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Sensonor STIM210 High-precision MEMS Gyro Module teardown reverse costing report by published Yole Developpement

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Sensonor STIM210 …

Sensonor STIM210
High-precision MEMS Gyro Module

World highest performance silicon MEMS gyro available without export control.
Tactical grade with bias instability of 0.5°/h in a miniature 33cm3 package.


MEMS gyroscopes for tactical grade applications made a lot of progress in the past few years in term of reliability. They are now accepted in high-reliability environments, and are even starting to replace FOGs and other technologies in tactical applications.

With a bias instability of 0.5°/h, the Sensonor STIM210 is the world highest performance silicon MEMS gyroscope. The module is available without export control (ITAR-free). The analyzed module is a complete system offering 3 axes MEMS gyros associated with a 32-bit microcontroller which provides flexibility in device configuration.

STIM210 applications are typically found within industrial, aerospace and defense markets, for various platform stabilizations, pointing and navigation systems, attitude heading reference systems (AHRSs), inertial navigation systems (INSs), smart munitions, missiles, 3D mapping systems, range finders, trains, robotics, and more. For many applications STIM210 directly replaces FOGs and improves system solutions with respect to robustness, reliability, size, weight, power and cost.

More information on that report at http://www.i-micronews.com/reports/Sensonor-STIM210High-precision-MEMS-Gyro-Module/1/436/

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  • 1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Electronic Costing & Technology Experts www.systemplus.fr 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr March 2014 – Version 1 – Written by Romain Fraux
  • 2. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 2 Glossary 1. Overview / Introduction 4 – Executive Summary – Reverse Costing Methodology 2. Company Profile 7 – Sensonor Profile – STIM210 Specifications 3. Physical Analysis 15 – Synthesis of the Physical Analysis – Physical Analysis Methodology – 3.1 Module 18 – Module View, Dimensions & Pin-out – Module Opening – 3.2 Electronic Board 24 – Top Side – Components Markings – Top Side – Components Identification – Bare Dies Connections – Bottom Side – Components Markings – Bottom Side – Components Identification – 3.3 Digital ASIC 36 – View, Dimensions & Marking – Delayering, Process Identification – Cross-Section – 3.4 Mixed-Signal ASIC 48 – View, Dimensions & Marking – Delayering, Process Identification – Cross-Section – 3.5 MEMS Gyroscope 59 – View, Dimensions & Marking – Bond Pads & Bond Pads Opening – MEMS Cap Removed – MEMS Sensing Area – MEMS Gyro Principle – MEMS Cross-Section: Structure – MEMS Cross-Section: Masses – MEMS Cross-Section: Electrode – MEMS Cross-Section: Buried Connections – MEMS Cross-Section: Getter 4. Manufacturing Process Flow 96 – Global Overview – Digital ASIC Front-End Process & Wafer Fab Unit – Mixed-Signal ASIC Front-End Process & Wafer Fab Unit – MEMS Process Flow & Wafer Fab Unit – Module Assembly Process Flow & Assembly Unit 5. Cost Analysis 119 – Synthesis of the cost analysis – Main steps of economic analysis – Yields Hypotheses – 5.1 Digital ASIC 124 – Front-End Cost – Probe Test & Dicing Cost – Wafer Cost & Die Cost – 5.2 Mixed-Signal ASIC 129 – Front-End Cost – Probe Test & Dicing Cost – Wafer Cost & Die Cost – 5.3 MEMS Gyroscope 134 – Front-End Cost – Front-End Cost per process steps – Probe Test & Dicing Cost – Wafer Cost & Die Cost – 5.4 BOM Cost 143 – Electronic Board BOM Cost – Housing BOM Cost – Material Cost Breakdown – 5.5 Module Assembly & Test Cost 149 – Electronic Board Assembly Cost – Housing Assembly Cost – Final Test & Calibration Cost – 5.6 Module Cost & Price 157 – STIM210 Module Cost – STIM210 Module Estimated Price Contact 161
  • 3. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 3 • This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the STIM210 Multi-Axis Gyro Module supplied by Sensonor. • MEMS gyroscopes for tactical grade applications made a lot of progress in the past few years in term of reliability. They are now accepted in high-reliability environments, and are even starting to replace FOGs and other technologies in tactical applications. • With a bias instability of 0.5°/h and 10°/h bias error over the operating temperature range, the Sensonor STIM210 is the world highest performance silicon MEMS gyroscope. The module is available without export control (ITAR-free). • The analyzed module is a complete system offering 3 axes MEMS gyros associated with a 32-bit microcontroller which provides flexibility in device configuration. • The MEMS gyros are associated with ASIC dies and are mounted on a silicon plate directly connected to the housing of the module, allowing to reduce the mechanical strain. • The Sensonor gyroscope dies use a “butterfly” structure with two masses operating in an anti-phase movement and asymmetric beams allowing them to bend both transversely and laterally.
  • 4. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 4 The reverse costing analysis is conducted in 3 phases: Teardown analysis • Package is analyzed and measured • The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking • Setup of the manufacturing process. Costing analysis • Setup of the manufacturing environment • Cost simulation of the process steps Selling price analysis • Supply chain analysis • Analysis of the selling price
  • 5. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 5 44.8mm Global view of the STIM210 Gyro Module 38.6mm 21.5mm
  • 6. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 6
  • 7. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 7
  • 8. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 8
  • 9. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 9 • The die marking includes: SWA17C1 E0512X8PCL2 ASIC Die Marking
  • 10. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 10
  • 11. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 11 • The die marking includes: IMEGO ASIC Die Marking
  • 12. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 12
  • 13. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 13 Sensonor Gyro Process Synthesis
  • 14. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 14
  • 15. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 15
  • 16. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 16
  • 17. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 17
  • 18. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 18
  • 19. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 19
  • 20. Sensonor STIM210 Gyro Module Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 20 Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated) These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: Europe & USA Office • Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service, Tel: +33 472 83 01 90, Email: jourdan@yole.fr Japan Office • For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K. Phone: (81) 362 693 457 - Cell : (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: katano@yole.fr • For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K. Email: onozawa@yole.fr Korea Office • Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 - Cell: (82) 10 4097 5810 - Fax: (82) 2 2010 8899 – Email: yang@yole.fr
  • 21. ORDER FORMPlease process my order for “Sensonor STIM210 MEMS Gyro Module” Reverse Costing Analysis: SHIP TO Name (Mr/Ms/Dr/Pr): ...................................................................................... Job Title: ...................................................................................... Company: ...................................................................................... Address: ...................................................................................... City: State: ...................................................................................... Postcode/Zip: ...................................................................................... Country*: ...................................................................................... *VAT ID Number for EU members: ...................................................................................... Tel: ...................................................................................... Email: ..................................................................................... Date: ....................................................................................... Signature : I hereby accept Yole’s Terms and Conditions of Sale (1) ...................................................................................... DELIVERY on receipt of payment Performed by On line on Yole website: http:/www.i-micronews.com/reports/ Credit Card: Name of the Card Holder: Credit Card Number: Card Verification Value (3 last digits except AMEX: 4 last digits) : Expiration date: By bank transfer: BANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France, Bank code : 30056, Branch code : 00170 Account No : 0170 200 1565 87, SWIFT or BIC code : CCFRFRPP, IBAN : FR76 3005 6001 7001 7020 0156 587 Return order by: • FAX: +33 (0)472 83 01 83 • MAIL: YOLE DEVELOPPEMENT, 75 Cours Emile Zola, F - 69100 Lyon - Villeurbanne Contact: David Jourdan, jourdan@yole.fr, Tel: +33 (0)472 83 01 90 (1) Our Terms and Conditions of Sale are available www.yole.fr/Terms_and_Conditions_of_Sale.aspx. The present document is valid 12 months after its publishing date: 20th May 2014.  Visa  Mastercard  Amex Beginning in 1998 with Yole Développement, we have grown to become a group of companies providing market research, technology analysis, strategy consulting, media in addition to finance services. With a solid focus on emerging applications using silicon and/or micro manufacturing Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Microfluidics & Medical, Advanced Packaging, Compound Semiconductors, Power Electronics, LED, and Photovoltaic. The group supports companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business. CUSTOM STUDIES • Market data, market research & marketing analysis • Technology analysis • Reverse engineering & reverse costing • Strategy consulting • Corporate Finance Advisory (M&A and fund raising) MEDIA • Critical news, Bi-weekly: Micronews, the magazine • In-depth analysis & Quarterly Technology Magazines: MEMS Trends – 3D Packaging – PV Manufacturing – iLED – Power Dev' • Online disruptive technologies website: www.i-micronews.com • Exclusive Webcasts • Live event with Market Briefings TECHNOLOGY & MARKET REPORTS • Collection of reports • Players & market databases • Manufacturing cost simulation tools • Component reverse engineering & costing analysis More information on www.yole.fr PAYMENT ABOUT YOLE DEVELOPPEMENT Distributed by  Full Reverse Costing report: EUR 4,490* *For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format *For French customer, add 20 % for VAT ** Technology Analysis report contains only Physical Analysis & Manufacturing Process Flow