PLM Connection: KHBO on Camera Heat Removal Project

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Frederick Desplentere of KHBO presented at Siemens PLM Connection on the use of our simulation and analysis software for determining heat issues and removal. See www.siemens.com/plm/blog for related blog post and more event coverage.

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PLM Connection: KHBO on Camera Heat Removal Project

  1. 1. Dr. F. Desplentere [email_address] Heat removal within camera and software linking demo
  2. 2. <ul><li>Introduction </li></ul><ul><li>Case study: Traffic control camera </li></ul><ul><li>Case study: Mould temperature calculation for thermoforming </li></ul><ul><li>Conclusions </li></ul>Overview
  3. 3. <ul><li>History </li></ul><ul><ul><li>1995: fusion of 5 former independent colleges </li></ul></ul><ul><ul><li>2002: associated with Catholic University of Leuven </li></ul></ul><ul><li>Locations </li></ul><ul><ul><li>Bruges </li></ul></ul><ul><ul><li>Ostend </li></ul></ul>KHBO
  4. 4. KHBO faculties
  5. 5. Campus Ostend <ul><li>Professional bachelor </li></ul><ul><ul><li>Chemics </li></ul></ul><ul><ul><li>Electronics </li></ul></ul><ul><ul><li>Mechanics </li></ul></ul><ul><ul><li>Aviation </li></ul></ul><ul><li>Academic bachelor </li></ul><ul><ul><li>Civil engineering </li></ul></ul><ul><ul><li>Electronics </li></ul></ul><ul><ul><li>Mechanics </li></ul></ul><ul><li>Master courses </li></ul><ul><ul><li>Civil engineering </li></ul></ul><ul><ul><li>Electronics </li></ul></ul><ul><ul><li>Elektro technics </li></ul></ul><ul><ul><li>Elektro mechanics </li></ul></ul><ul><ul><li>Polymer technology </li></ul></ul>
  6. 6. Mechanical department <ul><li>3-fold mission </li></ul><ul><ul><li>Education </li></ul></ul><ul><ul><li>Service for SME’s </li></ul></ul><ul><ul><li>Scientific research </li></ul></ul><ul><li>Overview of research fields </li></ul><ul><ul><li>Dynamic behavior of mechanical structures </li></ul></ul><ul><ul><li>Polymer processing </li></ul></ul><ul><ul><li>Avionics </li></ul></ul><ul><li>Different types of research </li></ul><ul><ul><li>Theoretical approach </li></ul></ul><ul><ul><li>Material characterization </li></ul></ul><ul><ul><li>Computer simulations </li></ul></ul><ul><ul><li>Experiments </li></ul></ul><ul><ul><li>… </li></ul></ul>
  7. 7. Software overview <ul><li>General finite element package </li></ul><ul><ul><li>NX 6 </li></ul></ul><ul><li>Polymer processing </li></ul><ul><ul><li>Autodesk Moldflow : Injection moulding </li></ul></ul><ul><ul><li>VEL 6.3 : Extrusion </li></ul></ul><ul><ul><li>T-sim 4.7: Thermoforming </li></ul></ul>
  8. 8. <ul><li>Traffic control camera </li></ul>First case study
  9. 9. First case study <ul><li>Housing: Influence of different materials </li></ul><ul><ul><li>PA + PC </li></ul></ul><ul><ul><li>ALU </li></ul></ul><ul><ul><li>≠ coatings </li></ul></ul><ul><li>All weather conditions </li></ul><ul><ul><li>Closed volume for air and humidity </li></ul></ul><ul><ul><li>Extreme temperatures </li></ul></ul><ul><ul><li>Solar heating </li></ul></ul><ul><li>Internal heat generation on 2 PCB’s </li></ul><ul><ul><li>3.7 Watt </li></ul></ul><ul><li>Maximum allowed temperature on PCB’s = 100°C </li></ul><ul><ul><li>Radiation has to be taken into account </li></ul></ul><ul><ul><li>Steady state conditions </li></ul></ul>
  10. 10. Camera: model <ul><li>Mesh on solids and air+ assigning material </li></ul>
  11. 11. Camera: Situation 1 <ul><li>Simulation 1 = lab-conditions </li></ul><ul><li>Ambient conditions=22°C Outside convection: 20W/m²K </li></ul><ul><li>Heat generated on PCB: 3.7 Watt </li></ul><ul><li>No solar heating </li></ul>
  12. 12. Camera: Situation 1 <ul><li>Without taking into account radiation </li></ul><ul><li>Maximum temperature: 91°C </li></ul><ul><li>Maximum air temperature: 64°C </li></ul>
  13. 13. Camera: Comparison <ul><li>Ambient temperature: 22°C </li></ul><ul><li>Internal heat generation 3.7W </li></ul><ul><li>Measurements for temperature with NTC’s in the internal air </li></ul><ul><li> Simulation Experiment </li></ul>NOT OK 60°C  46°C 55°C  48°C 40°C  45°C
  14. 14. Camera: Convection <ul><li>Calculated Internal natural convection coefficients: reasonable level </li></ul>
  15. 15. Camera: with radiation <ul><li>Taking into account radiation: first assumption black body </li></ul><ul><li>Maximum temperature: 63°C </li></ul><ul><li>Maximum air temperature: 50°C </li></ul><ul><li>Maximum air speed 7 cm/s </li></ul>63°C 50°C 7cm/s
  16. 16. Camera: Comparison <ul><li>Ambient temperature: 22°C </li></ul><ul><li>Internal heat generation 3.7W </li></ul><ul><li>Measurements for temperature with NTC’s in the internal air </li></ul><ul><li> Simulation Experiment </li></ul>48°C  46°C 52°C  48°C 39°C  45°C OK
  17. 17. Camera: Solar Heating <ul><li>Possible heat load in NX Thermal/flow : solar heating </li></ul><ul><ul><li>Function of day number (angle of the sun) </li></ul></ul><ul><ul><li>Function of location on the earth </li></ul></ul><ul><ul><li>Function of time (turning of the earth) </li></ul></ul><ul><li>June at zenith: maximum flux 1415 W/m², ambient 40°C </li></ul>85°C 73°C
  18. 18. Camera: Material properties <ul><li>Influence of radiation parameters </li></ul><ul><ul><li>Outer shells 100% thermal transparant </li></ul></ul>97°C 64°C
  19. 19. Camera: Material properties <ul><li>Influence of radiation parameters </li></ul><ul><ul><li>Outer shells 100% thermal reflecting </li></ul></ul>74C 57C
  20. 20. Second case study <ul><li>Software linking result: T-SIM - NX-Thermal – I-deas NX 5 </li></ul><ul><ul><li>Prediction of spatial temperature distribution for thermoforming mould </li></ul></ul><ul><ul><li>Cooling behavior of thermoformed product </li></ul></ul><ul><li>Problem description </li></ul><ul><ul><li>T-sim ® does not perform heat transfer calculation for the mould </li></ul></ul><ul><ul><li>Influence of cooling line geometry </li></ul></ul><ul><ul><li>Product thickness is not known in advance </li></ul></ul><ul><ul><li>General rules are not valid for thermoforming as for in injection molding </li></ul></ul>
  21. 21. Thermoforming process
  22. 22. T-sim ® software <ul><li>Sheet representation </li></ul><ul><ul><li>New sheet </li></ul></ul><ul><ul><li>Open sheet </li></ul></ul><ul><ul><ul><li>Preblown sheet </li></ul></ul></ul><ul><ul><ul><li>Sheet sag (gravimetric deformation) </li></ul></ul></ul>
  23. 23. T-sim ® software <ul><li>Thermoforming tools </li></ul><ul><ul><li>New tool </li></ul></ul><ul><ul><ul><li>Different formats </li></ul></ul></ul><ul><ul><li>Open tool </li></ul></ul>
  24. 24. T-sim ® software <ul><li>Process parameters: pressure, positions </li></ul><ul><ul><li>New process control </li></ul></ul><ul><ul><li>Open process control </li></ul></ul>
  25. 25. T-sim ® software <ul><li>Material data </li></ul><ul><ul><li>New material data </li></ul></ul><ul><ul><li>Open material data </li></ul></ul>
  26. 26. T-sim ® software <ul><li>Heat and friction </li></ul><ul><ul><li>New Heat and friction </li></ul></ul><ul><ul><li>Open Heat and friction </li></ul></ul>One temperature for one tool!
  27. 27. T-sim ® software <ul><li>Project definition: selection of different files </li></ul><ul><ul><li>New Project </li></ul></ul><ul><ul><li>Open Project </li></ul></ul>
  28. 28. T-sim ® software <ul><li>Results </li></ul><ul><ul><li>Thickness distribution </li></ul></ul><ul><ul><li>Temperature distribution </li></ul></ul><ul><ul><li>Stress distribution </li></ul></ul><ul><ul><li>Elongation distribution </li></ul></ul>
  29. 29. Case study <ul><li>Temperature within thermoforming mould </li></ul><ul><ul><li>PP sheet: 0.5 mm thickness, Process temperature 160°C </li></ul></ul><ul><ul><li>Serial cooling water flow 13 l/min, 13°C inlet value, Estimated mould temperature = 40°C </li></ul></ul><ul><ul><li>Cycle time = 2 sec, t form = 0.5 sec, forming pressure 5 bar </li></ul></ul>
  30. 30. T-sim simulation
  31. 31. T-sim results Thickness Temperature
  32. 32. <ul><li>Short cycle time  ± steady state </li></ul><ul><li>Discontinue process  continuous </li></ul><ul><ul><li>Cooling of sheet : Transformation into power </li></ul></ul><ul><ul><li>Need for Temperature and thickness distribution </li></ul></ul><ul><li>Realized through own developed program (Borland C++) </li></ul>Mould temperature
  33. 33. <ul><li>Export of T-sim data (ASCII format) </li></ul><ul><ul><li>Nodes, elements, thicknesses, temperatures </li></ul></ul><ul><li>Subdivision into 100 thickness intervals </li></ul><ul><ul><li>Necessary for the creation of physical properties within I-deas </li></ul></ul><ul><li>For each element: calculation of power </li></ul><ul><ul><li>Determination of element surface </li></ul></ul><ul><ul><li>Heat transported to mold (temperature assumed to be constant) </li></ul></ul><ul><ul><ul><li>For each time step within cycle time: </li></ul></ul></ul><ul><ul><ul><ul><li>Amount of heat transported </li></ul></ul></ul></ul><ul><ul><ul><ul><li>Cooling down of element </li></ul></ul></ul></ul>Procedure Local HTC Mould thickness Hot sheet cold mould
  34. 34. <ul><li>Use of Universal file format (ASCII format) </li></ul><ul><ul><li>Export node and element data </li></ul></ul><ul><ul><li>100 Physical properties </li></ul></ul><ul><ul><li>100 Power groups </li></ul></ul>Thermal Model
  35. 35. <ul><li>Heat flux field </li></ul>Boundary condition
  36. 36. <ul><li>Thermal modeling of mould : assembly mesh </li></ul><ul><ul><li>Imported mesh + boundary conditions </li></ul></ul><ul><ul><li>Thermal model built for mould in Ideas-TMG </li></ul></ul><ul><ul><li>Steady state modeling </li></ul></ul>Complete mould
  37. 37. <ul><li>Contact surface temperature (average temperature) </li></ul>Temperature result Weighted average = 64.5°C Weighted standard deviation = 5°C
  38. 38. <ul><li>Complete model (average temperature) </li></ul>Temperature result
  39. 39. <ul><li>Complete model (average temperature) </li></ul>Coolant temperature Good fit with measured outlet temperature: 24.8°C  25.1°C
  40. 40. <ul><li>Building of new model </li></ul><ul><ul><li>Transient model </li></ul></ul><ul><ul><li>Contact surface temperature  Boundary condition </li></ul></ul><ul><ul><li>Temperature result T-sim  Initial temperature for sheet </li></ul></ul><ul><ul><li>Thermal coupling between two “surface” meshes </li></ul></ul>Real cooling behavior
  41. 41. Cooling behavior Good prediction of hot spots in thermoformed part <ul><li>Sheet cooling as function of time </li></ul>
  42. 42. Conclusions <ul><li>Combinations of programs allow to obtain more realistic data for average mould temperatures </li></ul><ul><ul><li>Guessing the average mould temperature for T-sim = past </li></ul></ul><ul><li>Optimisation tool for cooling line geometry is developed </li></ul><ul><li>Future work: - Transient mould temperature prediction - Warpage of thermoformed products </li></ul>
  43. 43. October 2009

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