FOCUS OF THE REPORTThis report contains a list of all the 3D silicon/glass interposer opportunities by application. We analyze the key drivers, expected benefits, and the various technology options and alternatives. In addition we will cover the 3D interposer industry players and the respective supply chain changes. MARKET AND TECHNOLOGY TRENDSSeveral concurrent factors account for the growing momentum of 3D silicon and glass interposers: the continuously increasing gap between printed circuit boards and integrated circuits, both in terms of geometries and materials, has driven research and development of new innovative semiconductor assembly and packaging solutions over the past 10 years, including System-in-Package (SiP), Package-on-package (PoP), flip-chip Ball grid Array (fc-BGA) or more recently fan-out Wafer Level Packaging. The introduction of these recent technologies fills the gap by offering finer pitch interconnections and by alleviating the external IO interface thanks to recombined interconnections inside the package. However, a growing number of industry players now claim that the gap has become so wide that a new disruptive technology, such as 3D silicon or glass interposers, is needed. Concurrently, the so-called “mid-end infrastructure” (foundries for wafer-level packaging operations) has developed at an unprecedented pace over the past 3 years to meet the growing demand for Wafer-Level Chip-Scale Packaging (or “fan-in WLCSP”) and flip-chip. These new facilities, half way between front-end foundries and conventional assembly and packaging facilities now support high volume manufacturing on large size wafers, thus permitting economies of scale. These players, in search of growth opportunities, have positioned as service providers for the back-end operations for the making of through silicon vias (TSV’s) and other related wafer-level assembly operations. Thanks to 3D silicon/glass interposers, they can go one step further, and actually propose products combined with their service offer. MYTH, NICHE OR HIGH VOLUME NECESSITY'The industry is not clear where 3D interposers will have the most impact. These new interposer technologies, based on silicon wafer technologies such as wafer-level photolithography, are introducing thinner and denser substrates which can profoundly change the semiconductor packaging and assembly ecosystem. Of course, the upfront investments can sometimes limit the technology benefits.This report first focuses on the driver applications and the associated drivers by application. For each application, we simulate costs and compare them with projected market prices, we compare the 3D si/glass interposer solution with existing and other emerging alternatives and we derive detailed market and wafer forecasts. Will 3D silicon/glass interposers be an intermediate step to 3D TSV’s in active IC’s, or is this a long term trend' How will the supply chain evolve to serve these emerging technologies' These are the questions we address in this first-ever dedicated report on 3D glass/silicon interposers. Despite the emerging character of the 3D silicon/glass interposer solutions and the associated uncertainties, this report brings clear answers as to which applications and uses they are likely or unlikely to support in the future, and whether these will stay niche or rather expand to high volume manufacturing. KEY FEATURES OF THE REPORTDetailed account of all the application fields of 3D interposers (examples are logic, logic+memory, 3D RF/analogue integrated passive and MEMS capping interposers…) Drivers and expected benefits by application Comparison with technology alternatives and likeliness of 3D interposer penetration by application Market trends and figures with breakdown by application, substrate type, wafer and panel size Analysis of target wafer prices for a few key applications Cost analysis of several technology and industrial cases Supply chain

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3D Silicon and Glass Interposers
Published on September 2010
Report Summary
FOCUS OF THE REPORT
This report contains a list of all the 3D silicon/glass interposer opportunities by application. We analyze the key drivers, expected
benefits, and the various technology options and alternatives. In addition we will cover the 3D interposer industry players and the
respective supply chain changes.
MARKET AND TECHNOLOGY TRENDS
Several concurrent factors account for the growing momentum of 3D silicon and glass interposers: the continuously increasing gap
between printed circuit boards and integrated circuits, both in terms of geometries and materials, has driven research and
development of new innovative semiconductor assembly and packaging solutions over the past 10 years, including
System-in-Package (SiP), Package-on-package (PoP), flip-chip Ball grid Array (fc-BGA) or more recently fan-out Wafer Level
Packaging. The introduction of these recent technologies fills the gap by offering finer pitch interconnections and by alleviating the
external IO interface thanks to recombined interconnections inside the package. However, a growing number of industry players now
claim that the gap has become so wide that a new disruptive technology, such as 3D silicon or glass interposers, is needed.
Concurrently, the so-called “mid-end infrastructure” (foundries for wafer-level packaging operations) has developed at
an unprecedented pace over the past 3 years to meet the growing demand for Wafer-Level Chip-Scale Packaging (or “fan-in
WLCSP”) and flip-chip. These new facilities, half way between front-end foundries and conventional assembly and packaging
facilities now support high volume manufacturing on large size wafers, thus permitting economies of scale. These players, in search
of growth opportunities, have positioned as service providers for the back-end operations for the making of through silicon vias
(TSV’s) and other related wafer-level assembly operations. Thanks to 3D silicon/glass interposers, they can go one step
further, and actually propose products combined with their service offer.
MYTH, NICHE OR HIGH VOLUME NECESSITY'
The industry is not clear where 3D interposers will have the most impact. These new interposer technologies, based on silicon wafer
technologies such as wafer-level photolithography, are introducing thinner and denser substrates which can profoundly change the
semiconductor packaging and assembly ecosystem. Of course, the upfront investments can sometimes limit the technology
benefits.This report first focuses on the driver applications and the associated drivers by application. For each application, we
simulate costs and compare them with projected market prices, we compare the 3D si/glass interposer solution with existing and other
emerging alternatives and we derive detailed market and wafer forecasts.
Will 3D silicon/glass interposers be an intermediate step to 3D TSV’s in active IC’s, or is this a long term trend' How will
the supply chain evolve to serve these emerging technologies' These are the questions we address in this first-ever dedicated report
on 3D glass/silicon interposers. Despite the emerging character of the 3D silicon/glass interposer solutions and the associated
uncertainties, this report brings clear answers as to which applications and uses they are likely or unlikely to support in the future, and
whether these will stay niche or rather expand to high volume manufacturing.
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KEY FEATURES OF THE REPORTDetailed account of all the application fields of 3D interposers (examples are logic, logic+memory,
3D RF/analogue integrated passive and MEMS capping interposers…) Drivers and expected benefits by application Comparison
with technology alternatives and likeliness of 3D interposer penetration by application Market trends and figures with breakdown by
application, substrate type, wafer and panel size Analysis of target wafer prices for a few key applications Cost analysis of several
technology and industrial cases Supply chain analysis: main manufacturers and contract assemblers for 3D interposers, likely high
volume players. Design, test and liability considerations
Companies Included in this Report
AAC Microtec
Allvia
AMD
Altera
Amkor Technology
APM
ASE
ASET
Avago Technologies
Bridgelux
CEA-LETI
ChipMOS
Cree
Corning
Dai Nippon Printing
Dalsa
Discera
Elpida
Epcos
Epistar
EPWorks
Fraunhofer IZM
Georgia Tech
Hitachi
Hymite
Hynix
Ibiden
IBM
IME
IMT
Infineon Technologies
Intel
Ipdia
Liquid Design Solutions
LG Innotek
Lumileds
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Maxim
Micron
Nanium
National semiconductor
NEC / Schott
Nepes
Nichia
Nippon Electric Glass
Nokia
NXP Semiconductors
On Semiconductors
Panasonic
Qualcomm
Renesas
Replisaurus Technologies
Samsung
Schott
Sensonor
Shinko Electric
Silex Microsystems
SMIC
Soitec
Sony
StatsChipPac
STEricsson
STMicroelectronics
Süss Microtec
Tecnisco
Texas Instruments
TMT
Toshiba
TSMC
UltraTech
UMC
UTAC
VTI Technologies
WLCSP
Xilinx
Xintec
About the Author
Main author: Laurent Robin
-Laurent is in charge of the MEMS & Sensors market research at Yole Developpement. He previously worked at image sensor
company e2v Technologies (Grenoble, France). He holds a Physics Engineering degree from the National Institute of Applied
Sciences in Toulouse, plus a Master Degree in Technology & Innovation Management from EM Lyon Business School, France
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Contributor: Mike Perlmutter
-Mike has worked in the inertial navigation field for over 30 years. He was director of strategy and planning at Northrop Grumman in
2007 when he retired from the company and established Skylight Navigation to consult in the area of inertial systems, navigation,
corporate planning and strategy. Mike has published papers, chaired conference sessions, given talks and authored 10 US patents on
inertial sensors, GPS and navigation technology.
Table of Content
1. Scope of the report, definitions and background 2. Executive summary 3. Supply chain analysis 4. Market forecasts
2009-2015 market forecasts In $M2009-2015 wafer forecasts in kWafers (wspy) by application, substrate material size and shape5.
Applications and drivers Logic interposers Logic + memory interposers Interposers for memory stacks Interposers for MEMS &
sensors Interposers for CMOS image sensors 3D silicon submounts for HB LEDs 3D Power/RF/analogue integrated passives Misc.
Glass/silicon package substrates 6. Technologies & Design rules for 3D Glass / Siliconinterposers Technologies and design rules
for interposersby application Passive integration in interposers Mixing FO WLP and 3D interposer concepts' Focus on Glass
interposers Focus on PANEL interposers 7. Cost structure example Case study #1 Case study #2 Case study #3 8. Conclusions
APPENDIX
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