PLM Connection: KHBO on Camera Heat Removal Project


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Frederick Desplentere of KHBO presented at Siemens PLM Connection on the use of our simulation and analysis software for determining heat issues and removal. See for related blog post and more event coverage.

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PLM Connection: KHBO on Camera Heat Removal Project

  1. 1. Dr. F. Desplentere [email_address] Heat removal within camera and software linking demo
  2. 2. <ul><li>Introduction </li></ul><ul><li>Case study: Traffic control camera </li></ul><ul><li>Case study: Mould temperature calculation for thermoforming </li></ul><ul><li>Conclusions </li></ul>Overview
  3. 3. <ul><li>History </li></ul><ul><ul><li>1995: fusion of 5 former independent colleges </li></ul></ul><ul><ul><li>2002: associated with Catholic University of Leuven </li></ul></ul><ul><li>Locations </li></ul><ul><ul><li>Bruges </li></ul></ul><ul><ul><li>Ostend </li></ul></ul>KHBO
  4. 4. KHBO faculties
  5. 5. Campus Ostend <ul><li>Professional bachelor </li></ul><ul><ul><li>Chemics </li></ul></ul><ul><ul><li>Electronics </li></ul></ul><ul><ul><li>Mechanics </li></ul></ul><ul><ul><li>Aviation </li></ul></ul><ul><li>Academic bachelor </li></ul><ul><ul><li>Civil engineering </li></ul></ul><ul><ul><li>Electronics </li></ul></ul><ul><ul><li>Mechanics </li></ul></ul><ul><li>Master courses </li></ul><ul><ul><li>Civil engineering </li></ul></ul><ul><ul><li>Electronics </li></ul></ul><ul><ul><li>Elektro technics </li></ul></ul><ul><ul><li>Elektro mechanics </li></ul></ul><ul><ul><li>Polymer technology </li></ul></ul>
  6. 6. Mechanical department <ul><li>3-fold mission </li></ul><ul><ul><li>Education </li></ul></ul><ul><ul><li>Service for SME’s </li></ul></ul><ul><ul><li>Scientific research </li></ul></ul><ul><li>Overview of research fields </li></ul><ul><ul><li>Dynamic behavior of mechanical structures </li></ul></ul><ul><ul><li>Polymer processing </li></ul></ul><ul><ul><li>Avionics </li></ul></ul><ul><li>Different types of research </li></ul><ul><ul><li>Theoretical approach </li></ul></ul><ul><ul><li>Material characterization </li></ul></ul><ul><ul><li>Computer simulations </li></ul></ul><ul><ul><li>Experiments </li></ul></ul><ul><ul><li>… </li></ul></ul>
  7. 7. Software overview <ul><li>General finite element package </li></ul><ul><ul><li>NX 6 </li></ul></ul><ul><li>Polymer processing </li></ul><ul><ul><li>Autodesk Moldflow : Injection moulding </li></ul></ul><ul><ul><li>VEL 6.3 : Extrusion </li></ul></ul><ul><ul><li>T-sim 4.7: Thermoforming </li></ul></ul>
  8. 8. <ul><li>Traffic control camera </li></ul>First case study
  9. 9. First case study <ul><li>Housing: Influence of different materials </li></ul><ul><ul><li>PA + PC </li></ul></ul><ul><ul><li>ALU </li></ul></ul><ul><ul><li>≠ coatings </li></ul></ul><ul><li>All weather conditions </li></ul><ul><ul><li>Closed volume for air and humidity </li></ul></ul><ul><ul><li>Extreme temperatures </li></ul></ul><ul><ul><li>Solar heating </li></ul></ul><ul><li>Internal heat generation on 2 PCB’s </li></ul><ul><ul><li>3.7 Watt </li></ul></ul><ul><li>Maximum allowed temperature on PCB’s = 100°C </li></ul><ul><ul><li>Radiation has to be taken into account </li></ul></ul><ul><ul><li>Steady state conditions </li></ul></ul>
  10. 10. Camera: model <ul><li>Mesh on solids and air+ assigning material </li></ul>
  11. 11. Camera: Situation 1 <ul><li>Simulation 1 = lab-conditions </li></ul><ul><li>Ambient conditions=22°C Outside convection: 20W/m²K </li></ul><ul><li>Heat generated on PCB: 3.7 Watt </li></ul><ul><li>No solar heating </li></ul>
  12. 12. Camera: Situation 1 <ul><li>Without taking into account radiation </li></ul><ul><li>Maximum temperature: 91°C </li></ul><ul><li>Maximum air temperature: 64°C </li></ul>
  13. 13. Camera: Comparison <ul><li>Ambient temperature: 22°C </li></ul><ul><li>Internal heat generation 3.7W </li></ul><ul><li>Measurements for temperature with NTC’s in the internal air </li></ul><ul><li> Simulation Experiment </li></ul>NOT OK 60°C  46°C 55°C  48°C 40°C  45°C
  14. 14. Camera: Convection <ul><li>Calculated Internal natural convection coefficients: reasonable level </li></ul>
  15. 15. Camera: with radiation <ul><li>Taking into account radiation: first assumption black body </li></ul><ul><li>Maximum temperature: 63°C </li></ul><ul><li>Maximum air temperature: 50°C </li></ul><ul><li>Maximum air speed 7 cm/s </li></ul>63°C 50°C 7cm/s
  16. 16. Camera: Comparison <ul><li>Ambient temperature: 22°C </li></ul><ul><li>Internal heat generation 3.7W </li></ul><ul><li>Measurements for temperature with NTC’s in the internal air </li></ul><ul><li> Simulation Experiment </li></ul>48°C  46°C 52°C  48°C 39°C  45°C OK
  17. 17. Camera: Solar Heating <ul><li>Possible heat load in NX Thermal/flow : solar heating </li></ul><ul><ul><li>Function of day number (angle of the sun) </li></ul></ul><ul><ul><li>Function of location on the earth </li></ul></ul><ul><ul><li>Function of time (turning of the earth) </li></ul></ul><ul><li>June at zenith: maximum flux 1415 W/m², ambient 40°C </li></ul>85°C 73°C
  18. 18. Camera: Material properties <ul><li>Influence of radiation parameters </li></ul><ul><ul><li>Outer shells 100% thermal transparant </li></ul></ul>97°C 64°C
  19. 19. Camera: Material properties <ul><li>Influence of radiation parameters </li></ul><ul><ul><li>Outer shells 100% thermal reflecting </li></ul></ul>74C 57C
  20. 20. Second case study <ul><li>Software linking result: T-SIM - NX-Thermal – I-deas NX 5 </li></ul><ul><ul><li>Prediction of spatial temperature distribution for thermoforming mould </li></ul></ul><ul><ul><li>Cooling behavior of thermoformed product </li></ul></ul><ul><li>Problem description </li></ul><ul><ul><li>T-sim ® does not perform heat transfer calculation for the mould </li></ul></ul><ul><ul><li>Influence of cooling line geometry </li></ul></ul><ul><ul><li>Product thickness is not known in advance </li></ul></ul><ul><ul><li>General rules are not valid for thermoforming as for in injection molding </li></ul></ul>
  21. 21. Thermoforming process
  22. 22. T-sim ® software <ul><li>Sheet representation </li></ul><ul><ul><li>New sheet </li></ul></ul><ul><ul><li>Open sheet </li></ul></ul><ul><ul><ul><li>Preblown sheet </li></ul></ul></ul><ul><ul><ul><li>Sheet sag (gravimetric deformation) </li></ul></ul></ul>
  23. 23. T-sim ® software <ul><li>Thermoforming tools </li></ul><ul><ul><li>New tool </li></ul></ul><ul><ul><ul><li>Different formats </li></ul></ul></ul><ul><ul><li>Open tool </li></ul></ul>
  24. 24. T-sim ® software <ul><li>Process parameters: pressure, positions </li></ul><ul><ul><li>New process control </li></ul></ul><ul><ul><li>Open process control </li></ul></ul>
  25. 25. T-sim ® software <ul><li>Material data </li></ul><ul><ul><li>New material data </li></ul></ul><ul><ul><li>Open material data </li></ul></ul>
  26. 26. T-sim ® software <ul><li>Heat and friction </li></ul><ul><ul><li>New Heat and friction </li></ul></ul><ul><ul><li>Open Heat and friction </li></ul></ul>One temperature for one tool!
  27. 27. T-sim ® software <ul><li>Project definition: selection of different files </li></ul><ul><ul><li>New Project </li></ul></ul><ul><ul><li>Open Project </li></ul></ul>
  28. 28. T-sim ® software <ul><li>Results </li></ul><ul><ul><li>Thickness distribution </li></ul></ul><ul><ul><li>Temperature distribution </li></ul></ul><ul><ul><li>Stress distribution </li></ul></ul><ul><ul><li>Elongation distribution </li></ul></ul>
  29. 29. Case study <ul><li>Temperature within thermoforming mould </li></ul><ul><ul><li>PP sheet: 0.5 mm thickness, Process temperature 160°C </li></ul></ul><ul><ul><li>Serial cooling water flow 13 l/min, 13°C inlet value, Estimated mould temperature = 40°C </li></ul></ul><ul><ul><li>Cycle time = 2 sec, t form = 0.5 sec, forming pressure 5 bar </li></ul></ul>
  30. 30. T-sim simulation
  31. 31. T-sim results Thickness Temperature
  32. 32. <ul><li>Short cycle time  ± steady state </li></ul><ul><li>Discontinue process  continuous </li></ul><ul><ul><li>Cooling of sheet : Transformation into power </li></ul></ul><ul><ul><li>Need for Temperature and thickness distribution </li></ul></ul><ul><li>Realized through own developed program (Borland C++) </li></ul>Mould temperature
  33. 33. <ul><li>Export of T-sim data (ASCII format) </li></ul><ul><ul><li>Nodes, elements, thicknesses, temperatures </li></ul></ul><ul><li>Subdivision into 100 thickness intervals </li></ul><ul><ul><li>Necessary for the creation of physical properties within I-deas </li></ul></ul><ul><li>For each element: calculation of power </li></ul><ul><ul><li>Determination of element surface </li></ul></ul><ul><ul><li>Heat transported to mold (temperature assumed to be constant) </li></ul></ul><ul><ul><ul><li>For each time step within cycle time: </li></ul></ul></ul><ul><ul><ul><ul><li>Amount of heat transported </li></ul></ul></ul></ul><ul><ul><ul><ul><li>Cooling down of element </li></ul></ul></ul></ul>Procedure Local HTC Mould thickness Hot sheet cold mould
  34. 34. <ul><li>Use of Universal file format (ASCII format) </li></ul><ul><ul><li>Export node and element data </li></ul></ul><ul><ul><li>100 Physical properties </li></ul></ul><ul><ul><li>100 Power groups </li></ul></ul>Thermal Model
  35. 35. <ul><li>Heat flux field </li></ul>Boundary condition
  36. 36. <ul><li>Thermal modeling of mould : assembly mesh </li></ul><ul><ul><li>Imported mesh + boundary conditions </li></ul></ul><ul><ul><li>Thermal model built for mould in Ideas-TMG </li></ul></ul><ul><ul><li>Steady state modeling </li></ul></ul>Complete mould
  37. 37. <ul><li>Contact surface temperature (average temperature) </li></ul>Temperature result Weighted average = 64.5°C Weighted standard deviation = 5°C
  38. 38. <ul><li>Complete model (average temperature) </li></ul>Temperature result
  39. 39. <ul><li>Complete model (average temperature) </li></ul>Coolant temperature Good fit with measured outlet temperature: 24.8°C  25.1°C
  40. 40. <ul><li>Building of new model </li></ul><ul><ul><li>Transient model </li></ul></ul><ul><ul><li>Contact surface temperature  Boundary condition </li></ul></ul><ul><ul><li>Temperature result T-sim  Initial temperature for sheet </li></ul></ul><ul><ul><li>Thermal coupling between two “surface” meshes </li></ul></ul>Real cooling behavior
  41. 41. Cooling behavior Good prediction of hot spots in thermoformed part <ul><li>Sheet cooling as function of time </li></ul>
  42. 42. Conclusions <ul><li>Combinations of programs allow to obtain more realistic data for average mould temperatures </li></ul><ul><ul><li>Guessing the average mould temperature for T-sim = past </li></ul></ul><ul><li>Optimisation tool for cooling line geometry is developed </li></ul><ul><li>Future work: - Transient mould temperature prediction - Warpage of thermoformed products </li></ul>
  43. 43. October 2009