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Semi Conductors in Normandy

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Semi-conductors Players in Normandy

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  • 1. Invest in Normandy Semiconductors: R&D, Industry leaders www.normandydev.com
  • 2. CONTENTS 1 MajOr playErS iN MiCrOElECTrONiCS 2 NXp Semiconductors 4 iDpia 5 prESTO Engineering 6 publiC rESEarCh labOraTOriES 6 laMipS: Semiconductor physics and Micro-Electronics laboratory 7 CriSMaT: laboratory of Cristallography and Materials Science 8 irSEEM: research institute for Embedded Electronic Systems 9 EXiSTiNg TEST EquipMENT faCiliTiES fOr ThE SEMiCONDuCTOr iNDuSTry iN CaEN 10 SOME Of ThE SEMiCONDuCTOr prOjECTS DEvElOpED wiThiN ThE E-SECurE TraNSaCTiONS CluSTEr 11 aCaDEMiC SuppOrT 11 ENSiCaEN Engineering School 12 ESigElEC Engineering School
  • 3. august 2010 1 MajOr playErS iN MiCrOElECTrONiCS in france in Normandy NXp iDpia prESTO Engineering Philips Caen ALTIS/Corbeil Magnetic technologies ST Automotive electronics Tours NXP Philips-Freescale ST/Crolles CMOS Power technologies electronics ATMEL ST/Rousset Freescale Toulouse Communicating 300 devices 200 Regional programs for microelectronics and major wafer labs in France 150 125
  • 4. august 2010 2 NXp Semiconductors, french r&D headquarters - Caen NXp’ teams at the Caen-based R&D center, comprising 900 engi- neers and researchers, are developing ground-breaking technologies in • 1,150 EmployEEs four of NXP’s key fields of activity: • HomE, mobilE & pErsonal, • Mobile & Personal (nomad devices) idEntification, multimarkEt • Home (household electronics) • ID (identification) sEmiconductors (mms) • MMS (multimarket semiconductors) • innovation & tEcHnology R&D teams work in a number of fields including: rf technologies, si- • ic manufacturing opErations licon tuners, System-in-package, together with other innovative solu- • support functions tions such as Near field Communication (NfC) technology. Two joint R&D intitutes: LaMIPS & ISyTest NXP R&D Center also hosts common research institutes: • ISyTest (Institute for System Testing) in partnership with the CNRS (National Centre for Scientific Research). Specialized in advanced semiconduc- tors test strategies and tools, it is developing innovative test methods and techniques allowing NXp to improve the quality of its increasingly com- plex system solutions. • LaMIPS, a joint institute with CRISMAT lab in Caen, is specialized in failure analysis, reliability and characterization of semiconductors (SiP & SoC) and Materials. During the company’s 50 year presence in the town of Caen, NXP has continued its committed involvement in the local ecosystem. Now located within the new Effiscience Science Park, the company’s R&D Center federates the key ingredients capable of attracting high-tech partners and activities to the science park. “ Caen has always been the ideal location for our R&D activities: it boasts a strong entrepre- neurial culture and commitment from public authorities, as well as a solid ecosystem formed by research laboratories, regional competitiveness clus- ” ters, engineering schools and technical expertise. Henri-Alain Rault, former President of NXP France
  • 5. august 2010 3 NXp’s competencies sEctors crafts R&D products Production (Operations) Production, Maintenance • Integrated circuit design in the fields of cellular and cordlessw Test Test Development / Support, Test Manufacturing telephony, secure electronic transactions and consumer electronics • Image and video processing for mobile & personal solutions Hardware Development Analog Designer, Mixed Designer Digital back-end, Digital front-end • International Innovation Centers in RF technologies and video compression techniques Software Software Designer Architecture HW Architect, SW Architect R&D processes and pilot lines System Architect, IC Architect • International Competence Center for Advanced Technologies in Innovation Proc., Innovation Dev. heterogeneous integration (System-in-Package) TPE Test Engineer, Product Engineer • Test, assembly and packaging technologies Support BL Quality / Logistic, Industrialization/ Caen Campus SCM Assistant • Inauguration Q3 2007 Project Management Project management • 800 engineers and support functions (Headquarters) Marketing & IPM/Tactical, Business Development Sales Account Manager • Showroom with NXP Caen applications and technologies: TV-on-PC, TV-on-Mobile, Set-Top-Box, NFC, RF Cellular, SiP/PICS Support Site HR, Communication technologies, Solid-State Lighting F&A, Legal & Fiscal Purchasing, IT, Logistic
  • 6. august 2010 4 iDpia - Caen New manufacturing plant on piCS technologies and 3D Silicon production ipDia was founded in 2009 as a spin-out from NXP. ipdia products IPDiA dedicated campus covers 7 ha, including: • customizEd products . The IPDiA company Headquarters • 3d silicon capacitors . The Sales and Marketing organization • rf intEgratEd passivE . Pilot line for SiP product development and rapid prototyping dEvicEs . 6" wafer fab with integrated passives, capacity • intEgratEd protEction 150k wafers per year. dEvicEs ipDia is a preferred supplier of high-performance, high-stability and high- R&D Projects reliability silicon passive components. ipDia’s primary objective is to focus on two main axes : integrated Devices for high brightness lEDs and integra- priiM ted passive Devices for new markets such as medical, industrial, aerospace IPDiA has announced the launch of the R&D consortium PRIIM and defense. (Platform for the Realization of Shared Industrial Innovation) IPDiA’s technological lead in components for lighting, LEDs and integrated pas- which will address application requirements for markets such sive devices will enable companies to capitalize on this know-how acquired over as: implantable medical devices (stimulators, defibrillators, the last few years and which earned IPDiA its position as a major player on the motion detectors), multimedia chips and embedded systems. world market. IPDIA Multi Wafer Interposer & IPD Program IPDiA produces both stand-alone IPDs as well as Systems-In-Package (SiP). The stand-alone IPDs are used in LEDs and modem cards. In SiPs the IPD and the The consortium goal is to develop high-performance silicon chip are integrated leading to better performance, a smaller footprint (10 x smal- passive components capable of “withstanding severe environ- ler), and a lower cost price. ments and assembly technologies that allow the ultraminiatu- rization of future products”. The SiP technology opens up numerous commercial applications and meets the This 53 million euro - four year project will include the following ongoing requirements of many OEMs to keep on reducing the size of electronic partners: Oseo, CEA Leti, CNRS/LAAS, CNRS /CRISMAT, 3D devices while improving their performance and reliability. PLUS, ELA Medical, Gemalto, Kalray and Movea.
  • 7. august 2010 5 prESTO Engineering - Caen presto Engineering Offering Semiconductor Test and analysis Services in new European hub Presto Engineering, a pioneer “ of the labless business model For the first time, European chip companies have access to for bringing semiconductor pro- a state-of-the-art lab with a staff of highly skilled engineers and ducts into volume production, technology specialists offering advanced outsourced test and announced in February 2010 ” the opening of its new services analysis capabilities. Patrick Poirier - Director of Operations hub in Caen. • tEst • rEliability The new hub, which includes equipment and infrastructure acquired from NXP Semiconductors’ facility • ElEctrical failurE analysis in Caen, offers comprehensive failure analysis and reliability testing for semiconductor compa- • pHysical failurE analysis nies. The hub will be operated by Presto Engineering Europe. • program managEmEnt presto’s state-of-the-art capabilities include enhanced rf and 3D-integration expertise and ad- vanced test, reliability, fault-isolation and failure-analysis services. by outsourcing these steps, chip companies are able to cut costs and free resources for their core business. about presto Engineering Bringing an advanced chip design into silicon requires a variety of advanced test and analytical tech- niques. Presto’s Design Success Analysis™ offering eases this process by providing first-silicon vali- Presto Engineering, an ISO 9001 company dation, as well as characterization of new processes, new designs, and process transfers. Capabilities headquartered in San Jose, California, pro- include comprehensive custom ATE hardware interfaces (such as load modules, probe cards, DUT cards vides comprehensive semiconductor test and thermal interfaces) and product-engineering services. and analysis solutions to IDM and Fabless companies, helping to improve the speed More broadly, Presto can proactively and reactively address a variety of design-to-manufacturing chal- and predictability of new product releases. lenges. Presto’s product debug services include ATE-coupled in-silicon analytical capabilities, with ex- tensive backside silicon analysis; additional release-acceleration offerings include reliability services. Presto combines unique technical expertise, The company’s hubs can also maximize the utility of expensive test chips and engineering, validating extensive industry experience and state-of- simulation results and characterizing timing, power, leakage, and other parameters. the-art ATE, reliability, failure analysis and fault isolation capabilities to offer a com- «This new facility is the springboard for Presto’s expansion into Europe and our introduction of the labless plete product engineering solution designed model to that key market, which includes some of the world’s top fabless design houses, fab lines, and to complement the internal resources of its other members of the semiconductor community,» said Michel Villemain, CEO of Presto Engineering. customers. (source: Press Release - February 16, 2010)
  • 8. august 2010 6 publiC rESEarCh labOraTOriES Failure analysis, laMipS: Semiconductor physics and Micro-Electronics reliability and CharaCterization oF semiConduCtors and materials laboratory rEsEarcH tHEmatics laMipS’ strengths main fiElds • A huge amount of equipment at the cutting-edge of today’s tech- to d E v E l o p i n n o v a t i v E nologies (AFM, TEM, SEM, FIB...) mEtHods for cHaractE - • failurE analysis • A workforce of 60 people including doctors, engineers and tech- rizing and analysing micro- nicians, who manage twenty or so PhD students and trainees • matErial cHaractErization • rEliability • Strong skills in all kind of technical analysis combined with ElEctronic systEms advanced skills in the fields of electrical stresses and reliability tests • HypErfrEquEncy & radio • A rich, outward-looking network with other companies frEquEncy, ElEctric cHarac- (Valeo, Magneti Marelli, ArvinMeritor, Fime, Expert’eyes...) tErization and modElling • Partnership with competitive clusters: MOV’EO (automotive & • supporting procEss transport) and TES (e-secure transactions) ; membership in Caen dEvElopmEnt “CNRT” Materials laMipS is a shared facility between the CriSMaT (Laboratory of Christallo- partnership with NXp graphy and Materials Science) renowned worldwide in the fields of material NXP uses the laboratory for its specific needs. synthesis and characterization and NXp Semiconductors, which has de- Furthermore, the company ensures its maintenance and its ope- veloped expertise in the characterization, failure analysis and qualification of rating costs. As for its research activities, NXP’s engineers and products and processes on the Caen site. technicians take part in research and conduct measurements laMipS is a vital partner for the development of new technologies, its along with researchers. mission is to develop research activities focusing on physical and elec- “Thus, we can improve our efficiency and genuinely focus on trical characterization, modelling and the reliability of complex systems. identifying defects” explains LaMIPS’ Director, Philippe Des- camps. The research topics developed within the laboratory are The laboratory is also open to businesses with needs in the field of generally put forward by NXP. micro-electronic system analysis and characterization. By reuniting the expertise of all of its partner organizations, LaMIPS is emerging as a major Nevertheless, the lab can also work on its own themes according player for understanding the difficulties generated by new and increasingly to publication opportunities and to the specific skills of available complex micro-electronic systems. researchers.
  • 9. august 2010 7 FunCtional & struCtural materials. CeramiCs, alloys, Composites and miCroeleCtroniCs CriSMaT: laboratory of Cristallography and Materials Science A regional scheme aimed at supporting chairs of excellence has allowed the CRISMAT to welcome one tHE crismat, affiliatEd of the world’s leading names in research into nanomaterials for a 12-month, full-time secondment. And al- to cnrs and EnsicaEn, though CRISMAT is a renowned laboratory for its research on materials, a valuable outside view is sure to accelerate its exploratory work. i s a l a r g E r E s E a r c H Since the summer of 2007, the CRISMAT has been proud to welcome a high-flying American researcher for laboratory witH morE a one-year (1) secondment. ‘We were looking to initiate new work on nanomaterials with support from an tHan 100 pEoplE. tHE main established outside source. The regional scheme(2) in support of hosting renowned exterior researchers scopE of activitiEs is tHE offered the ideal opportunity.’ dEsign of nEw oxidEs to CRISMAT’s Director Antoine Maignon and his research team had already set their sights on Mas Subrama- crEatE nEw propErtiEs nian, a professor from Oregon State University. ‘A big name in nanomaterials, thermoelectricity in particular, for which he is among the world’s top 5 for patent applications.’ Working with him could but enhance the for applications CRISMAT’s international influence in its particular field of research. Publication pending: Mas Subramanian was welcomed to Caen last July. His time is shared between his American lab and CRISMAT, where he has started research work with a team comprising a professor, a CNRS researcher and two PhD students. ‘We are looking to develop new oxide nanomaterials, drawing on our knowledge in the field of solid-state chemistry.’ Subramanian coordinates his work between the United States and France. First impressions? «From a scientific point of view, we are already preparing and submitting articles for publication. This exchange has given us a new lease of life. Our students plan to travel to the United States this summer, and, likewise, we also plan to welcome American students to Caen. Without forgetting scientific dissemination, since local researchers can take full advantage of the Caen-based conferences and seminars at which Subramanian has agreed to speak». (1) This one-year, full-time partnership stretches in fact, on a part-time basis, over a period of two years and will consequently end in July 2009. (2) The regional scheme in support of chairs of excellence aims at encouraging the hosting of top-level foreign researchers within regional laboratories, by providing attractive resources for them to rapidly conclude their research project
  • 10. august 2010 8 irSEEM: research institute for Embedded measurement, simulation, design assistanCe Electronic Systems IRSEEM was created in 2001 with the support of the ESIGELEC, the Rouen Chamber of Commerce and Industry and several industrials and public bodies; it houses industrial research laboratories and has positioned itself on embedded electronics. The industrial research it has enabled to develop since then has been dedicated to regional automotive, aerospace and electronics networks. IRSEEM teams have carried out major research works while supporting various technology transfer and economic development activities. Equipment: IRSEEM Research Ins- • innovativE solutions titute and technology • mEasurEmEnts & tEsts • Semi-anechoic chamber with rolls transfer center has de- bench until 18 GHz for automobile veloped a strong ex- • tEcHnical support and bulky embedded systems pertise in embedded • tEcHnology transfEr electronic systems with • tEcHnological & normativE • Semi-anechoic chamber until 40 GHz a special emphasis on watcH • Mode-stirred reverberating chamber the Automotive and Aeronautics sectors • profEssional training • Measurement bench for EMC immunity (200V/m) and emission (CISPR 22) Research fields: • BCI tests bench partners: • Electromagnetic compatibility • Vectorial analysis bench until 40 GHz • Academic partners: GREAH (Le Havre University), • CAD GPM (Rouen University), LGEP (SUPELEC) and L2S • Components EMC (SUPELEC and Paris-Sud 11 University), TELICE-IEMN • Systems EMC • Electric simulations (Lille University), XLIM (Limoges University), Groupe • Measurement and investigation • 2D-3D electromagnetic modelling Antennes et Micro-ondes (Kent University) platforms (Near field test bench, Load • DPI test bench • Industrial partners: Airbus, EADS, Faurecia, FCI, Pull test bench, TEM 3D Cell, mode- INRETS, PSA, Renault, Thales Air Defence, Valeo, • Near field test benches (systems and Synchronic, Pragmatech, etc. stirred reverberating chamber) components)
  • 11. august 2010 9 EXiSTiNg TEST EquipMENT faCiliTiES fOr ThE SEMi- CONDuCTOr iNDuSTry iN CaEN Within the Normandy region, numerous quality & analytical equipements for the semiconductor & micro-electronic industry are available for external compa- nies. Below, some examples of the failure analysis lab tools that can be found in the different Norman facilities. failure analysis: lab tools initial inspection: Non Destructive analysis Electrical Verification • X-rays: Pheonix Nanomex 160 : 2D & 3D • Manual probe station PM8 + DC and RF probe • SAM: HITACHI FS300 PHEMOS1000 • TDR: Agilent 86100 + TDR + Tektronix probe • Photon Emission • Magnetic Current Imaging (2008) • Thermal Laser Stimulation (IR Laser 1300nm) (OBIRCh/TIVA), SDL Sample preparation and Observation • Magnetic Current Imaging (not available project 2008) • Observation: • Measurement instruments : Scope WavePro 940 . Optical Observation: Leica, Olympus 500 MHz, Semiconductor Parameter Analyser 4156C / . Confocal microscope (2008) 4155B / 4145B, LCR Meter 4284A • De-capsulation: physical analysis . Chemical de-capsulation: BGDCAP . Milling system: Hamamatsu IC Back Side • Preparation, observation Polishing - ASAP-1 . Delayering, Cross sectioning . Laser ablation . SEM: XL40 +EDX • Repackaging: • Physical Characterization . FIB for precise cross section or TEM lamella . Wire bonding: K&S4526 . TEM (available at the University) • Preparation: . Atomic Force Microscopy: VeecoD3000 + . Grinding and polishing system: Multiprep Electrical modes SCM, SSRM, EFM . Plasma etcher (Nextral860 & 110) . SIMS, AUGER, … (subcontracted) . Laser cutter (Ezlase 3 wave lengths) . FIB (FEI200)
  • 12. august 2010 10 SOME Of ThE SEMiCONDuCTOr prOjECTS DEvElOpED wiThiN ThE E-SECurE TraNSaCTiONS CluSTEr Secure Electronic Transactions are a combination of electronic, computing and data communication techniques enabling the reliable and secure exchange of information in a wide range of application domains. Changes in usage, the «electronisation» of certain daily gestures, together with the internationalisation of standards and legislation, are all factors bearing a strong influence on the field of Secure Electronic Transactions. projEct namE dEscription projEct lEadEr partnErs tEs clustEr nEw mould for tHE New mould for the manufacture of contactless Seropa manufacturE of cards contactlEss cards minifab Industrialization of the manufacturing process Alios for small and medium series smart cards sEmomE Magnetoelectronic structure of magneto-electric CRISMAT lab CRISMAT lab oxydes Key Technologies fEmmEs Ferro-electromagnetism for spin electronics CNRS/Thales CRISMAT lab, CEA Storage of digital information millEsim New analysis and test method in SIP production Pertinence Inria, CNRS, NXP Secure Transactions cumin 3D copper interconnects for silicon-based Sys- Rockwood Electronic Alchimer, NXP, CNRS Authentication technologies tem-in-Package (sbSIP) Materials Conception tools and methods mEdiasur Active security for CD/DVDs: insertion of an Orange Thomson, Greyc Man Machine Interface RFID tag in the optical disk and a reader in the (France Telecom) Laboratory disk drive RFID mastErE m’sip Executive Master in Microelectronics System EnsiCaen NXP, Oberthur, Design and Technology Stepmind, Silicon Key Themes Laboratories, 6 engineering schools e-citizen (health, tourism, transportation, city) tEmpicap Feasibility study, evaluation and clinical valida- NXP Caen University, tion of a prototype for measuring body tempera- Nantes University, Contactless technologies ture by ingestion of an electronic capsule Expert Soft Technologies e-administration/e-government normandy living Creation of the Normandy Living Lab dedicated TES cluster LSN/Novalog cluster lab to new uses of mobile phone
  • 13. august 2010 11 aCaDEMiC SuppOrT ENSiCaEN Engineering School ENSiCaEN (Caen) offers three main engineering degree courses in Computer Science, Electronics and applied physics, and Materials • rEsEarcH laboratoriEs including a joint Science and Chemistry laboratory witH nxp • 3 spEcializEd ExEcutivE mastErs Engineer Diplomas Executive Masters • strong links witH industry Master’s degree (considered as a 6-year university degree) • partnErsHip witH tEs and movE’o • Electronics and applied physics Options: Microelectronics - Telecommunications • Microelectronics System Design & compEtitivE clustErs - Automatics and industrial computing - Nuclear Technology • mEmbEr of tHE national cEntrE engineering and instrumentation - Optics, sen- Mixed Analog/Digital design, Analog/RF for tEcHnological rEsEarcH in matErials sors instrumentation design, High level integrated systems, • a dEpartmEnt of industrialcoopEration • Computer science Advanced Tests Methods and Processes, Options: digital imaging and multimedia - Business Management e-banking and computer science security - • Electronic payment e-banking and systems security E-secure payments and transactions, • Materials Science and Chemistry Authentication, E-commerce, smart cards ENSiCaEN research labs Options: Materials, Organic Chemistry - Materials for micro-electronics, micro-mechanics • business intelligence • laMipS (Laboratoire de Microélectronique ENSICAEN/ NXP Semiconductors): Microelectronics Laboratory Master in Microelectronics System Design & Technology: a Master designed for junior • grEyC (Groupe de Recherche en Informatique, and senior electronicians Image, Automatique et Instrumentation de Caen): IT, Imaging and Instrumentation Laboratory Unique in Europe, this degree is particularly orientated towards highly integrated Systems-on-Chip (SoC) and System-in-Package (SiP) design combined to the RFC MOS technology and is designed for both • CiMap (Centre de Recherche sur les Ions, les Maté- young engineers qualified in electronics/microelectronics and employees from the industry as part of their riaux et la Photonique): Centre for Research on Ions, life-long learning programmes. This course will span the overall SiP system from the technological/design Materials and Photonics aspects to the promotion of the products. • CriSMaT (Laboratoire de Cristallographie et Sciences des Matériaux): Laboratory of Christallogra- “ phy and Materials Science Driving and developing innovation is key in our industry. NXP Semiconductors is pionee- • lpC (Laboratoire de Physique Corpusculaire): ring new miniaturized concepts for a broad range of applications. This Master is then very sui- Laboratory of Corpuscular Physics table to understand the overall business and technical problematic when designing a complete • lCMT (Laboratoire de Chimie Moléculaire et ” integrated system. It will also speed up the knowledge acquisition of the Engineers. Thio-organique): Laboratory of Molecular and Thio- Dr Patrice Gamand, NXP Semiconductors - Caen, General Manager RF Innovation Center organics Chemistry
  • 14. august 2010 12 ESigElEC Engineering School Esigelec (Rouen) trains engineers in the following fields: Networks, Data processing, information Technology, Telecommunications, Electronics, Embedded Systems, Electrical Engineering • 4 training dEpartmEnts Transport, Automation & Industrial Robotics. • 8 laboratoriEs and irsEEm rEsEarcH institutE Majors • 8 tEcHnological spEcialisations and introduction to 7 EnginEEring carEErs • Optical Telecommunications Engineering (ITO) • strong coopEration witH tHE automotivE, • Networks and architecture Security (ASR) * aEronautical, ElEctronic and tElEcommu- • information systems engineering (GSI) * nications industriEs • business Engineer (IA) • mEmbEr of tHE national cEntrE for • industrial automation and robotics (ARI) tEcHnological rEsEarcH in matErials Automation and computer control, digital signal • partnErsHip witH tEs, movE’o and and microcontroller processing, instrumentation novalog compEtitivE clustErs (real and the virtual), automated manufacturing and local industrial networks, modelling and robot control, image processing and quality control, power electronics and electrical engineering. 7 engineering careers Departments/research labs • Embedded Systems Engineering (ISE) * • Electronics & Telecommunications • Research & Development Real-time OS, methodology, microcontrollers, programmable logic and VHDL, communications bus, Design Engineer • Computer & Communications Technology instrumentation, electromagnetic compatibility. • Project Manager Engineer • Electronics Laboratory • Electronic and Telecommunications Systems • Business Engineer • Microwave Frequency Telecommunications Engineering (ISET)* Laboratory Concepts specific to radio frequency sub-assemblies • International Engineer • Optical Telecommunications Laboratory for telecommunications (such as digital signal • Quality-Control Engineer processing) together with computer-aided design • Electrical Engineering & Embedded tools and measuring equipment. • Engineer Entrepreneur Systems • Industrial Automation Laboratory • Electrical Engineering and Transport (GET) * • Consulting Engineer • Electrical Engineering Laboratory Energy (transport, networks, management), rotating machines, power electronics, order real time, • Embedded Systems and Signal instrumentation and communication networks, EMC, • Processing Laboratory modelling. • humanities & languages * Bilingual English-French
  • 15. www.normandydev.com Normandy Crédits photos : Régions Haute et Basse Normandie - GSK - Snecma - Renault - Normandie Aménagement CMN Yachts/Guillaume Plisson - IStock - Fotolia - Daniel Fondimare - X For further information, please contact: Sylvain DORRIERE Project Manager Normandie Développement Unicentre 12 rue Alfred Kastler 14000 Caen - France Tel. +33 (0)2 31 43 56 56 sdorriere@normandydev.com With support from Exclusive representative of