Architecting for Hyper-Scale Datacenter Efficiency

  • 337 views
Uploaded on

Diane Bryant S. VP & GM of Intel’s Datacenter & Connected Systems Group discusses “Architecting for Hyper-Scale Datacenter Efficiency.” She reviews the newly announced Intel Atom Processor C2000 now …

Diane Bryant S. VP & GM of Intel’s Datacenter & Connected Systems Group discusses “Architecting for Hyper-Scale Datacenter Efficiency.” She reviews the newly announced Intel Atom Processor C2000 now in production, 1st “Silvermont” based SoC (System on a Chip), and the more than 50 new systems designs enabled – Microserver, Cold Storage, plus Entry Networking solutions. Diane also outlines the new Rack Scale Architecture Technologies enabled by next generation interconnect technologies using Intel silicon photonics.

More in: Technology
  • Full Name Full Name Comment goes here.
    Are you sure you want to
    Your message goes here
    Be the first to comment
No Downloads

Views

Total Views
337
On Slideshare
0
From Embeds
0
Number of Embeds
0

Actions

Shares
Downloads
26
Comments
0
Likes
1

Embeds 0

No embeds

Report content

Flagged as inappropriate Flag as inappropriate
Flag as inappropriate

Select your reason for flagging this presentation as inappropriate.

Cancel
    No notes for slide

Transcript

  • 1. Architecting for Hyper-scale Datacenter Efficiency Diane Bryant Senior Vice President & General Manager Datacenter & Connected Systems Group
  • 2. Today’s News Intel® Atom™ Processor C2000 now in production 1st “Silvermont” based SoC >50 new systems designs enabled Microserver, Cold Storage and Entry Networking New Rack Scale Architecture technologies unveiled Next generation interconnect technologies using Intel® silicon photonics
  • 3. Cloud Service Provider Environment Drives Need for Dynamic, Efficient, Workload Optimized Infrastructure 159 new services & features in 20122 >175% YoY user growth3 1. http://blog.instagram.com/post/8758396471/testing-testing; http://www.digitalbuzzblog.com/infographic-instagram-stats/ 2. Amazon year end results press release Jan 2013 3. http://www.tencent.com/en-us/content/at/2013/attachments/20130814.pdf August 2013 100M  >1B photos uploaded in <1 year1 *Other brands and names are the property of their respective owners Manage Workload Diversity Ramp New Services Support Dramatic Growth
  • 4. Software Defined Infrastructure Application-driven allocation of resources for greater efficiency Datacenter Orchestration Workload Optimized Solutions System Attributes Power Performance ThermalsSecurity Utilization NETWORK STORAGE SERVER Cloud Services
  • 5. I/O Intensive ComputeIntensive Cold Storage Workload Optimized Solutions E- Commerce Dedicated Hosting Enterprise Resource Planning Dynamic Modeling and Simulation Big DataContent Delivery and Gaming Graphics Rendering Entry Networking Edge Routing Storage De-dupe Cloud RAN Static WebMemory Caching Dedicated Hosting Cold Storage Entry Networking Static WebMemory Caching Collaboration Tools Workload Optimized Solutions Lightweight workloads require right-sized processing & low power
  • 6. Architecting for Hyper-scale Efficiency Software Defined, Workload Optimized Infrastructure PROCESSOR SYSTEM RACK End to End Innovation
  • 7. Low Power Product Direction 2011 All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. 2012 2013 2014+ Xeon E3 Sandy Bridge 32nm As low as 20W “Broadwell” 14nm Xeon E3 Ivy Bridge 22nm As low as 17W Xeon E3 Haswell 22nm As low as 13W Atom S1200 32nm As low as 6W “Denverton” 14nm “Broadwell” SoC 14nm Atom C2000 22nm As low as 6W ANNOUNCING TODAY
  • 8. Higher Performance • Up to 7x faster1 Energy Efficient • Up to 6x higher2 performance per watt IA Software Compatibility • Leverages existing SW ecosystem Datacenter Class • 64 bit, ECC memory, Intel® Virtualization Tech Workload Optimized •13 customized configurations • Intel Quick Assist Technology Intel® Atom™ Processor C2000 Product Family 2nd Generation Workload Optimized SoCs IN PRODUCTION NOW! Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance. 1 Performance based on Dynamic Web Benchmark Performance: Atom S1260(8GB,SSD,1GbE), Score=1522. Atom C2750(32GB, SSD,10GbE), Score=11351. 2 Performance per Watt based on Dynamic Web Benchmark: Atom S1260(8GB,SSD,1GbE), Score=1522, est node power=20W, PPW=76.1 Atom C2730(32GB, SSD,10GbE), Score=8778, est node power=19W, PPW=462. Source: Intel Internal measurements as of August 2013. Refer to backup for additional details. Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. ANNOUNCING TODAY
  • 9. Extending Low Power IA Into New Segments WIRELESS LINE CARDS ROUTERSSWITCHES MICROSERVERS COLD STORAGE NETWORK SECURITY APPLIANCES 8C, Intel QuickAssist Technology 8C, 64GB, 4x2.5GbE 2C, 7W, 10yr reliability 4C, <15W, 6 SATA 2C, Fanless, 7-yr supply 4C, Intel QuickAssist Technology 8C, Intel VT And more configurations available…
  • 10. Mats Karlsson Vice President and Head of Architecture and Process, Group Function Technology *Other brands and names are the property of their respective owners.
  • 11. © Ericsson AB 2013 | 2013-09-04 | Page 12
  • 12. © Ericsson AB 2013 | 2013-09-04 | Page 13 Ericsson cloud system The Network Enabled Cloud Operator network Network & DC Infrastructure Ericsson Cloud Execution Environment Ericsson Cloud Manager Ericsson Cloud System ApplicationApplicationApplication Application Application Application Innovation & TTM Performance Efficiency
  • 13. © Ericsson AB 2013 | 2013-09-04 | Page 14 Ericsson and INTEL Announcing the Intel Atom C2000 in Ericsson’s cloud infrastructure Common SW framework Energy efficiency Intel VT, Intel DPDK Scalable product portfolio
  • 14. Architecting for Hyper-scale Efficiency Software Defined, Workload Optimized Infrastructure PROCESSOR SYSTEM RACK
  • 15. High Density System Innovation ANNOUNCING TODAY Intel® Ethernet Switch FM5224 Compressed Memory Connector Shared Management Architecture Up to 30%1 Server Density Memory Density Up to 2x 3 Power & Components Up to 75% 2 Reduction *Other brands and names are the property of their respective owners Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to www.intel.com/performance. 1. Based on 2.5G port count compared to the BCM56540 2. Based on 8 node configuration where 8 BMCs are replaced by a two component MMC solution 3. Based on Intel SSI based Tiger Cove CRB using Compressed Footprint Connector (CFC) compared to a standard DIMM connector EcosystemEnabling MMC SoC SoC SoC SoC SoC SoC SoC SoC
  • 16. 50+ Atom C2000 System Designs Microserver Cold Storage Entry Network *Other brands and names are the property of their respective owners.
  • 17. Germain Masse Chief Operating Officer *Other brands and names are the property of their respective owners.
  • 18. © 2013 ovh.com. All rights reserved 2013 10 servers 150 000 servers 1999 10 000 servers 70 000 servers Breathtaking GrowthRacks of servers < 1h delivery
  • 19. OVH.com © 2013 ovh.com. All rights reserved 150 000 physical servers 12 datacenters *Netcraft source, nov. 2012 3rd worldwide hosting provider*
  • 20. © 2013 ovh.com. All rights reserved Innovation for Technology and Cost Leadership Watercooling Unique No Rack design SSD based High performance storage Own high speed WW fibre n/w 2 Tbps capacity
  • 21. OVH.com deploying Intel Atom C2000 © 2013 ovh.com. All rights reserved Storage Servers (Deep archiving) Entry-level Dedicated Servers Memcache Servers Higher Performance Larger Memory Capacity Low Power Consumption Vs. Intel® Atom™ Processor S1200Vs, Intel® Atom™ Processor S1200 Vs. Intel® Atom™ Processor S1200
  • 22. Intel® Atom™ Processor C2000 Collaborating with Leading Cloud Providers & Hosters “The right size performance, power efficiencies and data center class features makes the Intel Atom Processor C2000 the right choice for our entry level dedicated hosting service that will launch this year.” Robert Hoffmann, CEO Hosting, United Internet Multiple joint R&D projects: Specialized rack architecture Multi-tier data storage Broad use of Xeon in storage today and evaluating Atom C2000 for entry storage *Other brands and names are the property of their respective owners.
  • 23. Architecting for Hyper-scale Efficiency Software Defined, Workload Optimized Infrastructure PROCESSOR SYSTEM RACK
  • 24. Intel® Silicon Photonics Silicon: Intel® Atom™ & Xeon Open Network Platform CPU / Mem Modules Intel Rack Scale Architecture Innovation Orchestration ANNOUNCING TODAY *Other brands and names are the property of their respective owners.  New MXC connector Up to1.6 Terabits per second bandwidth1  New “ClearCurve” fiber Enables >3x cable length (300m) at 25Gbps2 Higher Bandwidth, Modularity & Density 2ClearCurve fiber operating at 300 meters was tested using 300 meters of new ClearCurve fiber connected to an Agilent Bit Error Rate Tester (BERT) that included a N4960A-CJ1 controller, N4951A-H32 pattern generator and N4952A-E32 error detector. 1Measured per fiber bandwidth on an Agilent Bit Error Rate Tester (BERT) that included a N4960A-CJ1 controller, N4951A-H32 pattern generator and N4952A-E32 error detector. MXC connector used had 32 fibers for an actual data rate of .8 tera-bits. Mechanical models and CAD simulations show that the MXC can accommodate up to 64 fibers for a theoretical total bandwidth of 1.6 Tera-bits per second.
  • 25. Live Rack Scale DEMO
  • 26. Intel Rack Scale Architecture Growing Range of Implementations January Open Compute Project April Project Scorpio Today Next Gen Cloud Scale Architecture *Other brands and names are the property of their respective owners.
  • 27. Chris Phillips General Manager, Windows Server & System Center Program Management *Other brands and names are the property of their respective owners.
  • 28. Innovation Cycle at Global Scale drives ‘Cloud OS’
  • 29. ‘Cloud OS’ - Blurring lines within, across racks
  • 30. Software Compatibility Global Ecosystem Technology Portfolio Architecture Consistency Workload Optimized Silicon Most Energy Efficient Transistors Intel’s Unmatched Assets
  • 31. Today’s News Intel® Atom™ Processor C2000 now in production 1st “Silvermont” based SoC >50 new systems designs enabled Microserver, Cold Storage and Entry Networking New Rack Scale Architecture technologies unveiled Next generation interconnect technologies using Intel® silicon photonics
  • 32. Q&A Continue the Atom-C Conversation with live audiocast interviews from our launch event featuring: Advantech, Dell, HP, Intel, Portwell, and Wiwynn http://intel.ly/inteldc7 *Other brands and names are the property of their respective owners.
  • 33. Legal Disclaimers Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase. Relative performance for each benchmark is calculated by taking the actual benchmark result for the first platform tested and assigning it a value of 1.0 as a baseline. Relative performance for the remaining platforms tested was calculated by dividing the actual benchmark result for the baseline platform into each of the specific benchmark results of each of the other platforms and assigning them a relative performance number that correlates with the performance improvements reported. SPEC, SPECint, SPECfp, SPECrate. SPECpower, and SPECjbb are trademarks of the Standard Performance Evaluation Corporation. See http://www.spec.org for more information. Intel® Hyper-Threading Technology (Intel® HT Technology): Available on select Intel® Core™ processors. Requires an Intel® HT Technology-enabled system. Consult your PC manufacturer. Performance will vary depending on the specific hardware and software used. For more information including details on which processors support HT Technology, visit http://www.intel.com/info/hyperthreading. Intel® Turbo Boost Technology: Requires a system with Intel® Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on select Intel® processors. Consult your system manufacturer. Performance varies depending on hardware, software, and system configuration. For more information, visit http://www.intel.com/go/turbo Intel® Enhanced Intel SpeedStep® Technology: See the Processor Spec Finder at http://ark.intel.com/ or contact your Intel representative for more information. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to: http://www.intel.com/products/processor_number Intel® products are not intended for use in medical, life-saving, life-sustaining, critical control, or safety systems, or in nuclear facility applications. All dates and products specified are for planning purposes only and are subject to change without notice. Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel's current plan of record product roadmaps. Copyright © 2013 Intel Corporation. All rights reserved. Intel, the Intel logo, Xeon, Atom and Intel Core are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. All dates and products specified are for planning purposes only and are subject to change without notice *Other names and brands may be claimed as the property of others. * Other names and brands may be claimed as the property of others.
  • 34. Legal Disclaimers INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm * Other names and brands may be claimed as the property of others.
  • 35. Performance Configuration Details Dynamic Web Perfomance: Atom S1260: DBC SDP w/Intel® Atom™ S1260 (2.0GHz, 2C), Hyper-Threading Enabled, 1x8GB DDR3-1333 MHz UDIMM ECC, BIOS version D134.4, Fedora* 17, Linux Kernel 3.3.4-5fc.x86_64, Apache 2.2.22, PHP 5.4.7, Boot Drive 1x 150GB SSD, Addl Drive 2x 150GB SSD, 2xGbE, Score: 1522 Atom C2xxx: MPK SDP w/Intel® Atom™ C2xxx (8C), Turbo Disabled, 4x8GB DDR3-1600 MHz UDIMM ECC, BIOS version 18D05, Fedora* 17, Linux Kernel 3.3.4-5fc.x86_64, Apache 2.2.22, PHP 5.4.7, Boot Drive 1x150GB SSD, Addl Drive 1x 800GB SSD, 1x10GbE, Score: 11109 Perfomance Per Watt: Atom S1260: FOR.INTEL.cpu2006.1.2.ic13.1.linux64.01june2013 Supermicro* 5017A-EF with one Intel® S1260 processor (2-core 2.0GHz), EIST Enabled, Hyper-Threading Enabled, 8GB memory (1x 8GB DDR3-1333 UDIMM ECC), 250GB SATA 7200RPM HDD, Red Hat Enterprise Linux 6.4 . Estimated score:int_rate_base2006=18.7. Est. Power=20W Atom C2xxx: FOR.INTEL.cpu2006.1.2.ic13.1.linux64.01june2013 Intel® Mohon Peak Alpha platform with one Intel® Avoton processor (8-core), Turbo Boost Disabled, 16GB memory (2x 8GB DDR3-1600 UDIMM ECC), 250GB SATA 7200RPM HDD, Red Hat Enterprise Linux 6.4. Estimated score:int_rate_base2006=69, Est. Power=19W