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Plastic Logic - Reliability of OTFTs

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Recent Advances in the Reliability of OTFTs

Recent Advances in the Reliability of OTFTs

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  • 1. Recent Advances in the Reliability of OTFTsPatrick Too, Herve Vandekerckhove, Guillaume Fichet, M. James Harding, Michael J. BanachSPIE – 13th August 2012San Diego
  • 2. Outline • Plastic Logic company introduction • Reliability of OTFTs • Challenges on the way from Lab to Fab • Applications of Plastic Logic technology and partnerships SPIE 2012 August 13th 2012 2
  • 3. The Leader in Plastic Electronics  Developed lightest, most durable display technology available today  Demonstrated scalability in the first and largest production facility  1-2 year lead over the competition for flexible backplane technology  A single display has 2.8M uniform and reliable plastic transistors SPIE 2012 August 13th 2012 3
  • 4. Company History Display technology Development10+ transistors 100+ transistors 1.2 M transistors Colour EPD 2.8 M transistors Research, Process Development & Manufacturing 2000: Cambridge Technology 2008: Dresden Display Factory Cambridge University Center translating research First plastic electronics factory in Cavendish Laboratory into products the world Research in organic electronics SPIE 2012 August 13th 2012 4
  • 5. R&D and Production Set-Up Technology Transfer Cambridge R&D Prototype Line (14”) Cambridge R&D Prototype Line  Proof of concepts  Highly configurable process  New designs in < 1 month  1” Chips to A4 displays SPIE 2012 August 13th 2012 5
  • 6. Production Set-Up Technology Transfer Dresden Factory (Gen 3.5) Dresden Gen. 3.5 Factory  Backplane Manufacturing  Qualified volume process  Production equipment  Fully Automated Handling  Process, Equipment, Integration Engineers  Thousands of backplane display modules/week SPIE 2012 August 13th 2012 6
  • 7. Electrophoretic Plastic Display SPIE 2012 August 13th 2012 7
  • 8. Reliability of OTFTs SPIE 2012 August 13th 2012 8
  • 9. Stress Test System SetupStress card module • Fully Automated electrical test system • Flexibility in the electrical test and stress test profiles • Ability to test in different environmental conditions • Capability to test more than 1800 TFTs per day in Cambridge SPIE 2012 August 13th 2012 9
  • 10. Stress Test Waveform etc Gate Source 1 WaveformLarge range of stress test waveforms available to mimic OLED and EPD displays driving SPIE 2012 August 13th 2012 10
  • 11. OTFTs under video rate (60Hz) stress test 600C annealing 1200C annealing  Video rate stressing was done at ambient controlled atmosphere  Threshold voltage shift is observed under video rate stress test for low annealing temperature (600C) of the OTFTs  The OTFTs show an improvement in the threshold voltage stability after a 1200C annealing SPIE 2012 August 13th 2012 11
  • 12. Effect of solvents on OTFT stability O-Xylene (B.P=1370C) Mesitylene (B.P= 1650C) Tetralin (B.P=2050C) Phenylcyclohexane (2380C)All samples are annealed in air and stress tested at ambient controlled temperature SPIE 2012 August 13th 2012 12
  • 13. Reliability testing Name Test Purpose Thermo cycling TST Mechanical robustness & CTE mismatch High Temperature Storage HTS Storage of transport conditionsAdvance Humidity Storage AHS Stability against Moisture ingress Low Temperature Storage LTS Storage of transport conditions Real World Usage RWU Display use in non accelerated modeAdvance Humidity Operation AHO Accelerated operation at high humidityLow Temperature Operation LTO Accelerated operation at low temperature Ambient Operation AO Accelerated operation at ambient conditions Solar storage SOR Solar robustness Altitude test ALT Pressure sensitivity SPIE 2012 August 13th 2012 13
  • 14. Challenges on the way from Lab to Fab SPIE 2012 August 13th 2012 14
  • 15. The Manufacturing ChallengeIt is one thing to show a single display at a tradeshow…...quite another to develop a high yield manufacturing process SPIE 2012 August 13th 2012 15
  • 16. Process learning & Development Printing process 2008Thickness mean 2009 Thickness mean Deposition process 2008Thickness mean 2009 Thickness mean SPIE 2012 August 13th 2012 16 16
  • 17. Progress in Plastic Logic display 2008 2009 Defects driven High Quality Display Equipment / Process driven SPIE 2012 August 13th 2012 17
  • 18. Colour Flexible Displays: Now Available Display size 1” - 10.7” Backplane Grey Levels 4 – 16 Pixel pitch up to 225ppi Contrast Ratio 12:1 Thickness thin as 130 µm Weight down to 11g Colour Available NTSC 2-5% Paper-like finish Excellent readability Colour gamut high enough to enable distinguishability Bistable enables long battery life 1280 x 960 Colour Display SPIE 2012 August 13th 2012 18
  • 19. Colour Flexible Display SPIE 2012 August 13th 2012 19
  • 20. Other Plastic Logic Technologies Transmissive display Thin displays Small displays SPIE 2012 August 13th 2012 20
  • 21. Plastic Logic Technology in Action1. 3.2. 1. The world‘s first plastic organic electronics factory 2. The most robust display on the market 3. Plastic Logic display at video rate www.youtube.com/plasticlogic SPIE 2012 August 13th 2012 21
  • 22. PartnershipsWe are looking for further professional partners to enable future applicationsand productsPartner areas• Potential users of Plastic Logic display components• Technology providers for sensors• End users for flexible logics• Materials and equipment suppliers to further progress the technology SPIE 2012 August 13th 2012 22
  • 23. Plastic Logic Ltd 34, Cambridge Science Park Cambridge, CB18DG UK Tel.: 01223706038Email: patrick.too@plasticlogic.com www.plasticlogic.com SPIE 2012 August 13th 2012 23