DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices o...
Infineon IPD65R225C7 – CoolMOS 7 generation
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Glossar...
Infineon IPD65R225C7 – CoolMOS 7 generation
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• This ...
Infineon IPD65R225C7 – CoolMOS 7 generation
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The rev...
Infineon IPD65R225C7 – CoolMOS 7 generation
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• The C...
Infineon IPD65R225C7 – CoolMOS 7 generation
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Die in ...
Infineon IPD65R225C7 – CoolMOS 7 generation
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• Die s...
Infineon IPD65R225C7 – CoolMOS 7 generation
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 8 Drawing...
Infineon IPD65R225C7 – CoolMOS 7 generation
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Infineon IPD65R225C7 – CoolMOS 7 generation
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Revers...
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Infineon CoolMOS C7 7th generation Superjunction MOSFET 2014 teardown reverse costing report by published Yole Developpement

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Infineon CoolMOSTM C7
7th generation Superjunction MOSFET

Infineon has improved the epitaxy process with a direct impact on Rdson, 20% lower.

The CoolMOSTM C7 from Infineon is the 7th generation high-voltage Superjunction structure power MOSFET. With a breakdown voltage of 650V for a current of 7A (100°C), the C7 is optimized for hard switching topologies such as Power Factor Correction, solar boost circuit applications.

The CoolMOSTM C7 offers a very low on-resistance (between 19mΩ and 225mΩ), and a fast switching speed, more than 100KHz. The C7 differs from the C6 via a new multi-epitaxy technology and an original contact solution. The C7 wafer cost is 10% higher than the C6 but the current density is 25% higher and the power losses 20% lower.

This reverse costing report provides an estimation of the production cost of the IPD65R225C7, a discrete CoolMOSTM transistor.

More information on that report at http://www.i-micronews.com/reports/Infineon-CoolMOS-C7-7th-generation-Superjunction-MOSFET/12/440/

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Infineon CoolMOS C7 7th generation Superjunction MOSFET 2014 teardown reverse costing report by published Yole Developpement

  1. 1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Electronic Costing & Technology Experts www.systemplus.fr 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr April 2014 – Version 1 – Written by Sylvain Hallereau
  2. 2. Infineon IPD65R225C7 – CoolMOS 7 generation Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 2 Glossary 1. Overview / Introduction 4 – Executive Summary – Comparison of C6 and C7 generations – Reverse Costing Methodology 2. Companies Profile 8 – Infineon Profile 3. IPD65R225C7 Characteristics 10 – IPD65R225C7 Characteristics 4. IPD65R225C7 Physical Analysis 13 – Physical Analysis Methodology – Package Views & Dimensions – Package Cross-Section – Leadframe MOSFET – Die View, Dimensions & Marking – Gate Supply Line – Guard Ring – Delayering – Metal Layers – Source and Gate – Cross-Section – Source Cross-Section – Substrate and Epitaxy Layers – Superjunction Structure – Backside – MOSFET Characteristics 5. Manufacturing Process Flow 46 – Global Overview – MOSFET Front end Unit – MOSFET Tests Unit – Transistor Process Flow 6. Cost Analysis 56 – Synthesis of the cost analysis – Main steps of economic analysis – Yields Hypotheses – MOSFET Epitaxy Cost – MOSFET Front-End Cost – MOSFET Wafer Cost – MOSFET Cost per process steps – MOSFET : Equipment Cost per Family – MOSFET : Material Cost per Family – MOSFET : Back-End : Probe and – IPD65R225C7 - Package – IPD65R225C7 - Final Test 7. Price Estimation 76 Contact 80
  3. 3. Infineon IPD65R225C7 – CoolMOS 7 generation Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 3 • This full Reverse Costing study has been conducted in order to give insight on technology data, manufacturing cost of the CoolMOS 650V MOSFET used in the IPD65R225C7 from Infineon. • The IPD65R225C7 package contains 1x CoolMOS 650V. The IPD65R225C7 drives 11A at 25°C for 225mohms and 7A at 100°C. • The component is provided in a standard 3-pins DPAK package, compatible with SMD process. • The MOSFET has a current density of 1.06A per mm² at 100°C under 650V. • The power component is designed and manufactured by Infineon. • The manufacturing of the MOSFET is assumed to take place in a 200mm wafer fab unit in Malaysia. • The packaging and final test are realized by Infineon and are assumed to take place in a plant in Malaysia. • The component can be used for : • PFC stages, • Hard switching PWM stages, • Computing, Server, • Telecom, • UPS, • Solar inverters.
  4. 4. Infineon IPD65R225C7 – CoolMOS 7 generation Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 4 The reverse costing analysis is conducted in 3 phases: Teardown analysis • Package is analyzed and measured • The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking • Setup of the manufacturing process. Costing analysis • Setup of the manufacturing environment • Cost simulation of the process steps Selling price analysis • Supply chain analysis • Analysis of the selling price
  5. 5. Infineon IPD65R225C7 – CoolMOS 7 generation Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 5 • The CoolMOS is assembled in a DPAK package. • Dimensions : 6.6mm x 6mm x 2.3mm • Marking Code : 65C7225 ( 650V – C7 – 225mOhm) HRC339 (H = ROHS + halogen free; RC = Lot number 339 = 2013 – 39 week) (Logo Infineon) R • On the packaging label : – CoO: Malaysia (production country) Module top view Package back view DPAK exposed leadframe to enhance the heat dissipation. Lateral view
  6. 6. Infineon IPD65R225C7 – CoolMOS 7 generation Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 6 Die in the DPAK after acid etching. Gate bond Source bond The Drain is directly soldered on the package leadframe with SAC solder. 2 Aluminum wire bonds : 1 Gate bond : Xmm and Xµm of diameter in aluminum. 2 Source bond : Xmm and Xµm of diameter in aluminum. Resin Bonding The lateral areas of the MOSFET, are covered by a polyimide layer, the yellow on the picture. Pad for the test
  7. 7. Infineon IPD65R225C7 – CoolMOS 7 generation Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 7 • Die size : XXmm x XXmm (XXsq mm) • Source pad: • - Size: XXmm x XXmm • Gate pad: • - Size: XXsq mm • Die thickness: XXµm XXmm Mark of the polyimide on the die. Optical views : Die XXmm
  8. 8. Infineon IPD65R225C7 – CoolMOS 7 generation Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 8 Drawing not to Scale
  9. 9. Infineon IPD65R225C7 – CoolMOS 7 generation Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 9
  10. 10. Infineon IPD65R225C7 – CoolMOS 7 generation Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 10 Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated). These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: European & USA Office • Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service, Tel: +33 472 83 01 90, Email: jourdan@yole.fr Japan Office • For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K. Phone: (81) 362 693 457 - Cell : (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: katano@yole.fr • For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K. Email: onozawa@yole.fr Korea Office • Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 - Cell: (82) 10 4097 5810 - Fax: (82) 2 2010 8899 – Email: yang@yole.fr
  11. 11. ORDER FORM PAYMENT Please process my order for “Infineon CoolMOS C7” Reverse Costing Report ” Reverse Costing Analysis ” Reverse Costing Analysis:  Multi user license price: EUR 2,990* *For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format *For French customer, add 20 % for VAT SHIP TO PAYMENT Name (Mr/Ms/Dr/Pr): ...................................................................................... Job Title: ...................................................................................... Company: ...................................................................................... Address: ...................................................................................... City: State: ...................................................................................... Postcode/Zip: ...................................................................................... Country*: ...................................................................................... *VAT ID Number for EU members: ...................................................................................... Tel: ...................................................................................... Email: ..................................................................................... Date: ....................................................................................... Signature : ...................................................................................... BILLING CONTACT First Name: .................................................................. Last Name: ............................................................................ Email:............................................................................ Phone:..................................................................................... Credit Card: Name of the Card Holder: Credit Card Number: Card Verification Value (3 last digits except AMEX: 4 last digits) : Expiration date: By bank transfer: BANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France, Bank code : 30056, Branch code : 00170 Account No : 0170 200 1565 87, SWIFT or BIC code : CCFRFRPP, IBAN : FR76 3005 6001 7001 7020 0156 587 Return order by: • FAX: +33 (0)472 83 01 83 • MAIL: YOLE DEVELOPPEMENT, 75 Cours Emile Zola, 69100 Lyon - Villeurbanne. Contact: David Jourdan, jourdan@yole.fr, Tel: +33 (0)472 83 01 90 The present document is valid till 27th May 2015. Our Terms and Conditions of Sale are available www.yole.fr/Terms_and_Conditions_of_Sale.aspx.  Visa  Mastercard  Amex ABOUT YOLE DEVELOPPEMENT Beginning in 1998 with Yole Développement, we have grown to become a group of companies providing market research, technology analysis, strategy consulting, media in addition to finance services. With a solid focus on emerging applications using silicon and/or micro manufacturing Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Microfluidics & Medical, Advanced Packaging, Compound Semiconductors, Power Electronics, LED, and Photovoltaic. The group supports companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business. CUSTOM STUDIES • Market data, market research & marketing analysis • Technology analysis • Reverse engineering & reverse costing • Strategy consulting • Corporate Finance Advisory (M&A and fund raising) MEDIA • Critical news, Bi-weekly: Micronews, the magazine • In-depth analysis & Quarterly Technology Magazines: MEMS Trends – 3D Packaging – PV Manufacturing – iLED – Power Dev' • Online disruptive technologies website: www.i-micronews.com • Exclusive Webcasts • Live event with Market Briefings TECHNOLOGY & MARKET REPORTS • Collection of reports • Players & market databases • Manufacturing cost simulation tools • Component reverse engineering & costing analysis More information on www.yole.fr
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