Your SlideShare is downloading. ×
IBM Special Announcement session Intel #IDF2013 September 10, 2013
Upcoming SlideShare
Loading in...5
×

Thanks for flagging this SlideShare!

Oops! An error has occurred.

×

Introducing the official SlideShare app

Stunning, full-screen experience for iPhone and Android

Text the download link to your phone

Standard text messaging rates apply

IBM Special Announcement session Intel #IDF2013 September 10, 2013

612
views

Published on

Nice IBM System x announcement overview presentation from Intel IDF2013 held on September 10, 2013. …

Nice IBM System x announcement overview presentation from Intel IDF2013 held on September 10, 2013.
IBM NeXtScale System is a new dense offering from IBM. It is based on our experience with IBM iDataPlex and IBM BladeCenter along with a tight focus on emerging and future client requirements. Today we announced two components: IBM NeXtScale n1200 enclosure – a 6U enclosure that can hold up to 12 NeXtScale System servers IBM NeXtScale nx360 M4 server – a half-wide server with up to 2 processors, 8 DIMMs (256 GB), 2 PCIe 3.0 adapters, and 2 HDDs or 4 solid-state drives
Watch our North America webcast replay here:
http://event.on24.com/r.htm?e=670225&s=1&k=FC5CD17AB42385B40BCED29B8B61E2E8&partnerref=IBM09


0 Comments
1 Like
Statistics
Notes

Comments are closed

  • Be the first to comment

No Downloads
Views
Total Views
612
On Slideshare
0
From Embeds
0
Number of Embeds
1
Actions
Shares
0
Downloads
21
Comments
0
Likes
1
Embeds 0
No embeds

Report content
Flagged as inappropriate Flag as inappropriate
Flag as inappropriate

Select your reason for flagging this presentation as inappropriate.

Cancel
No notes for slide
  • The shifts in IT industry are happening at a faster pace than ever before. And these are a result of numerous shifts in the world. Let’s talk about these first. The marketplace is evolving due to the popularity of social media, the pervasiveness of mobile devices, and the infusion of intelligence everywhere we look. This is giving rise to the need to extract value from all this intelligence and Big Data, using analytics to provide that insight and drive business outcomes, and the need to deliver all these applications in a much more expeditious and efficient way and in an environment where budgets are flat, which is why cloud is becoming so popular. At the same time we see advantages in computing in being able to bring high performance capabilities that used to only used for supercomputers now being used to analyze complex problems everywhere. Technical computing that used to only be available to large research centers is now being used to analyze anything from financial data, to areas that allow speed of design in manufacturing. Data analytics, technical computing and cloud are all an end result of social media, mobile, and intelligence embedded everywhere; creating a set of dynamics where there is a race to create new apps to extract the value of that information in ways to change business, all at a time when budgets are flat. This is creating a revolution in information that is bringing abut a new era of IT.
  • Transcript

    • 1. © 2013 IBM Corporation New Innovation in x86 Computing from IBM System x September 10, 2013
    • 2. © 2013 IBM Corporation2 Today’s Speakers Brian Connors Vice President System x Development & Lab Services Roland Hagan Vice President of Marketing IBM System x Scott Tease Director & Product Line Manager System x Technical Computing Dr Adrian Wander Director Scientific Computing Department of SFTC Cliff Brereton Director Hartree Centre Shannon Poulin Vice President, Datacenter Marketing Group Intel Corporation
    • 3. © 2013 IBM Corporation3 1) Facebook Second quarter 2013 results 2) Economist: stats from Morgan Stanley 3) IBM research Shifts in IT are happening fast, bringing a new era of IT 1.15 Billion Facebook users today1 Social Media 90% of data in the world today created in last two years alone.3 Big Data 10 billion devices by 20202 Mobile Need to analyze and extract value from massive amounts of data … provide insight and drive business outcomes
    • 4. © 2013 IBM Corporation4 High-end systems Broad portfolio to meet a wide range of client needs from infrastructure to technical computing 4 socket+ enterprise-class x86 performance, resiliency and security Integration across IBM assets in systems and SW for maximum client optimization and value Optimize space-constrained data centers with extreme performance and energy efficiency IBM PureSystemsIBM eX5 Systems IBM System x iDataPlex IBM NeXtScale IBM System x Rack & Tower IBM Flex System IBM BladeCenter IBM Strategy delivers a leadership systems portfolio Blades/Integrated systems Volume systems Dense systems
    • 5. © 2013 IBM Corporation5 AnalyticsCloud Application ready solutions to improve insight, reduce risk, speed deployment Solutions based on key ISVs such as SAP HANA & integrated IBM offerings Powerful and innovative Improve outcomes through a better understanding of business environments Designed for flexibility Cost effective cloud deployment with leadership x86 scalability Workload optimized IBM innovation in x86 for maximum performance and scalability Technical Computing Meet public, private and hybrid cloud for clients & service providers Client focus delivers solutions clients require to win  Performance & resiliency in x86 mission critical, memory intensive workloads  Scalability of compute, network and I/O to efficiently meet growing needs  Consolidation & virtualization of infrastructure to reduce cost, increase agility  Over $1 billion planned investment in x86 over three years
    • 6. © 2013 IBM Corporation6 New & optimized architectures are needed for new workloads Cloud Web 2.0 Technical Computing
    • 7. © 2013 IBM Corporation Brian Connors Vice President System x Development and Lab Services
    • 8. © 2013 IBM Corporation8 Mainframe, Mini Computer Terminals LAN/Internet Client/Server PC Mobile Cloud Big Data Social Mobile Devices Source: IDC, 2012 The Shifts are occurring rapidly, according to IDC we are at the 3rd platform
    • 9. © 2013 IBM Corporation9 Industry Partnering NeXt generation systems High performance storage – IBM GPFS Storage Server Flash/Networking – eXFlash, Virtual Fabric Energy efficiency – Water cooling – Energy aware scheduling Open industry standards – Chair, actively participate Deep relationships – Lead validation partner – Strong architecture influence – Over 100 industry suppliers Optimization – Algorithms – OS’s, hypervisors, systems – Solutions - e.g. SAP HANA Solution Provider – Technical Computing – Big Data, Cloud & Analytics – Virtual Desktop – MSP, CSP’s Involved with client – Trusted advisor – Data center efficiency – Proof of concepts – Learn and apply to new products IBM System x – Systems engineered for a changing landscape $1B Innovation Investment Client Engaged
    • 10. © 2013 IBM Corporation10 Performance Optimized Systems World Records:  4 socket TPC-C and TPC-E benchmarks  2 and 4 socket TPC-E price/performance  2 socket blade SPECvirt performance  4 and 8 socket servers for two-tier SAP #1 in installed aggregate supercomputer performance IBM Technology Leadership Enterprise X-Architecture Leadership  36 #1 eX5 benchmarks since 2010 launch IBM #1 in patents for 20 consecutive years  >6400 patents in 2012 X-Architecture 5 Generations World Records #1TPC, SAP, Spec Benchmarks IBM System x – Great Today, Engineered for Tomorrow Client Benefits and Trust  As little as three months ROI for technology refreshes  Leading x86 energy-efficient systems  Simplified workload and resource management Client Satisfaction TBR #1
    • 11. © 2013 IBM Corporation11  IBM SmartCloud Entry  IBM Application Ready Solutions  IBM Intelligent Cluster™  IBM GPFS™ Storage Server  IBM Platform Computing™ IBM System x 3650 M4 HD Big data and dense storage server High Density, 2 socket x3500 M4 Business Critical 2 socket iDataPlex® dx360 M4 HPC, 2 socket x3550 M4 Business Critical 2 socket x3650 M4 Business Critical 2 socket Platform HPC Platform LSF Platform Symphony Hyperscale, density, flexibility, 2 socket GPFS Storage Server 17%3 Greater Memory Speed 50%1 More Cores & Cache 50%2 Greater Performance 1 Intel Xeon E5-2600 8C & 20MB cache vs E5-2600 v2 12C & 30MB 2 Intel E5-2690 vs E5-2697 v2 3 Intel Xeon E5-2600 1600MHz vs E5-2600 v2 1866MHz IBM System x – New innovation Enhanced Systems Software and Solutions IBM NeXtScale System™ 9/10 New system for scale-out computing 9/10
    • 12. © 2013 IBM Corporation Scott Tease Director & Product Line Manager System x Technical Computing
    • 13. © 2013 IBM Corporation13 IBM NeXtScale SystemTM – Guiding principles IT Your Way Powerful Yet Simple FLEXIBILITY SIMPLICITY SCALE Scale Enabled for everyone
    • 14. © 2013 IBM Corporation14 Compute Chassis Storage Acceleration More Coming Standard Rack Primary Target Workloads  Architected for now and the future  Better density and flexibility  Compatible with standard racks  Optimized for top of rack switching  Software Defined Networking (SDN) ready  Intel® Xeon® Processor E5-2600 v2 product family  Powerful roadmap 2013 – Introducing IBM NeXtScale A superior architecture for scale-out computing Public Cloud High Performance Computing Private Cloud
    • 15. © 2013 IBM Corporation15 IBM NeXtScale – Simplicity Native eXpansion – Adding Value, not Complexity  Base node delivers robust and dense raw compute capabilities  NeXtScale’s Native Expansion capability allows seamless upgrades of the base to add common functionalities – Storage – Graphics Acceleration or Co-Processing  What is Native Expansion? No Exotic Components. No Mid-plane Dependencies. + nx360 M4 IBM NeXtScale nx360 M4 with Storage NeX Storage NeX + RAID Card + SAS Cable + HDDs + nx360 M4 PCI NeX + GPU Riser Card + GPU/Phi IBM NeXtScale nx360 M4 with Accelerator NeX
    • 16. © 2013 IBM Corporation16  6U Chassis, 12 bays  Half width component support  Up to 6 900W power supplies N+N or N+1 configurations  Up to 10 hot swap fans  Fan and power controller  Mix and match compute, storage, or GPU nodes  No built in networking  No chassis management required IBM NeXtScale n1200 Fan and power controller Front view 6 x 900W power supplies 10 x 80mm fans Rear view NeXtScale – Dense Chassis Optimizedsharedinfrastructure
    • 17. © 2013 IBM Corporation17 Simplearchitecture Power button and information LED Dual-port mezzanine card (IB/Ethernet) KVM connector Labeling tag 1 GbE ports IMM v2 port PCIe 3.0 Slot x24 PCIe 3.0 slot x8 mezz. connector 2 x CPU 8 x DIMMs Power Interposer Flexible Drive bay(s) x16 PCIe 3.0 slot NeXtScale – The Compute Node  New ½ Wide 1U 2 socket server  Intel® Xeon® Processor E5-2600 V2  Flexible slot-less I/O design  Generous PCIe capability  Open design, works with existing x86 tools  Versatile design with flexible Native Expansion options  32TB local storage (November)  GPUs/Phi adapters (2014) IBM NeXtScale n360 M4 Hyperscale Server
    • 18. © 2013 IBM Corporation18 Number of part numbers needed for the entire solution – no matter the brand of component SAVE Faster Time from arrival to production readiness 75% 1 £ ¥ € $ IBM NeXtScale – Flexibility How Do You Want Your IT to Arrive?  NeXtScale can be shipped fully configured and ready to power on – Fully racked and cabled – Labeling with user supplied naming – Pre programmed IMMs and addresses – Burn in testing before shipment at no added cost  Prefer to receive systems in boxes – no problem IBM Intelligent Cluster 1 Per Rack 105 lbs of cardboard1 54.6 ft3 of styrofoam 288 linear feet of wood 21,730 less paper inserts Customer Benefits
    • 19. © 2013 IBM Corporation IBM NeXtScale System Workload Optimized Stack for Cloud and Technical Computing 19 Cloud Technical Computing
    • 20. © 2013 IBM Corporation20 IBM NeXtScale – Flexible Designed on Open Standards = Seamless Adoption IBM ToolsCenter OpenStack Ready • Consolidated, integrated suite of mgmt tools • Powerful bootable media creator, FW updating • Deploy OpenStack with Chef or Puppet • Mirantis Fuel, SuSE Cloud, IBM SmartCloud UEFi and iMM IPMI 2.0 Compliant • Standards-based hardware that combines diagnostic and remote control; No embedded SW • Richer management experience and future-ready • Use any IPMI compliant mgt. software – Puppet, Avocent, IBM Director, iAMT, xCAT, etc. • OpenIPMI, ipmitool, ipmiutils, FreeIPMI compatible xCAT System Monitoring • Provides remote & unattended methods to assist with Deploying, Updating, Configuring, and Diagnosing • Friendly with open source tools like Ganglia, Nagios, Zenoss, etc. • Use with any RHEL/SuSE (and clones) or Windows based tools Platform Computing SDN Friendly • Workloads managed seamlessly with Platform LSF • Deploy clusters easily with Platform HPC • Networking direct to system; no integrated proprietary switching • Support for 1/10/40Gb, Infiniband, FCoE, and VFAs
    • 21. © 2013 IBM Corporation21 IBM NeXtScale – Simplicity NeXtScale will keep you in front (of the rack that is)  Cold aisle accessibility to most components  Tool-less access to servers  Remove a server without touching it’s power  Approved for 40O C operation to lower operating costs  Front-access to networking cables & switches  Simple cable routing (front or traditional rear rack cabling)  Power and LEDs all front facing Which aisle would you rather be working in? Know what cable you are pulling! Service NeXtScale from the front of the rack 65-80ºF >100 ºF!
    • 22. © 2013 IBM Corporation22 IBM NeXtScale – Scale Start at any size. Grow in any increment you want. Growing node by node?  Available direct from IBM  Optimized for availability through our partners  Install the chassis today, grow into it tomorrow Single nodes and chassis Configured racks or chassis Complete clusters and containers Want to speed how quickly you can grow?  Shipped fully assembled  Client driven, choice optimized  “Starter Pack” solutions are appliance easy, yet flexible Growing by leaps and bounds?  NeXtScale can arrive ready to power on – ‘personality’ applied  Racks at a time or complete infrastructure ready containers Single Nodes Rack (s) Chassis or Departmental Solutions Containers – ‘NeXtPods’
    • 23. © 2013 IBM Corporation23 MORE servers/rack6 2X16% Amount of power saved with Platform LSF Energy Aware4 15% One nx360 with SSDs delivers same IO perf as 355Hard Disks 3X 35% Maximize the capability of your data center floor with dense and essential IT  More servers per floor tile  Easy front access serviceability  Choice of rack infrastructure  Light weight + high performance can reduce floor loading Race Car Design – performance and cost point ahead of features/ functions  Fastest Xeon E5 2600 v2 processors  Fast memory running at 1866Mhz  Choice of SATA, SAS, or SSD on board  Open ecosystem of high speed IO interconnects 40% Less weight per system5 More High Frequency Cores1 50% Processing More cores per U than a Xeon E-5 2600 1Us7 Lower power per TFLOP of performance8 IBM NeXtScale – Scale Maximum impact per $. Per ft 2 . Per rack. Customer Benefits Memory Runs FASTER2
    • 24. © 2013 IBM Corporation24 Announce: Sep 10 2013 Shipping: Oct 28 2013 6U Dense Chassis 1U tall 1/2 Wide Compute Departmental HPC and Cloud Computing Solution PCI Native Expansion (PCI NEX) 1U (2U tall 1/2 Wide) GPU or Xeon Phi Support Storage Native Expansion (Storage NEX) 1U (2U tall 1/2 Wide) Up to 32TB total capacity 6U Chassis will support mix-match nodes IBM NeXtScale Product Roadmap Announce: Sep 10 2013 Shipping: Nov 29 2013 Shipping: 2014 More Storage More IO Options Next Gen Processors MicroServers A Lot More Coming!
    • 25. © 2013 IBM Corporation25 Primary Target Workloads  >60% more drive bay capacity vs x3650 M4 for higher throughput & ample storage  Flexible offering of SSDs & HDDs - up to 41.6 TB storage  *50% more cores & cache, 50% greater performance, 17% greater memory speed  12 Gb RAID on board for optimized RAID performance & data protection *Intel Xeon E5-2600 8C & 20MB cache vs E5-2600 v2 12C & 30MB. *Intel Test SPECjbb*2013 benchmark, 07/13. *Intel Xeon E5-2600 1600MHz vs E5-2600 v2 1866MHz Introducing System x3650 M4 HD Ultimate high density storage server, optimized for analytics and business critical workloads  High Performance & Availability  Flexible IO & storage options  Easy Setup & Serviceability  Energy Star compliance  Advanced security Data Management Big Data SAP / Analytics
    • 26. © 2013 IBM Corporation26 50%1 More Cores & Cache 50%2 More Performance 17%3 Faster Memory 40%4 Lower Power Better Price Performance System x3500 M4 1 Intel Xeon E5-2600 8C & 20MB cache vs E5-2600 v2 12C & 30MB 2 Intel E5-2690 vs E5-2697 v2 3 Intel Xeon E5-2600 1600MHz vs E5-2600 v2 1866MHz 4 Intel Server-Side Java* Energy Efficiency benchmark: Intel® Server Board S2600CP, 8/13. Improved systems with Intel Xeon processors Unlock New Performance from a Family of Trusted Systems Analytics, database, cloud, VDI iDataPlex dx360 M4 High performance & cloud computing System x3550 M4 Cloud, VDI, analytics, big data, HPC System x3650 M4 Cloud, VDI, Analytics, Database, HPC Virtualization, Cloud, Big Data Flex System x240 BladeCenter HS23 Cloud, VDI, Analytics, Database, HPC
    • 27. Re-Architecting the Data Center For a Services Oriented World Shannon Poulin Vice President, Datacenter and Connected Systems Group General Manager, Datacenter Marketing Group Intel Corporation
    • 28. Intel + IBM: Rich History of Innovation 28 System Solutions Software Solutions Networking Storage New Business + Opportunities Technology Development Bluetooth, Infiniband, PCIeG3, Xen, KVM, Java, Linux Kernel, Hadoop Industry Enablement Blade.org PCI.org Open Source Joint Collaboration eX5, BladeCenter, IBM Flex Systems & NeXtScale
    • 29. IT: Period of Transformation Focused on Productivity through automation Focused on Rapid Service Delivery through cloud & devices Focused on Cost Reduction through connectivity Computer-Centric Network-Centric Human-Centric ‘90s ‘00s Today
    • 30. INTEL CONFIDENTIAL Re-architecture of the Datacenter Needed 1: Source: Intel IT internal estimate Datacenter Today Software-defined Infrastructure Time to Provision New Service: Minutes1 Time to Provision New Service: Months1 Idea for service IT scopes Needs Balance user demands Idea for service Internet of things Private Public Self service orchestration Infrastructure resources composed Service running Manually configureManually configure devicesdevices Set up serviceSet up service componentscomponents Service running SW components assembled
    • 31. INTEL CONFIDENTIAL Software Defined Infrastructure on Intel OPEN: Standards based EFFICIENT: Intelligent and scalable AGILE: Software on high volume servers Storage ServerNetwork
    • 32. Launched Today: Intel® Xeon® Processor E5-2600 v2 Product Family At the Heart of a Modern Data Center Energy Efficient Up to 45% greater energy efficiency1 High Performance Up to 50% more performance2 50% more cores and cache (up to 12C, 30MB) Faster DDR3 memory (up to 1866 MTS) Datacenter Class Up to 1.5 TB memory support (in 2S system) Improved PCI Express* 3.0 to unleash 10GbE Virtualization and Security innovation Workload Optimized Advanced Vector Extensions IO optimized for Intel ® Xeon Phi ™ Processors Balanced for Big Data & Intel® Distribution for Apache Hadoop* software IA Software Compatibility Leverages Existing SW Ecosystem IN PRODUCTION NOW! Intel Xeon Processor E5-2600 v2 1 Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase. *Other names and brands may be claimed as the property of others. Configuration - Server-Side Java* Energy Efficiency: E5-2690 (32GB), E5-2697 v2 (32GB) Versatile Datacenter Processor powering IBM’s NeXtScale System 32
    • 33. © 2013 IBM Corporation Adrian Wander Director Scientific Computing Department of STFC Cliff Brereton Director Hartree Centre
    • 34. © 2013 IBM Corporation
    • 35. © 2013 IBM Corporation35 IBM NeXtScale – Scale Maximum impact per $. Per ft 2 . Per rack. 1. Intel Xeon E-5 26xx v2 versus current Intel Xeon3-5 26xx 2. Memory DIMMs running at 1866Mhz versus 1600Mhz in current platforms 3. 4 nx360 M4 includes 4 x 1.8” SSDs run which run faster than traditional 2.5” SAS HDDs. SSDs deliver peak performance of 40,000 IOPS versus HDDs at peak of 450 IOPS. 4 x 50,000 = 200,000 IOPS which is equivalent to 355 2.5” HDDs 4. Based on A 1000 node cluster with 2 x86 sockets, 8 core 2.7 GHz, consumes about 340 KW. No hardware changes – optimization of power useage at rest and at peak utilization. 5. Europe (0.15€ per KWh) = 441K€ per year 6. US (0.10$ per KWh) = US$ 295K per year 7. Asia (0.20$ per KWh) = US$ 590K per year 8. As compared to a traditional 1U server like HP DL360 Gen 8 – needs weights for each 9. As compared to a traditional 1U server like HP DL 360 Gen 8 in a 42U rack – DL 360 = 42 system max, NeXtScale = 84 systems max 10.As compared to a traditional 1U server like HP DL360 Gen 8 with Intel E-5 2600 processors. NeXtScale nx360 M4 with E-5 26xx v2 = 24 cores/system and 48 cores/U, HP 360 Gen8 with top bin E-5 2690 at 16 cores per system and per U. 11. Need to get from Intel – v1 compare to v2 12.As compared to a a traditional 1U server like HP DL360 Gen 8 Weight (maximum config) 17.69kg (39lbs) versus NeXtScale nx360 M4 (6.05kg) + apportioned chassis (39kg/12 or 3.25kg) = 9.30kg. 9.30 v 17.69 = 47% less weight. 13.Calculation based on typical Intel E5 2600 2.6Ghz 8C top bin processor system compared to typical Intel E5 2600 v2 2.7Ghz 12C top bin processor system. 2 sockets. TFLOPs/2S 2600 v1 = 332.8GFLOPs . TFLOPs/2S 2600 V2 = 518GFLOPs. To achieve 1TFLOP we need 3 v1 systems at 450W each versus 2 v2 systems at 440W each MORE servers/rack6 2X 3X 35% 40% Less weight per system5 More cores per U than a Xeon E-5 2600 1Us7 Lower power per TFLOP of performance8 16% Amount of power saved with Platform LSF Energy Aware4 15% One nx360 with SSDs delivers same IO perf as 355Hard DisksMore High Frequency Cores1 50% Processing Memory Runs FASTER2
    • 36. 36 Legal DisclaimersLegal Disclaimers Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark andSoftware and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary.MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product whenYou should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.combined with other products. Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visitIntel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflectthe referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase.performance of systems available for purchase. Relative performance for each benchmark is calculated by taking the actual benchmark result for the first platform tested and assigning it a value of 1.0 as a baseline. RelativeRelative performance for each benchmark is calculated by taking the actual benchmark result for the first platform tested and assigning it a value of 1.0 as a baseline. Relative performance for the remaining platforms tested was calculated by dividing the actual benchmark result for the baseline platform into each of the specific benchmark results ofperformance for the remaining platforms tested was calculated by dividing the actual benchmark result for the baseline platform into each of the specific benchmark results of each of the other platforms and assigning them a relative performance number that correlates with the performance improvements reported.each of the other platforms and assigning them a relative performance number that correlates with the performance improvements reported. SPEC, SPECint, SPECfp, SPECrate. SPECpower, and SPECjbb are trademarks of the Standard Performance Evaluation Corporation. SeeSPEC, SPECint, SPECfp, SPECrate. SPECpower, and SPECjbb are trademarks of the Standard Performance Evaluation Corporation. See http://www.spec.orghttp://www.spec.org for morefor more information.information. Intel® Hyper-Threading Technology (Intel® HT Technology): Available on select Intel® Core™ processors. Requires an Intel® HT Technology-enabled system. Consult your PCIntel® Hyper-Threading Technology (Intel® HT Technology): Available on select Intel® Core™ processors. Requires an Intel® HT Technology-enabled system. Consult your PC manufacturer. Performance will vary depending on the specific hardware and software used. For more information including details on which processors support HT Technology,manufacturer. Performance will vary depending on the specific hardware and software used. For more information including details on which processors support HT Technology, visitvisit http://www.intel.com/info/hyperthreadinghttp://www.intel.com/info/hyperthreading.. Intel® Turbo Boost Technology: Requires a system with Intel® Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available onIntel® Turbo Boost Technology: Requires a system with Intel® Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on select Intel® processors. Consult your system manufacturer. Performance varies depending on hardware, software, and system configuration. For more information, visitselect Intel® processors. Consult your system manufacturer. Performance varies depending on hardware, software, and system configuration. For more information, visit http://www.intel.com/go/turbohttp://www.intel.com/go/turbo Intel® Enhanced Intel SpeedStep® Technology: See the Processor Spec Finder atIntel® Enhanced Intel SpeedStep® Technology: See the Processor Spec Finder at http://ark.intel.com/http://ark.intel.com/ or contact your Intel representative for more information.or contact your Intel representative for more information. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to:Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to: http://www.intel.com/products/processor_numberhttp://www.intel.com/products/processor_number Intel® products are not intended for use in medical, life-saving, life-sustaining, critical control, or safety systems, or in nuclear facility applications. All dates and productsIntel® products are not intended for use in medical, life-saving, life-sustaining, critical control, or safety systems, or in nuclear facility applications. All dates and products specified are for planning purposes only and are subject to change without notice.specified are for planning purposes only and are subject to change without notice. Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel's current plan of recordIntel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel's current plan of record product roadmaps.product roadmaps. Copyright © 2013 Intel Corporation. All rights reserved. Intel, the Intel logo, Xeon, Atom and Intel Core are trademarks or registered trademarks of Intel Corporation or itsCopyright © 2013 Intel Corporation. All rights reserved. Intel, the Intel logo, Xeon, Atom and Intel Core are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.subsidiaries in the United States and other countries. All dates and products specified are for planning purposes only and are subject to change without noticeAll dates and products specified are for planning purposes only and are subject to change without notice *Other names and brands may be claimed as the property of others.*Other names and brands may be claimed as the property of others. * Other names and brands may be claimed as the property of others.
    • 37. 37 Legal DisclaimersLegal Disclaimers INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCHTO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OFPRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANYINTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE ORA "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORSUSE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES ANDAND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANYREASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, ORWAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features orIntel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising frominstructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. CurrentThe products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to:Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htmhttp://www.intel.com/design/literature.htm * Other names and brands may be claimed as the property of others.
    • 38. Legal DisclaimersLegal Disclaimers All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change withoutAll products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.notice. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not acrossIntel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Go to: http://www.intel.com/products/processor_numberdifferent processor families. Go to: http://www.intel.com/products/processor_number Intel, processors, chipsets, and desktop boards may contain design defects or errors known as errata, which may cause the product to deviateIntel, processors, chipsets, and desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.from published specifications. Current characterized errata are available on request. Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor (VMM).Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor (VMM). Functionality, performance or other benefits will vary depending on hardware and software configurations. Software applications may not beFunctionality, performance or other benefits will vary depending on hardware and software configurations. Software applications may not be compatible with all operating systems. Consult your PC manufacturer. For more information, visit http://www.intel.com/go/virtualizationcompatible with all operating systems. Consult your PC manufacturer. For more information, visit http://www.intel.com/go/virtualization No computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) requires a computerNo computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) requires a computer system with Intel® Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-system with Intel® Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT- compatible measured launched environment (MLE). Intel TXT also requires the system to contain a TPM v1.s. For more information, visitcompatible measured launched environment (MLE). Intel TXT also requires the system to contain a TPM v1.s. For more information, visit http://www.intel.com/technology/securityhttp://www.intel.com/technology/security Intel, Intel Xeon, Intel Atom, Intel Xeon Phi, Intel Itanium, the Intel Itanium logo, the Intel Xeon Phi logo, the Intel Xeon logo and the Intel logoIntel, Intel Xeon, Intel Atom, Intel Xeon Phi, Intel Itanium, the Intel Itanium logo, the Intel Xeon Phi logo, the Intel Xeon logo and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Other names and brands may be claimed as the property of others.Other names and brands may be claimed as the property of others. Copyright © 2013, Intel Corporation. All rights reserved.Copyright © 2013, Intel Corporation. All rights reserved.
    • 39. Legal DisclaimersLegal Disclaimers Baseline Configuration and Score on Server-Side Java* Energy Efficiency benchmark: Intel® Server Board S2600CP platform with two Intel® Xeon® Processor E5-2690 (2.9GHz, 8-core , 20MB L3 cache, 8.0GT/s, 135W), Hardware Prefetcher: Disabled; MLC Spatial Prefetcher: Disabled, DCU Streamer: Disabled; DCU IP: Enabled; Balanced Perf Mode, 32GB memory (8 x 4GB DDR3L-1600 ECC REG), Microsoft* Windows Server 2008 R2 SP1, IBM J9 VM 1.7.0. Score: 4,033. Source: Intel TR#1299 as of 12 Aug 2013. New Configuration and Score on Server-Side Java* Energy Efficiency benchmark: Intel® Server Board S2600CP platform with two Intel® Xeon® Processor E5-2697 v2 (2.7GHz, 12-core, 30MB L3 cache, 8.0GT/s, 130W, C0-stepping), Hardware Prefetcher: Disabled; MLC Spatial Prefetcher: Disabled, DCU Streamer: Disabled; DCU IP: Enabled; Hyper-threading: Enabled; Turbo: Enabled; Balanced Perf Mode, 32GB memory (8 x 4GB DDR3L-1600 ECC REG), Microsoft* Windows Server 2008 R2 SP1, IBM J9 VM 1.7.0. Score : 5,670. Source: Intel TR#1299 as of 12 Aug 2013. Baseline Configuration and Score on SPECpower*_ssj2008 benchmark: IBM System x3650 M2Baseline Configuration and Score on SPECpower*_ssj2008 benchmark: IBM System x3650 M2 withwith two Intel® Xeon® Processortwo Intel® Xeon® Processor X5570 (2.93 GHz, 4-core, 8MB L3 cache,X5570 (2.93 GHz, 4-core, 8MB L3 cache, 6.4 GT/s,6.4 GT/s, 95W)95W),, 8GB memory (48GB memory (4 x 2048MB DDR3-10600R CL9 ECC), 32 GB SATA SSD, Microsoft* Windows Server 2008 Enterprise Edition x64 SP1, IBM J9 VM (build 2.4, J2RE 1.6.0 IBM J9 2.4 Windows Server 2008 amd64-64 jvmx 2048MB DDR3-10600R CL9 ECC), 32 GB SATA SSD, Microsoft* Windows Server 2008 Enterprise Edition x64 SP1, IBM J9 VM (build 2.4, J2RE 1.6.0 IBM J9 2.4 Windows Server 2008 amd64-64 jvm pwa6460sr5-20090406_01(SR5) (JIT enabled, AOT enabled). Source:pwa6460sr5-20090406_01(SR5) (JIT enabled, AOT enabled). Source: http://www.spec.org/power_ssj2008/results/res2009q2/power_ssj2008-20090519-00165.html as of June 2009http://www.spec.org/power_ssj2008/results/res2009q2/power_ssj2008-20090519-00165.html as of June 2009. Score:1,977. Score:1,977 New Configuration and Score on Server-Side Java* Energy Efficiency benchmark: Intel® Server Board S2600CP platform with two Intel® Xeon® Processor E5-2697 v2 (2.7GHz, 12-core, 30MB L3 cache, 8.0GT/s, 130W, C0-stepping), Hardware Prefetcher: Disabled; MLC Spatial Prefetcher: Disabled, DCU Streamer: Disabled; DCU IP: Enabled; Hyper-threading: Enabled; Turbo: Enabled; Balanced Perf Mode, 32GB memory (8 x 4GB DDR3L-1600 ECC REG), Microsoft* Windows Server 2008 R2 SP1, IBM J9 VM 1.7.0. Score : 5,670. Source: Intel TR#1299 as of 12 Aug 2013. Baseline Configuration and Score on SPECint*rate_base2006 Benchmark: BL265 using two Intel® Xeon® Processor X5570 (2.93 GHz, 4-core, 8MB L3 cache, 6.4 GT/s, 95W), 48GB memory (12x 4GB 2Rx4 PC3-10600R-9, ECC), 73 GB SAS 10 K RPM, SUSE Linux Enterprise Server 11 (x86_64) SP1, Kernel 2.6.32.12-0.7-default. Compiler version: Intel C++ Compiler XE for applications running on IA-32 Version 12.0.1.116 Build 20101116. Source: http://www.spec.org/cpu2006/results/res2011q1/cpu2006-20110215-14599.html as of Feb 2011. Score: 264. New Configuration and Score on SPECint*rate_base2006 Benchmark: Intel® Server Board S2600CP platform with two Intel® Xeon® Processor E5-2697 v2 (2.7GHz, 12-core, 30MB L3 cache, 8.0GT/s, 130W, C0-stepping) , EIST Enabled, Turbo Boost enabled, Hyper-Threading Enabled, 128GB memory (8x16GB DDR3-1866), Red Hat* Enterprise Linux Server 6.3. CPU2006-1.2 with Intel compiler IC13.1 Source Intel TR#1270 as of 11 June 2013. Estimated Score: 906. Baseline Configuration and Score on Benchmark: Intel® Server Board S2600GL platform with two Intel® Xeon® Processor E5-2690 (2.9GHz, 8-core, 20MB L3 cache, 8.0GT/s, 135W, C2-stepping), Virtualization Technology Enabled, Turbo Enabled, HT Enabled, NUMA Enabled, MLC Spatial Prefetcher Enabled, DCU Data Line Prefetcher Enabled, 256GB memory (16x 16GB DDR3-1333 DR REG ECC), 128GB SATA SSD, ESXi4.1u1 (build 348481). Source: Intel TR#1359 as of 24 July 2013. Score: 1723 @ 108VMs. New Configuration and Score on Benchmark: Intel® Server Board S2600CP platform with two Intel® Xeon® Processor E5-2697 v2 (2.7GHz, 12-core, 30MB L3 cache, 8.0GT/s, 130W, C0-stepping), Virtualization Technology Enabled, Turbo Enabled, HT Enabled, NUMA Enabled, MLC Spatial Prefetcher Enabled, DCU Data Line Prefetcher Enabled, 256GB memory (16x 16GB DDR3-1866 DR REG ECC), 128GB SATA SSD, ESXi 5.1(build 799733). Source: Intel TR#1359 as of 24 July 2013. Score: 2246 @ 144VMs