Embedded IC in package technology is a young and promising advanced packaging technique: understanding the status of the patent situation is key to understanding the business environment and anticipating the related strategic evolutions!
A very young pa tent landscape dominated by a very small number of companies...
For this patent analysis 721 relevant and related patents have been selected and classified to further analyze embedded IC IP situation.
Among the 1547 patent documents constituting the 596 relevant patent families, 84% are active (pending or granted) and 16% are inactive (revoked, expired or lapsed).
In addition, even if first patents for embedded IC are quite old, this technology is very young with regard to the number of patents pending!
About 180 assignees are involved in embedded die technologies while the top 10 assignees represent 53% of patents filed in the Embedded die domain.
Main business model involved in this area is substrate & PCB makers (which have been strongly involved in the PCB and back-end industries for a while) but we found a significant number of IDMs and OSATs which are looking closer and closer to this packaging technology.
Patents in the embedded domain are mainly filed by firms or universities located in Korea (33%), Japan (21%) and USA (19%). Japanese and American players were the early adopters of the technology and they are still deeply involved in this business. Korea emerged as new key player in 2005.
We selected 10 companies among the most active players identified in this complete statistical analysis to lead an accurate description of their patent portfolios.
The report also provides a database of all the relevant patents we have analyzed in an Excel file, which allows multi-criteria searches. The criteria are basically those we used for the technological segmentation:
•Patent information: Patent publication number, link to the PDF, document, oldest priority date, title, assignee, patent potential ranking, nb of citing patent families
•Technological segmentation: chip placement / bonding, tape lamination, RDL, passivation & balling
This complete description of the patent landscape is included in the first part of the report and provides all the background material for the analysis of the embedded IC in package landscape. The report provides a complete analysis of the patent landscape including geographical origins of the patents, company or R&D organizations that have been granted the patents, historical data on when the companies have applied for patents in the last 20 years, inventors of the patents, expiration status, R&D collaborations…
More information on that report at http://www.i-micronews.com/reports/Embedded-Die-Package-Patent-Investigation/8/385/