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Infineon SP37 Tire Pressure Monitoring Sensor teardown reverse costing report by published Yole Developpement

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Highly Integrated & Reliable Tire Pressure Monitoring Sensor …

Highly Integrated & Reliable Tire Pressure Monitoring Sensor

With more than 150 million TPMS sensors sold worldwide, Infineon Technologies is one of the leaders on the TPMS market.
The latest generation of Infineon's TPMS, the SP37, is a highly integrated TPMS sensor which embeds measurement of pressure and radial acceleration (2 DoF) with a low-power microcontroller, a LF receiver and an RF transmitter in a system in package integrating only two dies. This high integration of functions allows to build a complete system with few external components and thus enable system cost savings.

The SP37 sensors inherits its MEMS technology from the acquisition of the Norwegian Sensonor in 2003. Therefore, highly reliable measurements in harsh environments are possible by the use of the mature and low-cost triple stack hermetic wafer bonding technology in combination with buried piezoresistors and conductors.


The SP37 sensors is assembled in a Small Outline 14-pin package and operates under a temperature range of -40 to +125°C.

This report will provide a complete teardown of the MEMS pressure sensor, the accelerometer and the ASIC (microcontroller & RF transmitter) of the SP37 TPMS with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth manufacturing cost analysis
- Supply chain evaluation
- Selling price estimation

More information on that report at http://www.i-micronews.com/reports/Infineon-SP37-Tire-Pressure-Monitoring-Sensor/1/420/

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  • 1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Electronic Costing & Technology Experts www.systemplus.fr 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr February 2014 – Version 1 – Written by Romain Fraux
  • 2. Infineon SP37 TPMS Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 2 Glossary 1. Overview / Introduction 4 – Executive Summary – Reverse Costing Methodology 2. Company Profile 7 – Infineon Technologies – SP37 Characteristics 3. Physical Analysis 12 – Synthesis of the Physical Analysis – Physical Analysis Methodology – 3.1 Package 15 – Package Views & Dimensions – Package Marking & Pin-Out – Package X-Ray – Package Opening – Wire Bonding Process – Package Cross-Section – 3.2 ASIC Die 27 – View, Dimensions & Marking – Delayering – Main Blocks – Cross-Section – Process Characteristics – 3.3 MEMS Die 44 – View & Dimensions – Marking – Bond Pad Opening & Bond Pad – Cap Removed – Sensing Area – Cross-Section: – Bond Pad Opening Cross-Section – Accelerometer Cross-Section – Pressure Sensor Cross-Section – Process Characteristics 4. Manufacturing Process Flow 77 – Global Overview – ASIC Front-End Process – ASIC Wafer Fabrication Unit – MEMS Process Flow – MEMS Wafer Fabrication Unit – Packaging Process Flow – Package Assembly Unit 5. Cost Analysis 98 – Synthesis of the cost analysis – Main steps of economic analysis – Yields Hypotheses – ASIC Front-End Cost – ASIC Back-End 0 : Probe Test & Dicing – ASIC Wafer & Die Cost – MEMS Front-End Cost – MEMS Back-End 0 : Probe Test & Dicing – MEMS Front-End Cost per process steps – MEMS Front-End: Equipment Cost per Family – MEMS Front-End: Material Cost per Family – MEMS Wafer & Die Cost – Back-End : Packaging Cost – Back-End : Packaging Cost per Process Steps – Back-End : Final Test Cost – Component Cost 6. Estimated Price Analysis 123 – Infineon Financial Ratios – SP37 Estimated Price Contact 126
  • 3. Infineon SP37 TPMS Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 3 • This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Infineon SP37 Tire Pressure Monitoring Sensor. • The SP37 is the latest generation of Infineon's TPMS. It is a highly integrated TPM sensor which embeds measurement of pressure and radial acceleration with a low-power microcontroller, a LF receiver and an RF transmitter in a system in package integrating only two dies. This high integration of functions allows to build a complete system with few external components and thus enable system cost savings. • The SP37 inherits its MEMS technology from the acquisition of the Norwegian Sensonor in 2003. Therefore, highly reliable measurements in harsh environments are possible by the use of the triple stack hermetic wafer bonding technology in combination with buried piezoresistors and conductors. • The SP37 is assembled in a Small Outline 14-pin package and operates under a temperature range of -40 to +125°C.
  • 4. Infineon SP37 TPMS Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 4 The reverse costing analysis is conducted in 3 phases: Teardown analysis • Package is analyzed and measured • The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking • Setup of the manufacturing process. Costing analysis • Setup of the manufacturing environment • Cost simulation of the process steps Selling price analysis • Supply chain analysis • Analysis of the selling price
  • 5. Infineon SP37 TPMS Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 5
  • 6. Infineon SP37 TPMS Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 6
  • 7. Infineon SP37 TPMS Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 7 • The die marking includes: 83308 168 MEMS bond pads & die marking
  • 8. Infineon SP37 TPMS Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 8
  • 9. Infineon SP37 TPMS Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 9
  • 10. Infineon SP37 TPMS Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 10
  • 11. Infineon SP37 TPMS Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 11
  • 12. Infineon SP37 TPMS Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 12
  • 13. Infineon SP37 TPMS Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 13 Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated). These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: USA Office • Michael McLaughlin, Business Development Manager, Phone: (650) 931 2552 - Cell: (408) 839 7178 - Email: mclaughlin@yole.fr • Jeff Edwards, Sales Associate, Yole Inc., Cell: (972) 333 0986- Email: edwards@yole.fr Japan Office • For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K. Phone: (81) 362 693 457 - Cell : (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: katano@yole.fr • For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K. Email: onozawa@yole.fr European Office • Yves Devigne, Europe Business Development Manager, Cell : +33 6 75 80 08 25 - Email : devigne@yole.fr • Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service, Tel: +33 472 83 01 90, Email: jourdan@yole.fr Korea Office • Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 - Cell: (82) 10 4097 5810 - Fax: (82) 2 2010 8899 – Email: yang@yole.fr

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