Semicon Greater China Presentation Complete Eng (2)

2,543
-1

Published on

Semiconductor Market Update by SEMICON 2010/2011

0 Comments
1 Like
Statistics
Notes
  • Be the first to comment

No Downloads
Views
Total Views
2,543
On Slideshare
0
From Embeds
0
Number of Embeds
1
Actions
Shares
0
Downloads
156
Comments
0
Likes
1
Embeds 0
No embeds

No notes for slide

Semicon Greater China Presentation Complete Eng (2)

  1. 1. Semiconductor Industry Outlook & SEMICON Update March 16, 2011
  2. 2. Agenda• Semiconductor Industry Outlook• SEMICON Show Update - Taiwan & South East Asia - Other Regions
  3. 3. Semiconductor Industry Outlook Daniel Tracy, Sr. Director, Industry Research & Statistics March 16, 2011
  4. 4. Overall Market Outlook
  5. 5. Semiconductor Industry Outlook:2010 was a Record Year $375 100% Global Semiconductor Revenue US $B $350 319 330 Annual Growth % (line graph) $325 298 75% $300 $275 248 256 249 $250 228 226 50% 213 $225 204 (bar graph) $200 166 25% $175 150 139 141 $150 $125 0% $100 $75 -25% $50 $25 $0 -50% 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011F 2012F Semiconductor Revenue Annual GrowthSource: SIA/WSTS historical year end reports, SIA November 2010 Forecast
  6. 6. 2011 SemiconductorRevenue Forecasts 11.0% Henderson Ventures (Mar 11) 10.0% IC Insights (Jan 11) 8.1% VLSI Research (Jan 11) 8.0% Semico Research (Jan 11) 6.0% Future Horizons (Dec 10) 6.0% SIA (Nov 10) 5.1% iSuppli (Oct 10) 4.6% Gartner (Dec 10) 4.5% WSTS (Nov 10)0% 2% 4% 6% 8% 10% 12%Source: SEMI
  7. 7. Semiconductor Investments
  8. 8. Worldwide Fab Capacity:Expansion Rebounds Taiwan Worldwide Installed Capacity In Millions (without Discretes) SE Asia 200mm Equivalent wafers/month Change in % S. Korea 18 23% 26% 16 24% Japan 19% 22% 14 20% Europe & 12 14% 15% 18% Mideast 13% 16% China 10 14% 10% 8 8% 9% 7% 12% 7% 10% Americas 6 8% 4 3% 6% Change 1% 4% 2 2% 0 -4% 0% -2 -2% -4% -4 -6% 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 Source: SEMI World Fab Database Reports (February 25, 2011)
  9. 9. 300 mm Fab Investments:Lead the Capacity Growth 300 mm Installed Capacity Thousands Wafers/month 1000 900 800 700 600 500 400 300 200 100 S.Korea Taiwan 0 Japan Americas 20 1 China 20 0 1 20 9 1 20 20 8 0 SE Asia 20 7 0 20 6 0 20 5 0 Eur&M.East 0 04 20 3 0 02 01 20 00 99 20 20 19Source: SEMI World Fab Forecast November 2010
  10. 10. Equipping Fabs: Top Spenders Companies that spend over $900M/Year on equipment 2006 2007 2008 2009 2010 2011 2012 9 10 6 3 9 9 9 Samsung Samsung Samsung Samsung Samsung Samsung Samsung Intel Intel Intel Intel Intel Intel Intel Hynix Hynix Hynix Hynix Hynix Hynix TSMC TSMC TSMC TSMC TSMC TSMC Powerchip Powerchip Globalfoundries Globalfoundries Globalfoundries Globalfoundries Globalfoundries Sony Toshiba Toshiba Toshiba Toshiba Toshiba Toshiba UMC UMC UMC Elpida Elpida Micron Micron Micron Micron Micron Micron SMIC SMIC NanYa NanYa Share 65% 71% 60% 49% 73% 75% 79% of total WW SEMI World Fab Forecast Database Reports (February 25, 2011p spenders (including JVs, alliances and recent mergers), based on share of known contribut
  11. 11. SEMI® Equipment Forecast (update) By Market Region N. America Japan Taiwan Europe S.Korea China ROW $50 $45.81 $47.14 US$ Billions $45 $42.77 $40 $39.54 $35 $29.52 $30 $25 $20 $15.92 $15 $10 $5 $0 2007 (A) 2008 (A) 2009 (A) 2010 (A) 2011 (F) 2012 (F) ROW 3.05 2.61 1.44 3.85 4.31 4.89 China 2.92 1.89 0.94 3.64 4.12 5.30 S.Korea 7.35 4.89 2.60 8.33 8.05 9.54 Europe 2.94 2.45 0.97 2.32 3.24 4.37 Taiwan 10.65 5.01 4.35 11.20 11.60 10.34 Japan 9.31 7.04 2.23 4.45 5.28 4.88 N. America 6.55 5.63 3.39 5.75 9.21 7.82 Totals may not add due to roundingSource: SEMI, March 2011
  12. 12. SEMI® Equipment Forecast (update)By Segment Wafer Process Assembly & Pack. Test Other $50 $47.14 $45.81 $45 $42.77 $39.54 $40 $35 US$ Billions $30 $29.52 $25 $20 $15.92 $15 $10 $5 $0 2007 (A) 2008 (A) 2009 (A) 2010 (A) 2011 (F) 2012 (F) Other 2.92 2.00 1.11 1.99 2.03 2.30 Test 5.05 3.45 1.55 4.15 3.76 4.08 Assembly & Pack. 2.84 2.04 1.41 3.88 2.97 3.31 Wafer Process 31.95 22.03 11.84 29.53 37.05 37.45 Totals may not add due to roundingSource: SEMI, March 2011
  13. 13. Regional Silicon Forecast: Asia-Pac’s share is >50% Total Silicon Area Shipments 11,000 10,000 Millions of Square Inches 9,000 8,000 7,000 6,000 5,000 4,000 3,000 2,000 1,000 0 95 96 97 98 99 00 01 02 03 04 05 06 07 08 09 20 0 20 F F 1 11 12 19 19 19 19 19 20 20 20 20 20 20 20 20 20 20 20 North America Japan Europe Asia Pacific Includes polished and epi wafers. Excludes non-polish, reclaim and SOI.Source: SEMI SMG through 2010; SEMI forecast
  14. 14. LED dedicated Fabs Changing LED Landscape: Year (begin operation) 2001 2006 2011 (est) Count Volume fabs 35 63 137 Capacity in 2-inch EQs w/m 664,800 1,639,200 6,844,256 Americas Europe/Mideast 4 5 7 1 2 5 SKorea 4 9 14 Japan 7 10 13 China 6 15 57 Taiwan 13 22 39 SEAsia 0 0 2Source: SEMI Opto/LED Fab Forecast, February 2011
  15. 15. Fab Investments and Activities
  16. 16. Taiwan Fab Capacity – Foundry todrive capacity growth Taiwan Fab Capacity - Foundry & DRAM 2,000 1,800 1,600 8" equiv wafer K/month 1,400 Analog 1,200 Discrete Foundry 1,000 Logic 800 Memory MEMS 600 Other 400 200 0 2007 2008 2009 2010 2011 2012 Source: SEMI World Fab Forecast, Feb. 2011
  17. 17. Foundry Capacity Trend – TaiwanLeads the pack Worldwide Foundry Capacity Trend5,000,0004,500,0004,000,0003,500,000 Taiwan3,000,000 SE Asia Korea2,500,000 Japan Europe & Mideast2,000,000 China1,500,000 Americas1,000,000 500,000 0 2007 2008 2009 2010 2011 2012Source: SEMI World Fab Forecast, Feb. 2011
  18. 18. Taiwan Fab Spending – Foundry &DRAM-driven Taiwan Fab Spending by Product Type 12000 10000 2320 3920 3155 8000 Other US$ Million 8380 MEMS Memory 6000 Logic Foundry 8074 Discrete 4000 3641 1130 6237 6930 Analog 2000 2711 2777 1576 0 2007 2008 2009 2010 2011 2012 Source: SEMI World Fab Forecast, Feb. 2011
  19. 19. Taiwan Foundry: 2011 SpendingRemains Strong• Taiwan foundries’ fab spending reached a record level of $6.7B in 2010 and we expect overall spending to exceed $8.7 billion this year.• Aggressive capacity plan and technology roadmap continue to drive foundry’s investment.• With 28 nm/40 nm technology investment, foundry sector is expected to outgrow overall semiconductor market.• Market dynamics: IDM’s fab-lite strategy and the surging demand for mobile devices continue to drive foundry business.
  20. 20. TSMCCAPEX• 2010 capex at $5.9 billion; $5.8B for foundry business and $100M for new business (PV and LED)• 2011 capex is planned at $7.8B (+32% YoY), while 81% of that will dedicate to 65nm/40nm/28nm technology and also 20nm/14nm development.Production & Capacity• Demand remains certain for specialty technology and advanced nodes.• Strong capacity growth to continue in 2011, with 300mm capacity expected to grow 35%.• LED lab & fab is almost completed. PV fab will be completed in mid 2011.Technology development• 28 nm adoption is faster than 40nm at the similar stage.• New projects in 2011 pipeline will include development of 28 nm, 20 nm, 14 nm, 10 nm and even 7 nm nodes.• 450mm fab plan revealed with pilot line planned at Fab 12 P6 in 2013/2014 and volume production line at Fab 15 P5 in 2015/2016.
  21. 21. UMCFab investments• Similar capex level of $1.8B in 2010 and 2011• Continue to add capacity for 65/55nm at Fab 12i• Production has started at Fab 12A P3/P4• Fab12A investment includes 40/45 capacity and 28 nm development.Production ,Technology & Capacity• 40/45nm revenue contribution will increase quarter by quarter to reach 10% in second half of 2011.• 28nm pilot will start in mid 2011 and mass production scheduled in 2012.• Overall 12” capacity will grow 25% in 2011.
  22. 22. DRAM: 3x/4xnm Nodes Transition• With the recent weakness of PC market and cannibalization of tablet devices, DRAM sector slows down in 2H10.• Nodes transition plans to 40 nm class and below are somehow disturbed by fast price erosion with some accelerating their migration and others may delaying.• Taiwan DRAM sector would only show technology buy rather than capacity buy in 2011.• The availability of immersion tools remains the bottleneck of technology migration and capacity expansion plan.
  23. 23. InoteraProduction• Wafer shipments reached 275K in 4Q10 (300mm-equiv.), up 20% quarter over quarter• Bit growth in 1Q11 is expected to be 40%-50% QoQ due to 42/50nm ramp.Technology & Capex• Capex to come down from $1.75B in 2010 to $560M in 2011.• Majority of required immersion tools for 130K capacity (42 nm) are installed and in production.• Plan to fully convert the vast majority of wafer starts to 42nm by around mid-2011.• 3xnm pilot runs of 4Gb DDR3 DRAM are expected to commence around mid-2011.
  24. 24. NanyaTechnology• Capex to come down from $730M in 2010 to $400M in 2011.• 42 nm mass production started in Oct. 2010. – 42 nm will have 53% more die output per wafer than 50 nm.• 3xnm pilot run to start in 2Q 2011.Production• Fab 3A: 50K wafer starts by the end of ’10, will reach 60K in mid 2011.• Company to focus more on Server DRAM, Consumer DRAM and Mobile DRAM products
  25. 25. Rexchip• Capacity was expanded to 85K wpm and 45 nm transition is on schedule with full conversion completed in early 2011.• 30 nm class node is expected to start pilot production in 1H11 and mass production in second half.• R2 fab production schedule has be postponed to 2012.• 2011 capex shall be less than half of that for 2010.
  26. 26. Taiwan LED Manufacturers: Growing Investments Epistar • Plans to ramp up capacity by 30% in 2011 after 30-40% capacity growth in 2010. • Two new LED JV fabs in China (Changzhou and Xiamen) shall come on line in 2011. • Capacity expansion in Pan-Epistar Group (including Huga, Tekcore and Nanya) will continue in 2011. Lexstar • Aggressive ramp of epi capacity from 30K/M to 130K/M in Hsinchu with the adoption of 6” MOCVD reactors. • New LED epi/chip fab in Suzhou, China is expected to come online in 1Q 2011. TSMC • Invest $175M to build a LED lighting R&D center in Hsinchu. Facility is almost completed. Production shall start in 2Q 2011. Tyntek • Started to invest in LED epi capacity with two new lines in Taichung Taiwan and Fuzhou China. Formosa Epitaxy • Taiwan fab expansion plan is still ongoing. • New fab in Yangzhou China has come on line in 4Q10 and plans to have 50 MOCVD installation by the end of 2011. Genesis Photonics • New fab 3 in Tainan to commence construction in October 2010. • New JV project in Kunshan, China will come online in 2H11 with 50 MOCVD installation plan.Source: SEMI, Company announcements, and DigiTimes
  27. 27. Singapore/Southeast Asia FabsGlobalFoundries• 300 mm Fab 7 upgrade and expansion• 200 mm Fab3 and 5 upgrade and expansionIM Flash• Ramping production; key driver in Southeast Asia fab capexTECH Semiconductor• On-going upgrade to 42 nmUMC• Capacity expansion and upgrade of UMC Fab12iInfineon• Expansion of 200 mm fab in Kulim
  28. 28. Backend Investments and Activities
  29. 29. Taiwan Packaging: Strong growth• High utilization rates, especially for advanced packaging• 2010 capex: record level for some companies• 3D packaging and copper bonding wire are key drivers in capital spending
  30. 30. ASEOutlook• Small unit shipment growth in 4Q• Progress/activity with customers from JapanCAPEX• ~$820M through 3Q, 4Q= $60M to $70M• 2011= ~$700M to $850M – Majority for flip chip, copper wirebond, and low pin countTechnology• See more European and U.S. customers “picking up pace” with copper wirebonding in 2011• TSV: investing R&D, waiting for mainstream
  31. 31. PowerTechOutlook- Expect 4Q to be slightly better than Q3CAPEX- 2010 Capex at NT$12B (approximate $400M)- 2011 plan similar as 2010 and first NT$3B (approximate $100M) would be released in Q1 for leading technologyTechnology and 3D IC activitiesPTI supports various types of 3D IC technologies, such as FC- C4,copper pillar, wirebond stacking/MCP up to 16 chips, PoP, and TSV- Equipment for TSV process development & pilot line for 3- 5K monthly wafer capacity expect to be installed in Q1and Q2 2011- Plans to build an advanced 3D IC backend factory in 2011
  32. 32. SPILCAPEX – 2010 Capex at NT$17B,or ~$500M – 2011 plan about NT$10B or ~$320M – Added 48 wire bonders in Suzhou in 3Q – 668 wirebonders pushed out from 4Q to 2011Technology and 3D Activities – 16-die stack for Flash – Package-over-Package, F/C CSP with wirebond – Very early stage TSV (logic + memory) – 3D SIP F/C BGA with stacked die
  33. 33. Southeast AsiaPackaging Materials• Largest regional market for packaging materials• Forecasting about $5.6 billion in spending for 2011Assembly & Test Equipment• #1largest regional market• 2011 outlook – ~$600 million in spending for A&P equipment – $850 million to $900 million for Test equipment
  34. 34. Regional Market Summary
  35. 35. SEMI® Equipment Forecast (update) By Market Region N. America Japan Taiwan Europe S.Korea China ROW $50 $45.81 $47.14 US$ Billions $45 $42.77 $40 $39.54 $35 $29.52 $30 $25 $20 $15.92 $15 $10 $5 $0 2007 (A) 2008 (A) 2009 (A) 2010 (A) 2011 (F) 2012 (F) ROW 3.05 2.61 1.44 3.85 4.31 4.89 China 2.92 1.89 0.94 3.64 4.12 5.30 S.Korea 7.35 4.89 2.60 8.33 8.05 9.54 Europe 2.94 2.45 0.97 2.32 3.24 4.37 Taiwan 10.65 5.01 4.35 11.20 11.60 10.34 Japan 9.31 7.04 2.23 4.45 5.28 4.88 N. America 6.55 5.63 3.39 5.75 9.21 7.82 Totals may not add due to roundingSource: SEMI, March 2011
  36. 36. SEMI® 2010 Materials Forecast By Market Region N. America Japan Taiwan Europe S.Korea China Southeast Asia $50 $45 $40 $46.10 $42.67 $44.70 $42.52 $42.85 $35 $37.25 US$ Billions $30 $34.51 $25 $28.82 $30.94 $20 $15 $10 $5 $0 2004 2005 2006 2007 2008 2009 2010F 2011F 2012F Southeast Asia 4.55 5.03 6.18 6.79 6.90 5.97 7.15 7.28 7.44 China 1.28 1.64 2.38 3.31 3.57 3.24 4.03 4.53 4.94 S.Korea 3.10 3.78 4.88 6.10 5.90 4.68 6.01 6.41 6.69 Europe 2.80 2.88 3.39 3.68 3.32 2.51 3.11 3.19 3.24 Taiwan 4.85 5.31 6.74 8.34 7.87 6.76 8.88 9.34 9.68 Japan 7.61 7.58 8.57 9.19 9.96 7.60 9.22 9.36 9.41 N. America 4.63 4.72 5.11 5.25 4.99 3.76 4.46 4.61 4.70 Totals may not add due to rounding.Source: SEMI Materials Market Data Subscription November 2010
  37. 37. Summary• Semiconductor industry recovery – Estimating 5% to 10% growth in 2011• Taiwan market – Strong investments in foundry and packaging continue in 2011 – Challenges for Taiwan’s DRAM makers. – #1 market for foundry capacity; # 2 market for 300 mm capacity – #1 region for equipment spending and currently # 2 largest market for semiconductor materials• Southeast Asia – # 1 region in spending for backend equipment and materials – +40% or more growth in fab equipment spending – Strong double-digit growth in 300 mm fab capacity over the next two years
  38. 38. Taiwan- Where great things happen
  39. 39. The Most Effective Semiconductor Event in Taiwan & SEA! Ana Li March 17, 2011
  40. 40. Agenda• SEMICON Taiwan & SEMICON Singapore 2010 Overview• SEMICON Taiwan & SEMICON Singapore 2011 Features - Technology Pavilions - Programs & Events - Marketing Promotion Opportunities• SEMICON Taiwan & SEMICON Singapore 2011 Visitor Promotion
  41. 41. Taipei World Trade Center September 7 to 9, 2011
  42. 42. General Information• Date: 10:00-17:00 Wed., Sept. 8 10:00-17:00 Thur., Sept. 9 10:00-16:00 Fri., Sept. 10• Co-organizers: Show Figures 2009 2010 Growth Number of Exhibiting Companies 520 558 7%+ Booths 1020 1150 13%+ Visitors 19,956 24,365 22%+
  43. 43. Results of Visitors • Visitors of SEMICON Taiwan 2010 - Inotera - Nanya - UMC - KYEC - ProMos - SilTerra - Maxchip - Powerchip - SPIL - MXIC - Renesas - SSMC - TSMC - AMAT, ASM, Disco, KLA, Novellus, TEL, etc. • Influential Visitors – 47% of attendees were management level or higher • Highly Qualified Audience – 49% of attendees influence purchasing decisions • High Visitor Satisfaction – 97% of visitors would like to attend future SEMICON Taiwan events
  44. 44. Why SEMICON Taiwan 2011?• A Supply-Chain Exhibition• A Technology-based Promotion Platform• A Cost Effective Solution• The Connection to the Largest Semiconductor Community in Taiwan
  45. 45. Exhibition Highlights• Technology Pavilions – 3D IC & Advanced Packaging/Testing Pavilion – Parts OEM Pavilion – New! – LED Pavilion – Green Management Pavilion – MEMS Pavilion – Secondary Market Pavilion – Advanced Processing Gallery – New! – Principal/ Representative Program – News! – CMP Pavilion – AOI Pavilion – Compound Pavilion• Country Pavilions – Cross Strait Pavilion (starting from USD 2,600!!) – Korea Pavilion – Singapore Pavilion – Scotland Pavilion
  46. 46. Technology Pavilions: All-in-One Package • Ready Exhibit + • Innovative Technology Center + • Exclusive Promotion Programs & Networking Events • Connect with Global and Local Business Value more than USD 7,000 Have it all at only USD 3,300 each booth now!!48 2011/3/18
  47. 47. Programs & Events• Program • Networking Events – Market Briefing – Gala Dinner – IC Executive Forum – Golf Tournament – MEMS Forum – 3D IC Technology Forum • Supplier Search Program – Green Manufacturing Forum Inviting TSMC, UMC & DRAM – LED Forum companies in 2011! More than 50 sessions in 2010!
  48. 48. Leadership Gala DinnerDate: Wednesday, Sep 7, 2011Location: Grand Hyatt TaipeiMore than 400 industry leaders join thebiggest annual gala dinner. It is a greatplatform for you to mingle with decisionmakers and customers.
  49. 49. Gala Dinner Attendee (partial)Company Guest Name Job TitleArdentec Corporation Shaulong Chin CTO & Vice ChairmanASE Ho-Min Tong General Manager & Chief R&D OfficerASML Tony Chao Managing DirectorCREE Inc. Walter ChenKLA-Tencor Corporation Norman Chang PresidentKYEC Mike Liang PresidentLam Research Corp. Daniel Liao President of Asia Pacific OperationsMACRONIX International Chih Yuan Lu PresidentNanya Technology Corp. Steven Shih DirectorPowerchip Technology Frank Huang ChairmanQualcomm Nicholas Yu Vice President, EngineeringRenesas Electronics Takao Akiyama Senior ManagerSPIL Carl Chen Vice PresidentTOKYO ELECTRON LIMITED Tom Tsuneishi Vice Chairman of the BoardTSMC F. C. Tseng Vice ChairmanUMC Group John Hsuan Vice Chairman & CEOVIS - Vanguard International Thomas Chang Vice President
  50. 50. Taiwan Foundry & DRAM Supplier Search Program• International leading device makers – SSMC, SilTerra and Renesas locate their next new strategic partners and service providers at SEMICON Taiwan• We target to invite TSMC, UMC & DRAM companies to attend in 2011!
  51. 51. SEMICON Golf TournamentOver 160 guests thumbed up cheerfully to initiate the annual golftournament with the mascot of SEMICON Taiwan-Jing Jing.
  52. 52. Tournament Player List No. Name Job Title Company Name 1 R.T. You Director ASE GROUP Chung-Li 2 Lorenzo Hsu Director CHIMEI INNOLUX CORP. 3 Jason Chu Ph.D. INOTERA MEMORIES, INC. 4 Wen-Sen Pan Vice President MXIC 5 Max Lin RD Manager Nan Ya Printed Circuit Board Corporation 6 Pei Ing Lee Senior Vice President Nanya Technology Corp. 7 Alex Wang President Powerchip Technology Corporation 8 Ben Tseng Vice President ProMOS TECHNOLOGIES 9 Matt Nowak Director Qualcomm CDMA Technologies 10 Scott Huang Technical Manager Rexchip Electronics Corp. 11 Samuel Liao Manager Samsung Taiwan Corporation 12 Jerry Chiu Sec. Manager Siliconware Precision Industries Co., Ltd. 13 Steve Tso SVP Taiwan Semiconductor Manufacturing Company, Ltd. 14 Chao Ying-Cheng Senior Director Taiwan Semiconductor Manufacturing Company, Ltd. 15 T. S. Wu FAB Director UMC
  53. 53. Suntec Singapore InternationalConventional & Exhibition Centre 11– 13 May 2011
  54. 54. Show Overview
  55. 55. Visitor Analysis - 2010• 51% of visitors are management level• 80% of visitors are involved in product selection Visitors are global leading semiconductor companies including: 3M, AMD, Amkor, Applied Materials, ASE, ASM, A-Star, Fairchild Semiconductors, Freescale Semiconductors, Globalfroundries, Infineon Technologies, Marvell, Micron Semiconductors, National Semiconductor, NEC Semiconductors, ON Semiconductor, Panasonic Semiconductor, PerkinElmer Singapore, Qualcomm, Renesas Semiconductor, Seagate, Soitec Singapore, StatsChipPAC, STMicroelectronics, SSMC, UMC, Unisem, UTAC
  56. 56. Why SEMICON Singapore• Gateway to the Southeast Asian semiconductor manufacturing industry• World largest Semiconductor back-end manufacturing• Biggest Test, Assembly & Packaging (TAP) market• Growing Front-end and PV manufacturing
  57. 57. SEMICON Singapore 2011 Features• Theme Pavilions • Networking Events - Printed Electronics - Opening Ceremony - LED - Exhibitor Reception - Speaker’s Luncheon - MEMS - SOLARCON • Forum and Conference – Market Trends Briefing• Country Pavilions – MEMS - France – SOLARCON - Korea – Advanced Packaging - Malaysia – Product Test Engineering - Netherlands – Wafer Processing - Singapore Technology
  58. 58. SEMICON Singapore 2011Technical Conference Agenda• 11 May 2011 • 12 May 2011 – Market Trends Briefing – SOLARCON – Market and – MEMS Forum Applications • Invited speakers: Morgan Stanley, EDB, Sustainable• 12 May 2011 Energy Development Authority – Advanced Packaging – Copper (SEDA), Ministry of Energy Wire and Mineral Resouces of Republic Indonesia, Leonics, • Invited Speakers: ASE, Singapore Intitute of STMicroelectronics, SPT, Stats Architects, SERIS Chippac – Product Test Engineering • Invited Speakers: IME, FormFactor, • 13 May 2011 Globalfoundries, Verigy, Advantest – Advanced Packaging – – Wafer Processing Technology – Copper Wire How to Improve Your Fab • Invited Speakers: Texas • Invited Speakers: TECH Instruments, KNS, Hitachi, Semiconductor, m+w Zander, KLA Hereaus, UTAC Tencor, AMAT
  59. 59. Media Exposure• EE Times Asia• The Star Online• Business Times.com• AsiaOne.com• Chip Scale Review• EM Asia• Advanced Packaging• Asian Solar• Compound Semiconductor• Global SMT & Packaging• Global SMT & Packaging India• US Tech• Recharge• Business Times (Print Ad)• Straits Times (Print Ad)
  60. 60. Marketing Promotion OpportunitiesVarious advertising opportunities to help you stand out from thecrowd!Event Sponsorship - Marketing Promotion and Advertisement -
  61. 61. Visitor Promotion Visitor 22% Web Marketing On-site Makers & Attraction IC Design Visiting Press Media Conference
  62. 62. Summary: All-in-One Package• Turn-Key Exhibit to showcase your solution• Promotion Channels to enhance your branding• Networking Events to broaden your connection• Visitor Promotion to bring you the right customers
  63. 63. SEMICON West 2011 July 12-14, 2011 San Francisco, California, USA
  64. 64. SEMICON West 2011• July 12-14, 2011• Moscone Center, San Francisco• 600+ exhibitors• 30,000+ expected attendance – 29,423 in 2010• Industries served: – Semiconductor – LED – MEMS – Photovoltaic – Printed/flexible electronics – Related micro- and nano- electronics
  65. 65. SEMICON West Visitor Profile: Attending Customers (sample list) • Altera • Intel • Samsung • Analog Devices • Intersil • SanDisk • Atmel • LSI • Sony • Broadcom • Marvell • STMicroelectronics • Cypress Semiconductor • Maxim • Sun Microsytems • Fairchild • Micron • Texas Instruments • Freescale • National Semiconductor • Toshiba • GLOBALFOUNDRIES • NEC • TSMC • HP • Numonyx • UMC • Hynix • nVidia • Vishay • IBM • NXP • Xilinx • Infineon • Qualcomm• 80% of visitors influence buying decisions, including 37% with final purchasing authority• 70% of visitors say that SEMICON West influences buying decisions over the next 12 months
  66. 66. SEMICON West 2011 Highlights• Keynotes/Executive Panels – Tien Wu, ASE – Luc Van den hove, imec – Executive Summit – Investor Conference• TechZONEs – Specialized exhibit areas covering: • 3D IC • LED, MEMS, printed/flexible electronics (Extreme Electronics) • Semiconductor design, EDA, and manufacturing services • Secondary equipment and services • Advanced materials• Co-located with Intersolar North America
  67. 67. Program Highlights SouthOne Extreme Electronics• TechXPOTs – Four stages: two South Hall, two North Hall• Keynotes/Executive Panels• PV Fab Managers Forum• SEMI International Standards meetings and workshops• Partner Events South Hall NorthOne NorthTwo – Gartner/SEMI Market Symposium – IMAPS/SEMI Packaging Workshops – ATE Test Vision Workshop – ITRS meetings North Hall
  68. 68. Special Exhibiting Opportunities• TechZONE Pavilions – Design and Manufacturing Services (Advanced Technology Manufacturing) – Advanced Materials – 3D IC – Secondary Equipment and Services – "Extreme Electronics" • LED • MEMS • Printed/Flexible Electronics
  69. 69. TechZONE Features/BenefitsExclusive Features Benefits• Dedicated pavilion exhibit area • High-traffic exhibit location to• All-inclusive exhibit display/demo showcase your solutions and station packages available services• Company recognition/visibility in • All-inclusive, low cost pre-show promotions • Identification with critical industry• Additional company visibility issues and technologies onsite (signs, advertising) • Inclusion in exclusive pre-show• Access to exclusive sponsorships and at-show traffic-building and exhibitor opportunities promotions
  70. 70. SEMICON Japan 2011 December 7-9, 2011 Makuhari Messe, Chiba, Japan
  71. 71. SEMICON Japan 2011• December 7-9, 2011• Makuhari Messe, Halls 1-8• 1,000+ exhibitors, 2,500 booths• 70,000+ expected attendance (3 days)
  72. 72. SEMICON Japan 2011 Facts• 35th Year (2011)• Worlds largest semiconductor equipment and materials trade show• New: "Power of Asia" Front-end Equipment & Parts Special Exhibits Zone Combined Front-end Facility & Materials Back-end Equipment , Facility & Materials
  73. 73. "Power of Asia"• Exhibits and events focused on Asian markets and cross-regional cooperation – Showcase for Asian companies, delegations – Networking, relationship-building events designed to strengthen communications and connections between Asian and Japanese companies – Information exchange
  74. 74. "Power of Asia"• Power of Asia Event Plans – Asian Parts Suppliers Pavilion – Asian Business Development Pavilion – Asian Manufacturing Services Pavilion – Power of Asia Presentation Stage – Keynote – Seminars/business programs – "Asian Night" Networking Event
  75. 75. Asian Parts Suppliers Pavilion• Dynamic new exhibiting opportunity connecting Asian parts and component suppliers with Japanese equipment companies• Benefits – Meet with senior buyers from leading Japanese equipment companies – Presentation stage time – Private meeting rooms – Networking lunch – Open discussion tables – SPECIAL BOOTH PRICING Invited Equipment Customers include:
  76. 76. Asian Business Development Pavilion• Exhibiting opportunity for regional government, trade, and business development organizations to meet Japanese companies looking to expand/build overseas operations• Benefits – Meet with leading Japanese companies – Presentation stage time – Private meeting rooms – Networking party (Asian Night) – SPECIAL BOOTH PRICING
  77. 77. Asian Manufacturing Services Pavilion• Exhibiting opportunity for semiconductor manufacturing services companies, including subcontractors, test/packaging houses, fabless, and foundries to connect with Japanese customers• Benefits – Meet with leading Japanese companies seeking manufacturing services – Presentation stage time – Private meeting rooms – Networking party (Asian Night) – SPECIAL BOOTH PRICING
  78. 78. Special Pricing for SEMICON Japan 2011"Power of Asia" Pavilions
  79. 79. SEMICON Russia 2011 May 31-June 2, 2011 Moscow, Russia
  80. 80. Russian market Outlook• Government initiatives to strengthen the semiconductor industry in Russia• Rusnano investing into Semiconductors, PV, Plastic Electronics and LED• Sitronics / Mikron to move to 90nm with STM and plans to go to 65/45nm• Skolkolov to be built as the Russian “Silicon Valley” near Moscow• LED given priority by the government. First fab (Octagon) being built now.• Several projects for PV grade polysilicon• Build-up of a competitive PV industry in planning
  81. 81. Profile• SEMICON Russia – 1500+ professional attendees – 30+ countries represented – 69% of attendees are from the Russian Federation – 72% represent Management Level – 180+ exhibiting Companies• Programs and Events – Semiconductor Market Forum – Photovoltaic Market Forum – TechARENA
  82. 82. SEMICON Russia 2011 Focus• Semiconductor Front-End• More than Moore• Packaging• LED / Solid State Lighting• SEMI-Grade Poly• PV-Grade Poly• PV-Crystalline• PV-Thin Films• PV-Modules• Flexible, Printed, Plastic, Organic electronic and PV• R&D Projects
  83. 83. SEMICON Europa 2011 October 11-13, 2011 Dresden, Germany
  84. 84. SEMICON Europe 2011• Date: 11-13 Oct 2011• Dresden, Germany• Co-located with: Plastic Electronics 2011 Conference and Exhibition• SEMICON Europa continues to be the most important semiconductor industry event in Europe• European market Outlook: – Investing in advanced technologies – $6 billion per year to be spent on semiconductor equipment and materials in both 2011 and 2012 – GLOBALFOUNDRIES and Infineon fabs and 240 related semiconductor companies nearby
  85. 85. Profile SEMICON Europa Programs are• SEMICON Europa is an international and pan-European event supported by: •Altis – 6000+ professional attendees •Analog Devices •Bosch – 50+ countries represented •Colibrys •CSR (Cambridge Silicon Radio) – Buying teams and engineers from all major European Fabs •Freescale •GLOBALFOUNDRIES – 50% represent Management Level •Infineon •Intel – 65% are involved in Product Selection and Purchasing Decisions •IBM •Lfoundry •Micron •Nanium• 50+ Programs and Events scheduled •Nokia •Numonyx – Technology and Business Conferences •NXP •Osram – Executive and Networking Events •STMicroelectronics •Texas – Free Technology and Standardization Sessions •Instruments •Thales •X-Fab – Educational Courses (CEI Europe) – Emerging Technologies: • Plastic Electronics Conference • Fraunhofer Microelectronics Day
  86. 86. SEMICON Europa 2011 Focus• MEMS/MST Applications / “More then Moore”• Advanced Packaging and advanced Test• LED / Solid State Lighting• Foundries Manufacturing Challenges• Fab Enhancement and Improvement• Research and Development (Science Park)• Country Pavilions (French, Saxony, Scottish and UK, US, …)• New: Flexible, Organic and Large Area Electronics, Photovoltaic, Display and Lighting
  87. 87. Plastic Electronics 2011• This is the 7th edition of the Plastic Electronics Conference, the leading International convention with focus on these new application and technologies.• 3 days conference with 600+ attendees from all regions of the world.• The leading global Conference and Exhibition for Flexible, Organic and Large Area Electronics, Photovoltaic, Display and Lighting.• The co-location of the two events offer great synergies and unique opportunities for business and collaboration between this related disciplines.• New: Dedicated Exhibition area for Plastic Electronics Suppliers
  88. 88. TOGETHER WE CAN MAKE A DIFFERENCEJoin Us Today!
  1. A particular slide catching your eye?

    Clipping is a handy way to collect important slides you want to go back to later.

×