptics………………………171– Focus on 3D TGV/2.5DInterposer……………………………….…194– Focus on Carrier…………………………209– Focus on Microstructuring ……………227• Glass Substrate Wafer: Supply Chain& ValueChain…….........………………………232– Main Players involved in Glass SubstrateProcessing ………………………………233– Glass Substrate Players’ Market Share andRevenue ………………………………...236– Main Players involved in Glass SubstrateProcessing ……………………..………243– Glass Substrate Players’ Market Share andRevenue ………………………….…….245• Structuration of GlassSubstrate……………………………...252– Wafer-Level Packaging Applications: SupplyChain for Logic IC………………….…….255– Supply Chain for MEMS Devices………257– Supply Chain for CMOS ImageSensors……………………………..……..264– Supply Chain for MicrofluidicDevices………………………………….…273• Glass Substrate MicromachiningTechnologies…………..……………..280• Conclusions &Perspectives………………………….295
  4. 4. © 2013• 4Copyrights © Yole Developpement SA. All rights reservedKey Objectives of the Report• We have prepared a report on the glass substrate topic related to Wafer-Level Packaging and microstructuring technologies applications in order tounderstand the applications, the technology trends and be able to providemarket forecast per functions and end applications in this area• The objectives of the report are:– Describe the applications of glass substrate– Give the following detailed information• a definition of the applicative segmentation for finished glass substrates• an overview of the overall glass wafer market and market share of the main glassmaterials suppliers– Evaluation of market developments in terms of market size (volume, value),substrate sizes/formats, by applications– Technology process, specification and value chain• The report does not cover– ROE/DOE µoptics applications– Photonics applications– Flat panel display applications– PV applications
  5. 5. © 2013• 5Copyrights © Yole Developpement SA. All rights reservedScope of this report coveragePlatforms / Functionnalities of Glass substrates coveredMicrostructuring technologiesUsing GlassµstructuresWafer-Level PackagingUsing Glass3D TGV/3D glasscappinginterposersWLOpticsWLCappingGlasscarriersMEMS LED CIS c-PVMemoryLogicICsRFIPD/AnalogICsOptocomp.Fuel-cells/µbatteriesµfluidicPowerEnd ApplicationsSubstrateSupportSubstrate
  6. 6. © 2013• 6Copyrights © Yole Developpement SA. All rights reservedGlass Substrate Value ChainStructurationof GLASS Substrates:Functionnalityof GLASS Substrates:End Applicationsfor GLASS Substrates:• MEMS & Sensors• CMOS image sensors• LED Modules• Memories• Logic ICs• Analog & RF ICs• Microfluidic / Microreaction• Micro-batteries / Fuel-cells• Power components• Concentrated - Solar PV• Wafer Level Packagingtechnologies using GLASS:– Support substrate– WLC– WLO– 3D TGV/3D glass cappinginterposers– Glass carriers• Microstructuring technologiesusing GLASS:– µstructures• Simple GLASS:– Wafer 4” / 6” / 8” / 12”– Sheet or Panel• Finished / Structured Wafers with:– Advanced thinning & polishing treatment– Cavities– Fluidic channel– Fluidic hole– Electric « Through the Glass » Vias– Electric redistribution & Bumping– Printed polymer structures– Specific coating / functionalizationExample of glass value chain in a camera module
  7. 7. © 2013• 7Copyrights © Yole Developpement SA. All rights reservedFunctionnalities of Glass substrate wafer versus End applicationsX X X XX X XXX X X XX X XXMEMS LEDCIS memoryLogicICsRF/AnalogICsFuel-cells/µbatteriesWLCWLO3D TGV/interposerCarriersMicrostructuresPowerµfluidicOptocomp.SupportSubstrate
  8. 8. © 2013• 8Copyrights © Yole Developpement SA. All rights reservedGlass substrate market: 2012 shipments per Application111Kwpy8’’ eq58Kwpy8’’ eq2,5Kwpy8’’ eq0Kwpy8’’ eq493Kwpy8’’ eq4,5Kwpy8’’ eq2,9Mwpy8’’ eq191Kwpy8’’ eq25Kwpy8’’ eq0Kwpy8’’ eq0Kwpy8’’ eq63Kwpy8’’ eq22Kwpy8’’ eq15Kwpy8’’ eq53Kwpy8’’ eq210Kwpy8’’ eqMEMSLEDCIS memoryLogicICsRF/AnalogICsFuel-cells/µbatteriesWLCWLO3D TGV/interposerCarriersMicrostructuresPowerµfluidicOptocomp.SupportSubstrate
  9. 9. © 2013• 9Copyrights © Yole Developpement SA. All rights reservedGlass substrate overall market size in wspyBreakdown per Functionnalities02468101214162012 2013 2014 2015 2016 2017 2018Shipments(in8incheqwspy)Glass substrate overall market size (in 8 inch Million wspy)Breakdown per End ApplicationOpto componentsµfluidicRF devicesLogicMemoryPowerLEDCISMEMSYole Developpement © April 2013
  10. 10. © 2013• 10Copyrights © Yole Developpement SA. All rights reserved2012 Overall market share for glass substrate• Total market related to the Glass market is assessed at $158M in 2012.• Schott (G), Tecnisco (JP), PlanOptik (G), Bullen (US) and Corning (US) will sharealmost 70% of the $158M glass substrate market this year, driven mainly by demandfor WLCapping.Schott AGTecniscoBullenPlanOptikCorningAGCHOYAOthersGlass substrate production for WLP2012 Market Share Breakdown by glass supplier (in M$)Yole Developpement© April 2013$158M
  11. 11. © 2013• 11Copyrights © Yole Developpement SA. All rights reservedMore slides extracts
  12. 12. © 2013• 12Copyrights © Yole Developpement SA. All rights reservedWho should be interested in this report?• Equipment & Material suppliers– Identify new business opportunities and prospects– Understand the differentiated value of your products and technologies in this market– Identify technology trends, challenges and precise requirements related to glass substrate• Glass substrate manufacturers– Evaluate market potential of your technologies and products– Position your company in the value chain and market– Monitor and benchmark your competitors• R&D organizations & Investors– Monitor the global activity and consolidation currently happing in the semiconductorequipment & material business in order to identify new partners, targets and take the rightdecision before committing to one particular supplier• IDMs, CMOS foundries & OSAT players– Understand technology trends related to glass substrate used in the Wafer-Level-Packagingand Micro structuring technologies
  13. 13. © 2013• 13Copyrights © Yole Developpement SA. All rights reservedAbout the Authors of this reportAmandine Pizzagalli– Amandine recently joined Yole Development Advanced Packaging and MEMSmanufacturing teams after graduating as an engineer in Electronics, with aspecialization in Semiconductors and Nano Electronics Technologies. Sheworked in the past for Air Liquide with an emphasis on CVD and ALD processesfor semiconductor applicationsContact: pizzagalli@yole.fr
  14. 14. © 2013• 14Copyrights © Yole Developpement SA. All rights reservedCompanies Cited in this ReportAGC, Amkor, Anteryon, ASE, Audi, Berliner Glass, Bosch, Bullen, Colorship,Corning, Dolomite, Heptagon, Hoya, Hoya, Honeywell, Hynix, Qualcomm,Ibiden, IMT AG, IPDiA, Infineon, Lemoptix, Microfluidic ChipShop, Micronit,Micron, MikroGlass, Murata, Nemotek, Omnivision, Osram, OptoPac,PlanOptik, Saint-Gobain,Sensonor/Infineon, Samsung, SKHynix,Statchippac, STMicro, Schott, Sony, SPIL,Tecnisco, TexasInstruments, Toshiba, TSMC, Ulcoat, VisEra, and more…
  15. 15. © 2013• 15Copyrights © Yole Developpement SA. All rights reservedYole activitiesMEDIANews feed / Magazines / WebcastsREPORTSMarket & technologyPatent AnalysisReverse costing reportCONSULTINGMarket researchTechnology & StrategyPatent Analysiswww.yole.frYOLE FINANCEM&A / Due Diligence /Fundraising services
  16. 16. © 2013• 16Copyrights © Yole Developpement SA. All rights reservedOur latest market reports…© 2010Copyrights © Yole Développement SA. All rights reserved.MEMS PackagingMarket & Technology Trends1995Sidebraze DIP1996-2002Plastic PDIP1999 - todaySMT SOIC& Die Down2006Stacked DieQFN~125 sq mm ~100 sq mm ~25 sq mm6 & 6 mm1995Sidebraze DIP1996-2002Plastic PDIP1999 - todaySMT SOIC& Die Down~125 sq mm ~100 sq mFlip-chip2013 ReportNokia3D Glass & Siliconinterposers - 2012 ReportFerro-ElectricThin FilmsThin WaferHandlingMEMS Front EndManufacturingDeep RIEFlexible & PrintedElectronics
  17. 17. © 2013• 17Copyrights © Yole Developpement SA. All rights reservedFor More Information …Take a look at our websiteswww.yole.frYole Développement corporate websitewww.i-micronews.comNews Portal - online free registration to our publicationswww.systemplus.frSister company expert in teardown & reverse costing analysiswww.yolefinance.comSeparate business unit of Yole dedicated to financial services

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