Spansion GL-S NOR Flash Memory

Spansion®GL-S NOR Flash Memory
Breakthrough Performance for Embedded Applications

Spansion® GL-S Family
Spansion® GL-S Family– The Highest Performance Solutions to Enable and Expand the Possibilities!
Spansion® GL-S Family

Spansion® GL-S Delivers Breakthrough Performance for Embedded Applications
45% Faster Read for Fast Data Access, Interactivity & Boot Times
Key Features:
128Mb – 2Gb
65nm MirrorBit Charge-Trapping Technology
45% faster read performance
40% smaller BGA package
Industry-standard TSOP package
Wide temperature ranges
Industrial (-40C to +85C)
Automotive in-cabin planned(-40C to +105C)
Complementary drivers & Flash file system
Substantial Innovation for:
Automotive
Consumer Electronics
Gaming
Set-top box
Telecommunications & Networking
Note: Comparisons based on published datasheet specifications.

Improved System Performance With Faster Page Read
45% Faster Throughput vs. Competitive Solutions
Up to 98.5 MB/s
Fast System Boot-up
Up to 67.4 MB/s
Faster inter-page access (15ns vs. 25ns)
Spansion®GL-S
Numonyx
M29EW

New Features Enhance System Performance
SystemSecurity
System Effectiveness
16 Word Page Read Buffer
256 Word Write Buffer
1.2 MB/s Program
655 KB/s Erase
15ns Page Access
Sector Read Protection
1024B Secured Silicon Sector (OTP)

2Gb
32 Mb
64 Mb
128 Mb
256 Mb
512 Mb
1 Gb
16 Mb
8 Mb
48-ball FBGA(0.8 mm pitch)
S29AL032D
S29GL032N
S29JL032J
S29PL032J
S29AL008J
S29AL016J
S29GL064N
S29JL064J
S29PL064J
64-ball Fortified BGA
(1 mm pitch)
S29GL01GP
S29GL064N
S29GL032N
S29GL128P
S29GL256P
S29GL512P
S29AL016J
S29GL01GS
S29GL02GS
S29GL128S
S29GL256S
S29GL512S
48-pin TSOP
S29AL032D
S29GL032N
S29JL032J
S29AL008J
S29AL016J
S29GL064N
S29JL064J
56-pin TSOP
S29GL01GP
S29PL127J
S29GL128P
S29GL256P
S29GL512P
S29GL064N
S29GL032N
S29GL512S
S29GL01GS
S29GL256S
k
S29GL128S
Spansion Universal Footprint for Backwards Compatibility
Consistent Pinouts Across Densities and Product Families

NEW
110nm & 90nm
65nm
13 x 11mm
9 x 9 mm
Smaller
Physical Size
7 x 7 mm
7 x 7 mm
No change
Ball Matrix / Pinout
1.0 mm
1.0 mm
No change
Ball Pitch
0.6 mm
0.6 mm
No change
Ball Diameter
1.4 mm (max)
1.4 mm (max)
No change
Package Height
Universal Footprint in a Smaller BGA Package

Trademark Attribution
Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse™, and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.
This document is for informational purposes only and subject to change without notice. Spansion does not represent that it is complete, accurate or up-to-date; it is provided “AS IS.” To the maximum extent permitted by law, Spansion disclaims any liability for loss or damages arising from use of or reliance on this document.

Spansion GL-S NOR Flash Memory

by Spansion on May 16, 2011

Accessibility

Categories

Tags

Upload Details

Usage Rights

Statistics

Spansion GL-S NOR Flash Memory — Presentation Transcript