PLM Connection: KHBO on Camera Heat Removal Project

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    PLM Connection: KHBO on Camera Heat Removal Project - Presentation Transcript

    1. Dr. F. Desplentere [email_address] Heat removal within camera and software linking demo
      • Introduction
      • Case study: Traffic control camera
      • Case study: Mould temperature calculation for thermoforming
      • Conclusions
      Overview
      • History
        • 1995: fusion of 5 former independent colleges
        • 2002: associated with Catholic University of Leuven
      • Locations
        • Bruges
        • Ostend
      KHBO
    2. KHBO faculties
    3. Campus Ostend
      • Professional bachelor
        • Chemics
        • Electronics
        • Mechanics
        • Aviation
      • Academic bachelor
        • Civil engineering
        • Electronics
        • Mechanics
      • Master courses
        • Civil engineering
        • Electronics
        • Elektro technics
        • Elektro mechanics
        • Polymer technology
    4. Mechanical department
      • 3-fold mission
        • Education
        • Service for SME’s
        • Scientific research
      • Overview of research fields
        • Dynamic behavior of mechanical structures
        • Polymer processing
        • Avionics
      • Different types of research
        • Theoretical approach
        • Material characterization
        • Computer simulations
        • Experiments
    5. Software overview
      • General finite element package
        • NX 6
      • Polymer processing
        • Autodesk Moldflow : Injection moulding
        • VEL 6.3 : Extrusion
        • T-sim 4.7: Thermoforming
      • Traffic control camera
      First case study
    6. First case study
      • Housing: Influence of different materials
        • PA + PC
        • ALU
        • ≠ coatings
      • All weather conditions
        • Closed volume for air and humidity
        • Extreme temperatures
        • Solar heating
      • Internal heat generation on 2 PCB’s
        • 3.7 Watt
      • Maximum allowed temperature on PCB’s = 100°C
        • Radiation has to be taken into account
        • Steady state conditions
    7. Camera: model
      • Mesh on solids and air+ assigning material
    8. Camera: Situation 1
      • Simulation 1 = lab-conditions
      • Ambient conditions=22°C Outside convection: 20W/m²K
      • Heat generated on PCB: 3.7 Watt
      • No solar heating
    9. Camera: Situation 1
      • Without taking into account radiation
      • Maximum temperature: 91°C
      • Maximum air temperature: 64°C
    10. Camera: Comparison
      • Ambient temperature: 22°C
      • Internal heat generation 3.7W
      • Measurements for temperature with NTC’s in the internal air
      • Simulation Experiment
      NOT OK 60°C  46°C 55°C  48°C 40°C  45°C
    11. Camera: Convection
      • Calculated Internal natural convection coefficients: reasonable level
    12. Camera: with radiation
      • Taking into account radiation: first assumption black body
      • Maximum temperature: 63°C
      • Maximum air temperature: 50°C
      • Maximum air speed 7 cm/s
      63°C 50°C 7cm/s
    13. Camera: Comparison
      • Ambient temperature: 22°C
      • Internal heat generation 3.7W
      • Measurements for temperature with NTC’s in the internal air
      • Simulation Experiment
      48°C  46°C 52°C  48°C 39°C  45°C OK
    14. Camera: Solar Heating
      • Possible heat load in NX Thermal/flow : solar heating
        • Function of day number (angle of the sun)
        • Function of location on the earth
        • Function of time (turning of the earth)
      • June at zenith: maximum flux 1415 W/m², ambient 40°C
      85°C 73°C
    15. Camera: Material properties
      • Influence of radiation parameters
        • Outer shells 100% thermal transparant
      97°C 64°C
    16. Camera: Material properties
      • Influence of radiation parameters
        • Outer shells 100% thermal reflecting
      74C 57C
    17. Second case study
      • Software linking result: T-SIM - NX-Thermal – I-deas NX 5
        • Prediction of spatial temperature distribution for thermoforming mould
        • Cooling behavior of thermoformed product
      • Problem description
        • T-sim ® does not perform heat transfer calculation for the mould
        • Influence of cooling line geometry
        • Product thickness is not known in advance
        • General rules are not valid for thermoforming as for in injection molding
    18. Thermoforming process
    19. T-sim ® software
      • Sheet representation
        • New sheet
        • Open sheet
          • Preblown sheet
          • Sheet sag (gravimetric deformation)
    20. T-sim ® software
      • Thermoforming tools
        • New tool
          • Different formats
        • Open tool
    21. T-sim ® software
      • Process parameters: pressure, positions
        • New process control
        • Open process control
    22. T-sim ® software
      • Material data
        • New material data
        • Open material data
    23. T-sim ® software
      • Heat and friction
        • New Heat and friction
        • Open Heat and friction
      One temperature for one tool!
    24. T-sim ® software
      • Project definition: selection of different files
        • New Project
        • Open Project
    25. T-sim ® software
      • Results
        • Thickness distribution
        • Temperature distribution
        • Stress distribution
        • Elongation distribution
    26. Case study
      • Temperature within thermoforming mould
        • PP sheet: 0.5 mm thickness, Process temperature 160°C
        • Serial cooling water flow 13 l/min, 13°C inlet value, Estimated mould temperature = 40°C
        • Cycle time = 2 sec, t form = 0.5 sec, forming pressure 5 bar
    27. T-sim simulation
    28. T-sim results Thickness Temperature
      • Short cycle time  ± steady state
      • Discontinue process  continuous
        • Cooling of sheet : Transformation into power
        • Need for Temperature and thickness distribution
      • Realized through own developed program (Borland C++)
      Mould temperature
      • Export of T-sim data (ASCII format)
        • Nodes, elements, thicknesses, temperatures
      • Subdivision into 100 thickness intervals
        • Necessary for the creation of physical properties within I-deas
      • For each element: calculation of power
        • Determination of element surface
        • Heat transported to mold (temperature assumed to be constant)
          • For each time step within cycle time:
            • Amount of heat transported
            • Cooling down of element
      Procedure Local HTC Mould thickness Hot sheet cold mould
      • Use of Universal file format (ASCII format)
        • Export node and element data
        • 100 Physical properties
        • 100 Power groups
      Thermal Model
      • Heat flux field
      Boundary condition
      • Thermal modeling of mould : assembly mesh
        • Imported mesh + boundary conditions
        • Thermal model built for mould in Ideas-TMG
        • Steady state modeling
      Complete mould
      • Contact surface temperature (average temperature)
      Temperature result Weighted average = 64.5°C Weighted standard deviation = 5°C
      • Complete model (average temperature)
      Temperature result
      • Complete model (average temperature)
      Coolant temperature Good fit with measured outlet temperature: 24.8°C  25.1°C
      • Building of new model
        • Transient model
        • Contact surface temperature  Boundary condition
        • Temperature result T-sim  Initial temperature for sheet
        • Thermal coupling between two “surface” meshes
      Real cooling behavior
    29. Cooling behavior Good prediction of hot spots in thermoformed part
      • Sheet cooling as function of time
    30. Conclusions
      • Combinations of programs allow to obtain more realistic data for average mould temperatures
        • Guessing the average mould temperature for T-sim = past
      • Optimisation tool for cooling line geometry is developed
      • Future work: - Transient mould temperature prediction - Warpage of thermoformed products
    31. October 2009
    SlideShare Zeitgeist 2009

    + Siemens PLM SoftwareSiemens PLM Software Nominate

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