Multiple Board Si Analysis And Emi Analysis

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    Multiple Board Si Analysis And Emi Analysis - Presentation Transcript

    1. Multiple Board SI Analysis and EMI Analysis using Spectraquest for successfully reducing the EMI of the medical product Ravindra Munvar Mohit Jain Oct 16, 2008
    2. Agenda
      • Terms and Terminologies - Definition
      • Our Objective
      • How we did SI simulations?
      • Block Diagram
      • Pre-layout SI Analysis
      • Post-layout SI Analysis
      • EMI Analysis
      • Conclusion
      • Q&A
    3. Terms and terminologies - Definition
      • Overshoot
      • Propagation Delay
      • Noise Margin
      • Cross Talk
      • SSN (Simultaneous Switching Noise)
    4. Objective
      • To meet CISPR 11 and IEC 60601-1-2 EMI/EMC regulations for medical product
      • For Class B product its 30 dB (at 10m)
    5. How we did SI simulation?
      • Only few signals of the similar signal groups were simulated for the pre-layout reflection analysis
      • Batch simulations for the reflection, cross talk and SSN were performed at the post layout stage along with the EMI Analysis
      • Single iteration of Post layout Analysis and consequent Layout update was followed.
    6. Block Diagram
      • Address and data signals are connected to the FPGA on the same board
      • Address and data signals are connected to SRAM and ROM on the other board through board to board connector
      • The frequency of operation of the signals is 12MHz
    7. Pre-Layout SI - Setting Simulation Preferences
    8. Pre-layout SI : Topology for Data Line MCU/ROM
    9. Pre-layout SI : Simulation Graph for Data Line MCU/ROM MCU as driver and ROM as receiver OBSERVATIONS: Overshoots are high
    10. Pre-layout SI : Simulation Graph for Data Line MCU/ROM ROM as driver and MCU as receiver
    11. Pre-layout SI : Updated Topology for Data Line MCU/ROM
      • Corrective Action:
      • Added 47 ohms series termination resistor
    12. Pre-layout SI: New Simulation Graph for Data Line MCU/ROM MCU as driver and ROM as receiver
    13. Pre-layout SI: New Simulation Graph for Data Line MCU/ROM ROM as driver and MCU as receiver
    14. Pre-layout SI : Topology for Data Line MCU/RAM
    15. Pre-layout SI : Simulation Graph for Data Line MCU/RAM MCU as driver and RAM as receiver OBSERVATIONS: Ringing is more
    16. Pre-layout SI : Simulation Graph for Data Line MCU/RAM RAM as driver and MCU as receiver
    17. Pre-layout SI : Updated Topology for Data Line MCU/RAM
      • Corrective Action: Added 47 ohms series termination resistor
    18. Pre-layout SI: New Simulation Graph for Data Line MCU/RAM MCU as driver and RAM as receiver
    19. Pre-layout SI: New Simulation Graph for Data Line MCU/RAM RAM as driver and MCU as receiver
    20. Post-layout SI : Topology for RW Signal MCU as driver  ROM and NOT Gate as receiver
    21. Post-layout SI : Simulation Graph for RW Signal OBSERVATIONS: Waveform is not monotonic MCU as driver  ROM and NOT Gate as receiver
    22. Post-layout SI : Updated Topology for RW Signal
      • Corrective Action: Added 47 ohms series termination resistor
    23. Post-layout SI : New Simulation Graph for RW Signal MCU as driver  ROM and NOT Gate as receiver
    24. Cross Talk Analysis 0ns Pulse Step Offset 0.5 Pulse Duty Cycle 12MHz Pulse Clock Frequency 100mil Minimum Coupled Length 0.1pF Min Neighbor Capacitance 30mil Geometry Window Value Variable Simulation Preferences
    25. Cross Talk Analysis – Results 13.53 15.98 14.49 19.48 U14 18 DQ<6> U13 J1 DQ<7> 14.59 16.16 15.11 19.9 U14 16 DQ<4> U13 J1 DQ<7> 2.43 19.89 2.47 31.89 U14 18 DQ<6> U14 19 DQ<7> 3.325 21.93 3.12 32.28 U14 16 DQ<4> U14 19 DQ<7> 114.4 152.1 104.1 142.3 U13 J2 DQ<6> U13 J1 DQ<7> 118.4 155.6 101.8 147.5 U13 K2 DQ<4> U13 J1 DQ<7> 244.6 266.3 200.6 267.2 U13 J2 DQ<6> U14 19 DQ<7> 249.9 276 201.5 277.7 U13 K2 DQ<4> U14 19 DQ<7> LSEvenXtalk (mV) LSOddXtalk (mV) HSEvenXtalk (mV) HSOddXtalk (mV) Aggr Drvr Aggr XNet Victim Drvr Victim XNet
    26. SSN Analysis – Simulation Preferences 0ns Pulse Step Offset 0.5 Pulse Duty Cycle 12MHz Pulse Clock Frequency 0GHz Cutoff Frequency 0.1pF Min Neighbor Capacitance 30mil Geometry Window Simulation Preferences – 12 MHz
    27. SSN Analysis - Results 110.5 gndbus 461 pwrbus U16 104 A<18> 110.5 gndbus 461 pwrbus U16 105 A<17> 110.5 gndbus 461 pwrbus U16 106 A<16> 110.5 gndbus 461 pwrbus U16 110 A<15> 110.5 gndbus 461 pwrbus U16 111 A<14> 110.5 gndbus 461 pwrbus U16 112 A<13> 110.5 gndbus 461 pwrbus U16 113 A<12> 110.5 gndbus 461 pwrbus U16 115 A<11> 110.5 gndbus 461 pwrbus U16 116 A<10> SSNFall (in mV) GroundBus SSNRise (in mV) PowerBus Drvr Net
    28. EMI Analysis
    29. EMI Analysis – Topology for SQW Signal FPGA as driver  MCU as receiver
    30. EMI Analysis – New Topology for SQW signal FPGA as driver  MCU as receiver Added termination resistor of 33 ohms
    31. EMI Analysis – Simulation Graph for SQW signal
    32. Conclusion
      • Pre-Layout and Post Layout analysis helped to eliminate signal integrity issues and reduce the EMI.
      • EMI Analysis helped to analyze the frequency spectrum of the signals
      • Able to eliminate the use of external costly EMI shielding material in the product.
    33. Q&A
      • Q & A
    34. Mohit Jain [email_address] +91-80-67064432 © 2008 MindTree Limited Imagination Action Joy www.mindtree.com Ravindra Munvar [email_address] +91-80-67065617 www.mindtree.com

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