2010
Rev 0125
Technology Roadmap
                   Parameters                          Standard        Advanced              R&D       ...
Technology Roadmap
                 Parameters                       Standard        Advanced           R&D          Comme...
Technology Roadmap
               Parameters                      Standard    Advanced     R&D         Comments
Surface fi...
Technology Roadmap
                  Parameters             Standard     Advanced        R&D        Comments
Other Capabil...
Material Specifications
                                                                                                  ...
Nelco              N4000-13SI               210     350     3.4 @ 1 GHz             0.008 @ 2.5 GHz (SPC)           9-13  ...
Material Specifications
                                                                                                  ...
File Transfer Instructions
Preferred data formats: Gerber (274 or 274X) or Valor ODB++, drill files should be in ASCII for...
Environmental
Consciousness


MEI Wins Southern
California Facility
of the Year Award
Vince Beusan
Account Manager
MEI Inc.
130 W. Bristol Lane
Orange, California 92865
                           Thank You!
T...
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MEI 2012 Tech Roadmap

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MEI 2012 Tech Roadmap

  1. 1. 2010 Rev 0125
  2. 2. Technology Roadmap Parameters Standard Advanced R&D Comments IL line and space 0.5 oz. copper 4/4 2/2.5 2/2 OL line and space 0.25 oz. copper 4/4 2.5/3 2/2.5 OL line and space 0.5 oz. base copper 5/5 4/4 3/3 Smallest drilled thru via - .062” brd. thickness .010” .006” .004” Smallest drilled thru via - .093” brd. thickness .010” .008” .006” Smallest drilled thru via - .115” brd. thickness .012 .010” .010” Smallest drilled thru via - .250” brd. thickness .020” .016” .014” .001” annular ring – Class 2 .010” .008” See Eng. .002” annular ring – Class 3 .012” .010” See Eng. Antipad over drill size .024” .016” .012” Microvia laser drill size .006” .004” .003” Pad over microvia drill size .006” .005” .004” Maximum layers of microvia per side 2 3 See Eng. Multi depth microvias Yes Yes Yes Maximum aspect ratio – w/ .010” drilled hole 12:1 18:1 24:1 Not recommended to Maximum aspect ratio - microvias 0.8:1 0.8:1 See Eng. go higher than1:1 MEI is proud to announce our submittal to PCQR² and listings as CAT Code “G16”, “F27”, “H34”, “I20”, “I45”, “J20” (Aug “09)
  3. 3. Technology Roadmap Parameters Standard Advanced R&D Comments Press fit hole tolerance +/- .002” +/- .002” +/- .002” SMD soldermask web width - mils .004” .0035” .003 SMD soldermask clearance – mils (over pad) .005” .004” See Eng. Soldermask registration tolerance .003” .002” See Eng. Impedance control – single ended +/- % +/- 7% +/- 5% See Eng. Impedance control – edge coupled diff. +/- % +/- 10% +/- 7% See Eng. Impedance control – broad side differential +/- +/ 10% +/- 7% See Eng. % Board thickness – Min./Max. .020” / .240” .016” / .300” .010” / .300” Layer count is only Maximum layer count 28 50 50+ limited by total thickness Average layer count 16 Maximum panel size 18”X 24” 20”X 26” See Eng. Maximum bow and twist - % <1% <0.75% <0.75% (balanced construction) Minimum copper to edge clearance .015” .012” .010” Min. positional tol. – feature to feature +/- .005” +/- .003” +/- .003” Layer to layer registration tolerance +/- .005” +/- .004 +/- .004” Minimum core thickness .002” .002” .001”
  4. 4. Technology Roadmap Parameters Standard Advanced R&D Comments Surface finishes offered Immersion Silver In House ENIG (Electroless NI / Immersion Au) In House ENEPIG (Electroless Nickel / Electroless Outside Palladium / Immersion Gold OSP – Entek Plus HT In House HASL (Tin / Lead) In House Full body & Selective Electrolytic Ni / Au In House Gold edge connector In House Immersion Tin Outside Other Capabilities Sequential lamination 3 Sublams 5 Sublams See Eng. Various Stacked/Staggered Vias Yes Yes materials Copper Filled Vias Yes MEI recommends Non Epoxy filled vias Yes Conductive Embedded Capacitance Yes ZBC200 & HK 04 Mixed dielectric construction Yes Back-Drilling Tolerances +/- .015 .010 See Eng
  5. 5. Technology Roadmap Parameters Standard Advanced R&D Comments Other Capabilities Pigmented Soldermask Yes (Red, Blue, Black, Purple, Clear) Photo Imageable Legend Yes Jump Scoring Yes Edge Milling Yes Counter Bores / Slot Milling Yes Edge Plating Yes Heat Sink Laminations Yes Yes Yes Industry Certifications UL 94V-0 Yes ISO 9001:2000 Yes IPC-6012 Class II & III Yes IPC-9151 / PCQR² Benchmark Data CAT CODE F27, G16, H34, I20, I45, J20 ITAR Certified Yes Cert # M20467 JCP Certified Yes Cert # 47424 RoHS Compliant Yes Telcordia Compliant Yes
  6. 6. Material Specifications CTE (Z axis, CTE (X-Y, ppm/ºC) Post T260 Deg C T288 Deg IPC 4101B Slash Supplier Type Tg(℃) Td(ºC)) Dk Df ppm/℃) Post Tg Tg (TMA) C (TMA) Construction Sheet Mid-Tg FR-4 Material: 170 Tg Isola FR406 170 300 4.0 @ 1 MHz 0.013 @ 1 MHz 14-17 250 10 min. 2 min. High-Tg Epoxy /24, /26, /28 3.95 @ 1 GHz 0.0161 @ 1 GHz 3.79 @ 2 GHz 0.018 @ 2 GHz 3.76 @ 10 GHz 0.0186 @ 10 GHz Nelco N4000-6 175 325 4.3 @ 1 MHz 0.023 @ 1 MHz 12-15 4-8 min. High-Tg Epoxy /24, /26 4.1 @ 1 GHz 0.022 @ 2.5 GHz 4.0 @ 2.5 GHz (stripline) (stripline) CTE (Z axis, CTE (X-Y, ppm/ºC) Post T260 Deg C T288 Deg IPC 4101B Slash Supplier Type Tg(℃) Td(ºC) Dk Df ppm/℃) Post Tg Tg (TMA) C (TMA) Construction Sheet High-Tg FR-4 Material: 180 Tg Isola FR370HR 180 340 4.24 @ 1 MHz 0.015 @ 1 MHz 14-17 230 60 min. 30 min. Phenolic Filled /21, /24, /26, /98, 4.17 @ 1 GHz 0.0161 @ 1 GHz /99, /101, /126 4.04 @ 2 GHz 0.021 @ 2 GHz 3.92 @ 10 GHz 0.025 @ 10 GHz Nelco N4000-11 185 345 4.3 @ 1 MHz 0.016 @ 1 MHz 12-14 265 30 min. Dicyandiamide /28, /83, /98, /99 4.1 @ 1 GHz 0.020 @ 2.5 GHz 3.8 @ 2.5 GHz (stripline) (stripline) Nelco N4000-29 185 350 4.5 @ 1 MHz 0.016 @ 1 MHz 15-17 265 >60 min. 15 min. Multifunctional Epoxy /28, /98, /99, /126 4.3 @ 1 GHz 0.015 @ 2.5 GHz 4.0 @ 10 GHz (stripline) 0.017 @ 10 GHz (SPC) CTE (Z axis, CTE (X-Y, ppm/ºC) Post T260 Deg C T288 Deg IPC 410B Slash Supplier Type Tg(℃) Td(ºC) Dk Df ppm/℃) Post Tg Tg (TMA) C (TMA) Construction Sheet High-Tg Low DK Material: Isola IS410 180 350 3.96 @ 1 MHz 0.0149 @ 1 MHz 13 250 60 min. Phenolic /21, /24, /26, /28, 3.90 @ 1 GHz 0.0189 @ 1 GHz /121, /124, /129 3.97 @ 2 GHz 0.0200 @ 2 GHz 3.87 @ 10 GHz 0.0230 @ 10 GHz Isola FR408 180 360 3.81 @ 1 MHz 0.0092 @ 1 MHz 14 220 60 min. Low Dk & Df /24, /121, /124 3.78 @ 1 GHz 0.0112 @ 1 GHz 3.77 @ 2 GHz 0.0116 @ 2 GHz 3.75 @ 10 GHz 0.0120 @ 10 GHz Isola FR408HR 200 360 3.72 @ 100MHz, 0.0072 @ 100 MHz, 18 230 60 min. Low Df, Low CTE /21, /24, /121, 3.69 @ 1GHz, 0.0091 @ 1 GHz, /124, /129 3.68 @ @GHz, 0.0092 @ 2 GHz, 3.65 @ 10 GHz 0.0095 @ 10 GHz Nelco N4000-12 190 350 3.7 @ 1 GHz 0.008 @ 2.5 GHz (SPC) 12-15.5 260 >60 min. Epoxy Resin /29 3.6 @ 10 GHz (stripline) 0.008 @ 10 GHz (SPC) 3.7 @ 10 GHz (SPC) Nelco N4000-13 210 350 3.7 @ 1 GHz 0.009 @ 2.5 GHz (SPC) 10-14 280 30+ min. 10+ min. Multifunctional Epoxy /29 3.7 @ 2.5 GHz (SPC) 0.009 @ 10 GHz 3.6 @ 10 GHz (stripline) (stripline) 0.008 @ 3.7 @ 10 GHz (SPC) 10 GHz (SPC) continued
  7. 7. Nelco N4000-13SI 210 350 3.4 @ 1 GHz 0.008 @ 2.5 GHz (SPC) 9-13 280 30+ min. 10+ min. Multifunctional Epoxy /29 3.2 @ 2.5 GHz (SPC) 0.008 @ 10 GHz 3.2 @ 10 GHz (stripline) 0.007 @ (stripline) 10 GHz (SPC) 3.3 @ 10 GHz (SPC) Nelco N4000-13EP 210 350 3.7 @ 1 GHz 0.009 @ 2.5 GHz (SPC) 10-14 275 30+ min. 10+ min. Multifunctional Epoxy /29 3.7 @ 2.5 GHz (SPC) 0.009 @ 10 GHz 3.6 @ 10 GHz (stripline) 0.008 @ (stripline) 10 GHz (SPC) 3.7 @ 10 GHz (SPC) Nelco N4000-13EP SI 210 350 3.4 @ 1 GHz 0.008 @ 2.5 GHz (SPC) 9-13 275 30+ min. 10+ min. Multifunctional Epoxy /29 3.2 @ 2.5 GHz (SPC) 0.008 @ 10 GHz 3.2 @ 10 GHz (stripline) 0.007 @ (stripline) 10 GHz (SPC) 3.3 @ 10 GHz (SPC) Panasonic R-2125 Megtron 4 170 380 4.4 @ 1 GHz 0.010 @ 1 GHZ 33 (Pre Tg) ≤120 min. 50 min. Hi-Rel Glass Epoxy /98, /97, /99, /101,/126 3.7 @ 1 GHz, 0.002 @ 1 GHz, Panasonic R-5775 Megtron 6 185 410 3.6 @ 2 GHz 0.002 @ 2 GHz 45 (Pre Tg) ≤120 min. >120 min. PPO Blend Resin /91 CTE (X-Y, CTE (Z axis, ppm/℃) Post ppm/ºC) Post T260 Deg T288 Deg IPC 4101B Slash Supplier Type Tg(℃) Td(ºC) Dk Df Tg Tg C (TMA) C (TMA) Construction Sheet Polyimide: Isola P95 / P96 (V-0) 260 416 3.9 @ 1 MHz 0.0180 @ 1 MHz 14-17 55 Pre-Tg 60 min. Polyimide /41, /40, /42 3.95 @ 1 GHz 0.0180 @ 1 GHz 3.76 @ 2 GHz 0.0170 @ 2 GHz 3.74 @ 10 GHz 0.0210 @ 10 GHz Nelco N7000-2VO 250 390 4.0 @ 1 MHz 0.009 @ 1 MHz 10-12 30+ min. Polyimide /40, /41, /42 3.8 @ 1 GHZ 0.010 @ 10 GHz (SPC) 3.8 @ 10 GHZ (stripline) Nelco N7000-2HT 260 376 3.8 @ 1 GHZ 0.015 @ 2.5 GHz 9-12 12+ min. Polyimide /40, /41, /42 3.5 @ 2.5 GHz (stripline) 0.015 @ 10 (stripline) 3.5 @ GHz (stripline) 0.009 10 GHZ (stripline) @ 10 GHz (SPC) 3.5 @ 10 GHz (SPC) CTE (X-Y, CTE (Z axis, ppm/℃) Post ppm/ºC) Post T260 Deg T288 Deg IPC 4103 Slash Supplier Type Tg(℃) Td(ºC) Dk Df Tg Tg C (TMA) C (TMA) Construction Sheet High Frequency Rogers RO3003 500 3.00 +/-0.04 @ 10 GHz 0.0013 @ 10 GHz 17 24 PTFE Ceramic Rogers RO3006 500 6.15 +/-0.15 @ 10 GHz 0.0020@ 10 GHz 17 24 PTFE Ceramic Rogers RO3010 500 10.2 +/-.030 @ 10 GHz 0.0023 @ 10 GHz 17 24 PTFE Ceramic PTFE Ceramic - Rogers RO3203 500 3.02 +/-0.04 @ 10 GHz 0.0016 @ 10 GHz 13 58 Reinforced Woven Glass Rogers RO4003C >280 425 3.38 +/-0.05 @ 10 GHz 0.0027 @ 10 GHz 11-14 46 Hydrocarbon Ceramic /10 Rogers RO4350B >280 390 3.48 +/-0.05 @ 10 GHz 0.0037 @ 10 GHz 14-16 35 Hydrocarbon Ceramic /10 Rogers RT/duroid 5870 500 2.33 +/-0.02 @ 10 GHz 0.0012 @ 10 GHz 22-28 173 PTFE Glass Fiber Rogers RT/duroid 5880 500 2.20 +/-0.02 @ 10 GHz 0.0009 @ 10 GHz 31-48 237 PTFE Glass Fiber Rogers RT/duroid 6000 Series SEE DATA SHEETS PTFE Ceramic
  8. 8. Material Specifications CTE (X-Y, CTE (Z axis, ppm/℃) Post ppm/ºC) Post IPC 4101 Slash Supplier Type Tg(℃) Td(ºC) Dk Df Tg Tg Lead Time Construction Sheet Halogen-Free FR4 Nan Ya NPG-170TL 170 4.3-4.5 @ 1 MHz, 0.014-0.016 @ 1 MHz, 9-13 200-230 4 weeks Halogen, antimony and 3.9-4.1 @ 1 GHz 0.012-0.014 @ 1 GHz (avg) red phosphorous free Hitachi MCL-E-679 FG( R ) 175 5.2-5.4 @ 1 MHz 0.008-0.010 @ 1 MHz 13-15 140-170 4 weeks Halogen, antimony and (avg) red phosphorous free CTE (X-Y, CTE (Z axis, ppm/℃) Post ppm/ºC) Post T260 Deg T288 Deg IPC 4101B Supplier Type Tg(℃) Td(ºC) Dk Df Tg Tg C (TMA) C (TMA) Construction Slash Sheet Miscellaneous: Isola FR406BC 170 300 3.51 @ 1 GHz 0.02 @ 1 GHz 14 140 10 min. >2 min. "Buried Capacitance" /24 3.48 @ 2 GHz 0.021 @ 2 GHz 2 mil dielectric 3.44 @ 5-10 GHZ 0.022 @ 5-10 GHz Nelco N4000-x BC "Buried Capacitance" /24, /26 Each of the Nelco N4000 "Type" offers a 2 mil dielectric. Material properties are similar to that "Type". Dupont Interra HK 04 3.5 @ 1 MHz 0.003 @ 1 MHz 25 (Pre Tg) Embedded Capacitance. Polyimide dielectric. Dielectric thickness: 25 µm. Copper Thickness: 18 µm, 36 µm, 72 µm. Ticer Technologies TCR Thin Film Resistor Foil "Embedded Resistors" - NiCr resistive material. Available in 0.5 oz. and 1 oz. copper tickness. Sheet resistance: 25, 50, 100 Ω/sq., Sheet resistivity tolerance ± 5%. Can be matched to most resin systems listed above. Notes: SPC = Split Post Cavity Information listed is from manufacturer’s Data Sheet. Please contact laminate supplier directly to discuss your particular application. Isola: http://www.isola-group.com Nelco: http://www.parkelectro.com Rogers: http://www.rogerscorp.com DuPont: http://www2.dupont.com/Interra Panasonic: http://panasonic-denko.cp.jp/em/pcbm/en/product Ticer: http://www.ticertechnologies.com
  9. 9. File Transfer Instructions Preferred data formats: Gerber (274 or 274X) or Valor ODB++, drill files should be in ASCII format, fabrication drawings as Gerber, HPGL, HPGL2 or AutoCAD DXF / DWG files. An IPC D-356 netlist is highly recommended for crosscheck against Gerber files and for electrical testing. Data files and drawings should be compressed together into either ZIP (WinZip) or TGZ (UNIX) files to reduce file size and speed up the file transfer process Alternative data types or compression schemes may be acceptable by agreement. EMAIL Attach your files to an email and send to data@mei4pcbs.com . Attached flies should be no larger than 15 MB (15,000 KB) although we have the capacity to accept up to 50 MB files. Please keep in mind that your own email server may be a limiting factor in your ability to send large file attachments. FTP Using FTP client software (such as WS-FTP) you can send files via FTP with no file size limits. FTP hostname: ftp.mei4pcbs.com IP address is 65.170.125.60 username: mei/marcel <------all lower case exactly as shown, using forward slash ( / ) password: mei4qta <-------all lower case exactly as shown Upload your files to INCOMING directory (directory name is not case sensitive). Also, be sure to use PASSIVE mode for compatibility with our firewall. If using WS-FTP this setting is found on the “Properties” page under “Advanced” tab. Please contact our Customer Service Department by phone (714) 974-8590 if you prefer to have your own FTP username, password and directory or if you experience any problems with the transfer..
  10. 10. Environmental Consciousness MEI Wins Southern California Facility of the Year Award
  11. 11. Vince Beusan Account Manager MEI Inc. 130 W. Bristol Lane Orange, California 92865 Thank You! Tel. 714-974-8590 vbeusan@mei4pcbs.com
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