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ARM Based Microcontrollers by Renesas: Roadmap

ARM Based Microcontrollers by Renesas: Roadmap

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    1 c02b ritesh_mcu_roadmap_v1.31 1 c02b ritesh_mcu_roadmap_v1.31 Presentation Transcript

    • Microcontroller Technologies forSmart SocietyRitesh Tyagi, Sr. Director MCU MarketingClass ID: 1C02BRenesas Electronics America Inc.© 2012 Renesas Electronics America Inc. All rights reserved.
    • Mr. Ritesh Tyagi  Sr. Director – Microcontroller Product Marketing  Product Marketing and Segment Marketing  Responsibilities for 8, 16 and 32-bit MCU families  MSEE and MBA from University of Allahabad, India  More than 15 years of experience in MCU/MPU products and applications  MCU product definition and marketing launch  Solution development for key segments like consumer, Medical industrial and communication  Design experience for consumer electronics2 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Renesas Technology & Solution Portfolio3 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Smart Society ParadigmFrom sporadic to CONTINUOUS Energy is limitedmeasurementINFORMATION “Soon the amount of data in the world willOVERLOADis an opportunity for QUADRUPLE every day” -IBMPATTERNRECOGNITION More THINGS connected toPRIVACY is the new the internet than PEOPLEATOMIC BOMB REALTIME is the new PRIME TIME Source: The conversation prism by Brian Solis & LESS3 4 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Data is the Key  “Between now and 2020, the amount of digital information created and replicated in the world will grow to an almost inconceivable 35 trillion gigabytes, as all major forms of media -voice, TV, radio, print -complete the journey from analog to digital… This explosive growth means that by 2020, our Digital Universe will be 44 times as big as it was in 2009.” -IDC data is the NEW OIL5 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Trends of CPU Performance MIPS 1000 Dual-core 200MHz 100 80MHz 40MHz 10 25MHz 32-bit 16MHz 1 10MHz 8-bit 16/32-bit 0.1 2MHz 16-bit 0.01 1980 1990 2000 2010 Year6 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Trends of Embedded Memory Capacity MB 10 1 x8 x8 0.1 x8 0.01 Year 1980 1990 2000 20107 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Agenda  Renesas’ innovative Microcontroller Technologies  Process technology  Architecture (Performance and Power consumption)  Innovative integration  Summary & Q/A By the end of this session you will be able to:  Understand the Renesas’ microcontroller technologies and solutions driving the smart society concept8 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Embedded Flash Technology Roadmap Memory Structure 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 Tech. Max. read NOR freq. (Split-gate) NOR 40MHz Low power op. ES MP 130nm Low voltage 130nm NOR 50MHz Unified flash MONOS* RC03F (RV40F) for RH850 & (Former Renesas Tech.) RX600 MONOS 100MHz MONOS 90nm 120MHz UX6LF (Former NECEL) 40nm MONOS 100MHz Large capacity * MONOS: 90nm High speed Metal Oxide Nitride Oxide Silicon Renesas MCUs are the first with 40 nm embedded flash!9 © 2012 Renesas Electronics America Inc. All rights reserved.
    • World First 40nm Flash MCU Transistor / mm2 320MHz CPU 120MHz Flash 40nm ~ 8MByte Lowest power consumption 55nm Other Option A 65nm Other Option B 90nm Previous generation 100 80 60 40 Technology node Leading Flash Process for Next Generation Automotive & Industrial10 © 2012 Renesas Electronics America Inc. All rights reserved.
    • No. 1 MCU Supplier in the World  Firmly maintained the world’s No.1 MCU market share of 27% in CY2011  Dominant position in automotive MCU unchanged with the world’s No.1 share M US$CY2011 WW Automotive WW MCU #1General- MCU #1purpose 27% share MCU * 42% share 2,147  8-bit MCU #1: 17% share  Deepened relationships with  16-bit MCU #1: 27% share carmakers  32-bit MCU #1: 38% share  Collaborating in BCPAuto- 454motive 2,150 740 MCU 764 512 1,055 1,052 783 431 782 574 506 233 150 61 369 16 274 6 Renesas Freescale Infineon Atmel STMicro Microchip TI Infineon STMicro TI Samsung Fujitsu Fujitsu NXP*General-purpose MCU: MCUs for applications excluding automobiles Source: IHS iSuppli, Annual 2011 Semiconductor Market Share11 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Microcontroller and Microprocessor Line-up 2010 2012 1200 DMIPS, Superscalar  Automotive & Industrial, 65nm 1200 DMIPS, Performance  600µA/MHz, 1.5µA standby  Automotive, 40nm  500µA/MHz, 35µA deep standby 500 DMIPS, Low Power32-bit  Automotive & Industrial, 90nm  600µA/MHz, 1.5µA standby 165 DMIPS, FPU, DSC 165 DMIPS, FPU, DSC  Industrial, 90nm  Industrial, 40nm  500µA/MHz, 1.6µA deep standby  200µA/MHz, 0.3µA deep standby 25 DMIPS, Low Power  Industrial & Automotive, 150nm8/16-bit  190µA/MHz, 0.3µA standby 44 DMIPS, True Low Power  Industrial & Automotive, 130nm 10 DMIPS, Capacitive Touch  144µA/MHz, 0.2µA standby WideIndustrial &LCDs  Format Automotive, 130nm  350µA/MHz, 1µA standby12 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Microcontroller and Microprocessor Line-up 2010 2012 1200 DMIPS, Superscalar  Automotive & Industrial, 65nm 1200 DMIPS, Performance  600µA/MHz, 1.5µA standby  Automotive, 40nm  500µA/MHz, 35µA deep standby 500 DMIPS, Low Power High Performance, 32-Bit32-bit High Scalability & High Reliability  Automotive & Industrial, 90nm  600µA/MHz, 1.5µA standby 165 DMIPS, FPU, DSC 165 DMIPS, FPU, DSC  Industrial, 90nm  Industrial, 40nm  500µA/MHz, 1.6µA deep standby  200µA/MHz, 0.3µA deep standby 25 DMIPS, Low Power  Industrial & Automotive, 150nm8/16-bit  190µA/MHz, 0.3µA standby 44 DMIPS, True Low Power  Industrial & Automotive, 130nm 10 DMIPS, Capacitive Touch  144µA/MHz, 0.2µA standby WideIndustrial &LCDs  Format Automotive, 130nm  350µA/MHz, 1µA standby13 © 2012 Renesas Electronics America Inc. All rights reserved.
    • High-end, 32-bit CPU Roadmap Succession of “V850 and SH” Architecture High Performance and Low power G3M +FPU(IEEE754-2008) +Branch prediction, +SIMD, +Multi-Core V850E2M +MPU V850E2R +FPU V850E2 * 7-Stage * dual-issue Good Performance and V850E1 Low Power SH2A * 5-stage G3K * 5-stage E2S SH2 * 5-stage SH114 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RH850 Architecture (Example CPU Core and Pipeline) Example RH850 CPU 96 MHz CPU Core 2.x 5-STAGE PIPELINE DMIPS/MHz Flash Memory TICK TICK TICK TICK TICK TICK TICK TICK TICK Memory F D E M W F D E M Protect Unit Q Q F D E M W F D E u u 128 bit path 32x 32bit Instruction F D E M W F D e e Inst General Purpose F D E M W F 1 2 Registers 32bit Capable Floating F D E M W to Flash Point Unit 120MHz (Optional) Achieves : One Clock-Per-Instruction (CPI) 32x32 +64 MAC, 64b Result HARVARD ARCHITECTURE SRAM 32 x 32 DIV or MULT, 32bit or 64bit Result 39 bit path Operand Data Interrupt On-Chip (Data) Control Debug 5 STAGES OF PIPELINE F = FETCH INSTRUCTION D = DECODE INSTRUCTION E = EXECUTE INSTRUCTION M = READ OR WRITE MEMORY W = WRITE BACK TO REGISTER15 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RH850 Architecture… System Interface RH850 MCU 128b PIPELINE Buffer 64 bits instruction 128b INST RH850 BUFFER 32b DATA 32 bits Bus Master SRAM, Flash Memory, 120MHz Access 120MHz Access Internal Main Bus 1/ System interconnect 32 bits Bus Bus DMAC Bridge Bridge (bus master) Peripheral Busses to Spread Bandwidth Loading System Control (DMA, E2P, ICU, LVD, Communication Timers RTC, WDG, CLKS) (CSI, CAN, SCI,LIN, I2C, (TAUA, TAU J, OST, Analog GPIO Flex Ray) CMT)16 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RH850: 40nm MCU Series for Vehicle Control High Mid Low 320MHz 240MHz Powertrain Dual core w/ Dual core w/LS 160MHz Single core w/LS Lockstep I/O CPU I/O processor High 240MHz 240MHz EV/HEV Dual core w/ LS Single core w/ LS Reliability Platform 240MHz 160MHz Chassis & Dual core w/ LS 240MHz Single Core Safety x2 Single core w/ LS 120/160MHz 80MHz Air Bag 240MHz Single core Single Core Single core w/ LS Low Power Low Power 120MHz 120MHz 80MHz Body Multi Core Single Core Single Core Low Power Low Cyclic Power Low Power Low Power Platform17 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RH850/F1x Line-up RH850/F1U Triple-Core 160MHz 8MB RH850/F1H Dual Core 120MHz 6MB 4MB RH850/F1M 3MB Single core 120MHz 2MB RH850/F1L 1.5MB Single core 80MHz 1MB 768KB 512KB 384KB 256KB 48 64 80 100 144 176 208 272 357 QFP BGA18 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Microcontroller and Microprocessor Line-up 2010 2012 1200 DMIPS, Superscalar  Automotive & Industrial, 65nm 1200 DMIPS, Performance  600µA/MHz, 1.5µA standby  Automotive, 40nm  500µA/MHz, 35µA deep standby 500 DMIPS, Low Power32-bit  Automotive32-Bit High Performance & Industrial, 90nm 32-Bit High Efficiency  600µA/MHz, 1.5µA standbywith High DSP, FPU Ultra Low Power and Low Integration Voltage 165 DMIPS, FPU, DSC 165 DMIPS, FPU, DSC  Industrial, 90nm  Industrial, 40nm  200µA/MHz, 0.3µA standby  200µA/MHz, 0.3µA standby 25 DMIPS, Low Power  Industrial & Automotive, 150nm8/16-bit  190µA/MHz, 0.3µA standby 44 DMIPS, True Low Power  Industrial & Automotive, 130nm 10 DMIPS, Capacitive Touch  144µA/MHz, 0.2µA standby WideIndustrial &LCDs  Format Automotive, 130nm  350µA/MHz, 1µA standby19 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RX Architecture… CPU Core and Pipeline RX600 CISC CPU 5-STAGE PIPELINE PRE-FETCH 100MHz CPU Core QUEUE Typically 1.65 DMIPS/MHz TICK TICK TICK TICK TICK TICK TICK TICK TICK (PFQ) Flash Memory 9 x 32bit Memory Control Protect F D E M W F D E M Registers Unit F D E M W F D E E 64 64bit path Inst Instruction F D E M W F D 64bits 64bits 64bits 64bits 16 x 32bit 32bit F D E M W F E RX Flash is General Floating F D E M W 10 nsec, or Purpose Point 100 MHz Holds 4 to 32 zero-wait Registers Unit Instructions Achieves One for Slower Clock-Per-Instruction (CPI) Memory Memory Interface 16x16 or 32x32 MAC, 48bit or 80bit Result ENHANCED HARVARD ENHANCED HARVARD RX SRAM is WRITE BUFFER 32 x 32 DIV or MULT, ARCHITECTURE ARCHITECTURE also 10 nsec 32bit or 64bit Result 32bit path Buffer 32 Operand Only for Data Interrupt On-Chip (Data) Writes Control Debug For Slow Memory Typically 5 STAGES OF PIPELINE SRAM F = FETCH INSTRUCTION D = DECODE INSTRUCTION E = EXECUTE INSTRUCTION M = READ OR WRITE MEMORY W = WRITE BACK TO REGISTER20 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Advanced Bus Architecture for High Data Throughput21 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RX vs. M4: Performance, Power & Peripherals22 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RX vs. M4: Performance, Power & Peripherals23 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RX600 Series: High Performance Roadmap 100 MHz, Single Cycle Flash Up to 120 MHz 90 nm Process 40 nm Process24 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RX200 Series: Low Power Roadmap RX210 RX210 RX210 ELC Comparator ELC Comparator ELC Comparator 50MHz 50MHz 50MHz 128BK-512KB 64KB- 256KB 1MB RX220 RX211 ELC Comparator ELC Comparator 32MHz 50MHz 256KB USB RX211 AES 24 bit ADC 50MHz 512KB25 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RX: Scalable Lineup26 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Next Generation RX27 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RX CPU Architecture Roadmap • High Performance Higher • Low Power Performance/MHz • Small Code Size 4.0 Coremark/MHz 400MHz~ RX-v2 (240MHz~) Next RX64x RX-v1 3.30 Coremark/MHz (200MHz~) 0.78 Automark/MHz Smaller gate count Smaller code size RX600, 2.76 Coremark/MHz RX200, RX100 0.68 Automark/MHz 2009 2012 201528 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RX Family Roadmap: Next Generation RX700 240MHz RX600 100/120MHz RX200 Up to 8MB 50MHz Dual Ethernet, Up to 4MB DSP, LCD DSC, FPU, RX100 Connectivity 32MHz Low power, Up to 1MB Flash, 1.62 to 5.5v, 24-bit ADC, Security Lowest Power 32-bit platform in the Industry29 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Industry Leading Low Power 32-bit Platform 32-bit 8/16-bit 32-bit Performance  <1$ price point Integration  Lowest Power Eco-System  Fast wake up Higher power consumption  Analog integration  Scalability RX-L (32-bit)  1.56 DMIPS/MHz performance  155uA/DMIPS in active & 0.1uA in standby  <$1 price point  RX scalability  Similar eco-system30 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RX-L: Lowest Power 32-bit Family Best in class Performance Best in class Power efficiencyRX-L 1.56DMIPS/MHz RX-L 155µA/DMIPS Cortex M4 1.25DMIPS/MHz Company B Cortex M0 200µA/DMIPS Cortex M3 1.25DMIPS/MHz Company A Cortex M3 300µA/DMIPS Cortex M0 0.9DMIPS/MHz31 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RX100: Unique Differentiators Lowest Power 32-bit • Lowest DC off set, lowest power at 1 MHz, faster wake up (<5us), MCU <155uA/DMIPS active, 0.1uA standby • 8KB to 2MB Flash memory, Smaller 3x3mm QFN/WPP package Memory & Package for space critical applications Innovative integration • ELC, Asynchronous Timers to reduce power consumption Safety features • IEC60730 are critical for medical and Industrial • PMC to offer maximum number of I/O, Semi- programmability of Flexibility of layout I/Os and reduction of external noise circuitry Bridge between Digital • 12-bit, 24-bit A/Ds, 10-bit D/As, Op-Amps, Comparators, Temp and Analog world sense, Capacitive touch etc.32 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RX700: 40nm, 240MHz Industrial Applications High Performance • 120MHz/240Mhz operation with 120MHz single cycle Flash • 4MB Flash, 512KB RAM, IEE1588 Dual Ethernet, Trusted Innovative Integration ELC, 2MSPS ADC, Data Capture Unit, SDIO, MMC etc. Safety Features • IEC60730, AES security, CRC, DOC , CSD etc. • PMC to offer maximum number of I/O, Semi-programmability Flexibility of layout of I/Os and reduction of external noise circuitry, Event Link Controller Flexible package size • 64 pin to 256 pin package variants Bridge between digital • 12-bit, 24-bit A/Ds, 10-bit D/As, Op-Amps, Comparators, and Analog world Temp sense, etc.33 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Microcontroller and Microprocessor Line-up 2010 2012 1200 DMIPS, Superscalar  Automotive & Industrial, 65nm 1200 DMIPS, Performance  600µA/MHz, 1.5µA standby  Automotive, 40nm  500µA/MHz, 35µA deep standby 500 DMIPS, Low Power32-bit 8/16-Bit True Low Power  Automotive & Industrial, 90nm High Efficiency & Integration  600µA/MHz, 1.5µA standby 165 DMIPS, FPU, DSC 165 DMIPS, FPU, DSC  Industrial, 90nm  Industrial, 40nm  200µA/MHz, 0.3µA standby  200µA/MHz, 0.3µA standby 25 DMIPS, Low Power  Industrial & Automotive, 150nm8/16-bit  190µA/MHz, 0.3µA standby 44 DMIPS, True Low Power  Industrial & Automotive, 130nm 10 DMIPS, Capacitive Touch  144µA/MHz, 0.2µA standby WideIndustrial &LCDs  Format Automotive, 130nm  350µA/MHz, 1µA standby34 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Low-end CPU Core Roadmap  RL78 Renesas New Low end core performs up to 40.6DMIPS  RL78/G14 core hits 44DMIPS with DSP instructions RL78 Architecture R8C Architecture RL78/G14 core RL78 16bit, 44DMIPS 16bit, 40.6DMIPS MAC/MUL/DIV R8C instructions 10 DMIPS Compact 78K Architecture 78K0R Renesas New Low 16bit, 31.2DMIPS end core 78K0 8bit, 2.9DMIPS 78K0S 8bit,1.1DMIPS35 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RL78 CPU Core Register Banks 0-3: 16-bit (Register Pair) Internal Buses Bank 3 Addr./ Data Bus Bank 2 System Bus Bank 1 ES Interface Address Bus MUL/MAC /DIV. ALU Bank 0 CS Control Signals 16-Bit PC PSW Bit SP Interrupt Barrel Controller Shifter RL78/G14 only36 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RL78 CPU Low Power Technique Automatically Adjusted Decode + Address operation MEM operation + Write 3-stage pipe line Fetch ID MEM Decoder Current reduction! Instruction Operator Address Operator Data Ex) ADD A, [HL] - Instruction : 1byte - Address Operation : HL 25% 50% - Data Operation : ADD Fetch Add 1st- BR$ Write Byte Bit Selected HL “Path” +Byte Mul 2nd- Byte RAM Decoder Operator … 66uA/MHz at basic operation (NOP) Judge 1 or 2 2nd-byte decoder turned on, Only the operator which will instruction only when the instruction is be used in a instruction will bytes judged as 2 bytes instruction be turned on.37 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Flash Operation Modes  Flash modes realize an optimal power consumption MCU current  HS (High-speed) mode: 30% down  32MHz (VDD = 2.7 to 5.5V) 1.7mA 1.7mA 40% down  16MHz (VDD = 2.4 to 5.5V) 1.2mA 1.3mA 1.2mA  2.1V (Active, Halt) & 1.8V(STOP) 0.8mA regulator HS LS HS LS LV  LS (Low-speed) mode: 8MHz 8MHz 4MHz 4MHz 4MHz  8MHz (VDD = 1.8 to 5.5V)  1.8V regulator Regulator System VDD RL78  LV (Low-voltage) mode: Reg  4MHz (VDD = 1.6 to 5.5V) I/O  1.8V regulator Etc. CPU, Peripherals VSS38 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Active Current Advantage to Competition Typ. Value Max. Value 12 12 RL78/G13 (VDD=2.0V/3.0V/5.0V) RL78/G13 10 10 RL78/G13 (Basic (VDD=2.0V/3.0V/5.0V) Competition Power Consumption [mA] Power Consumption [mA] Competition Operation) A MCU-1 (VDD=3.6V) A MCU-1 (VDD=3.6V) 8 8 A MCU-1 (VDD=3V) A MCU-1 (VDD=3V) 6 6 A MCU-1 (VDD=2.2V) A MCU-1 (VDD=2.2V) A MCU-2 (VDD=3.0V) 4 4 A MCU-2 (VDD=3.0V) A MCU-3 (VDD=3.0V) A MCU-3 (VDD=3.0V) RL78 2 RL78 2 A MCU-3 (VDD=2.2V) A MCU-3 (VDD=2.2V) 0 0 0 10 20 30 0 10 20 30 Operation Frequency [MHz] Operation Frequency [MHz]39 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Fast Wake-up is Good, but doesn’t Always Have an Effect  Fast wake-up is critical when active time is <30uS - Assuming current consumption during wake up is the same as during the Active - Active mode: 8MHz, 3V 42 72 150 Better mAusec mAusec mAusec 1.2mA RL78 25usec 22 72 204 No good mAusec mAusec mAusec 2.0mA A MCU-3 1usec Wake up time Active Time 10usec 30usec 35usec 100usec 100usec Condition Real Application functions Simple Monitoring - Glass Break detector :35usec - Smock detector : 400usec - Simple Status check - Health care applications : msec to sec (1 ADC, Port check etc.) - Remote controller : 100msec - Increment Standard Timer for - UART 1 byte @ 9600bps = 1.04 msec Real Time - EEPROM storage ; msec order40 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RL78: Roadmap F12 (Auto Body) Metering ASSP D1x (Auto Dashboard) RF4CEProduct Category I1A (Lighting) L1x SEG LCD (USB, Enhanced Analog) L1x L12 (LCD Standard) (High Function) 32-64 pin, 8-32 KB GENERAL G14 (High Function) 30-100 pin, 16-256 KB Capacitive Touch G13 (Standard) 20-128 pin, 16-512 KB G1A (Enhanced Analog) G1x 25-64 pin, 16-64 KB (USB) G12 (Lite) 20-30 pin, 2-16 KB G1x (Entry) Sub 20 pins Schedule is preliminary and subject to change ~ CY 2012 CY 2013~ 41 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Scalability: RL78 Line-up (Over 300 products from 2KB to 512KB of flash memory)42 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RL78: Next Generation Concept43 © 2012 Renesas Electronics America Inc. All rights reserved.
    • SMART15 Concept Smart Smart SMART Power Analog Integration Intelligent connection Asynchronous SMART Data between Analog- Architecture Transfer Controller to-Analog & Analog-to-Digital) SMART SMART Snooze (in 16/24-bit ADC & integration: combination with 12-bit DAC RF, Touch, Eink more peripherals) Display, BAN Intelligent-Wake- up (Quick wake- Fast Comp, Super SAFE: up + lowest Op-Amps DOC, CAC, MPU current)44 © 2012 Renesas Electronics America Inc. All rights reserved.
    • RL78/SMART15: Roadmap Concept Next Generation Process 130um process Remote WCPApplication Lighting Specific ASSP Meter sub Ghz RL78 HMI Core GP with LCD GP-Next G15 (20-100 pin) W/ Touch W/LCD G12 G13GeneralPurpose G14 GP-L next G10 10-20-pin 45 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Summary What should engineers care about?46 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Questions?47 © 2012 Renesas Electronics America Inc. All rights reserved.
    • ‘Enabling The Smart Society’  Challenge: Digital revolution is fuelling the exponential demand to manage the society more smarter and in a eco friendly way.  Solution:  In order to address the complex requirements of the Smart Society a scalable microcontroller portfolio which is supported by a rich eco system would be the most important selection criteria.48 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Please Provide Your Feedback…  Please utilize the ‘Guidebook’ application to leave feedback or  Ask me for the paper feedback form for you to use…49 © 2012 Renesas Electronics America Inc. All rights reserved.
    • Renesas Electronics America Inc.© 2012 Renesas Electronics America Inc. All rights reserved.