Intel HPC Update
Upcoming SlideShare
Loading in...5
×
 

Like this? Share it with your network

Share

Intel HPC Update

on

  • 1,141 views

Presentation from the HPC event at IBM Denmark - September 2013, Copenhagen

Presentation from the HPC event at IBM Denmark - September 2013, Copenhagen

Statistics

Views

Total Views
1,141
Views on SlideShare
1,111
Embed Views
30

Actions

Likes
1
Downloads
32
Comments
0

1 Embed 30

http://www.scoop.it 30

Accessibility

Categories

Upload Details

Uploaded via as Adobe PDF

Usage Rights

© All Rights Reserved

Report content

Flagged as inappropriate Flag as inappropriate
Flag as inappropriate

Select your reason for flagging this presentation as inappropriate.

Cancel
  • Full Name Full Name Comment goes here.
    Are you sure you want to
    Your message goes here
    Processing…
Post Comment
Edit your comment

Intel HPC Update Presentation Transcript

  • 1. Intel HPC Portfolio and Roadmap Update ® Gareth Tucker IBM Technical Account Manager EMEA INTEL CONFIDENTIAL
  • 2. This slide MUST be used with any slides removed from this presentation Legal Disclaimers INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel’s current plan of record product roadmaps. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. This document contains information on products in the design phase of development. All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copyright © 2013, Intel Corporation. All rights reserved. *Other names and brands may be claimed as the property of others. 2 INTEL CONFIDENTIAL
  • 3. This slide MUST be used with any slides removed from this presentation Legal Disclaimers Continued Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Go to: http://www.intel.com/products/processor_number Intel® HT Technology available on select Intel® processors. Requires an Intel® HT Technology-enabled system. Consult your system manufacturer. Performance will vary depending on the specific hardware and software used. For more information including details on which processors support HT Technology, visit http://www.intel.com/info/hyperthreading. Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor (VMM). Functionality, performance or other benefits will vary depending on hardware and software configurations. Software applications may not be compatible with all operating systems. Consult your PC manufacturer. For more information, visit http://www.intel.com/go/virtualization No computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) requires a computer system with Intel® Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-compatible measured launched environment (MLE). Intel TXT also requires the system to contain a TPM v1.s. For more information, visit http://www.intel.com/technology/security Requires a system with Intel® Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on select Intel® processors. Consult your PC manufacturer. Performance varies depending on hardware, software, and system configuration. For more information, visit http://www.intel.com/go/turbo Intel® AES-NI requires a computer system with an AES-NI enabled processor, as well as non-Intel software to execute the instructions in the correct sequence. AES-NI is available on select Intel® processors. For availability, consult your reseller or system manufacturer. For more information, see http://software.intel.com/en-us/articles/intel-advanced-encryption-standard-instructions-aes-ni/ Intel, Intel Xeon, the Intel Xeon logo and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Other names and brands may be claimed as the property of others 3 INTEL CONFIDENTIAL
  • 4. This slide MUST be used with any slides with performance data removed from this presentation Legal Disclaimers: Performance Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, Go to: http://www.intel.com/performance/resources/benchmark_limitations.htm. Relative performance is calculated by assigning a baseline value of 1.0 to one benchmark result, and then dividing the actual benchmark result for the baseline platform into each of the specific benchmark results of each of the other platforms, and assigning them a relative performance number that correlates with the performance improvements reported. SPEC, SPECint, SPECfp, SPECrate. SPECpower, SPECjAppServer, SPECjEnterprise, SPECjbb, SPECompM, SPECompL, and SPEC MPI are trademarks of the Standard Performance Evaluation Corporation. See http://www.spec.org for more information. SAP and SAP NetWeaver are the registered trademarks of SAP AG in Germany and in several other countries. See http://www.sap.com/benchmark for more information. Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. 4 INTEL CONFIDENTIAL
  • 5. This slide MUST be used with any slides with performance data removed from this presentation Legal Disclaimers INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. Intel does not control or audit the design or implementation of third party benchmarks or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmarks are reported and confirm whether the referenced benchmarks are accurate and reflect performance of systems available for purchase. Relative performance is calculated by assigning a baseline value of 1.0 to one benchmark result, and then dividing the actual benchmark result for the baseline platform into each of the specific benchmark results of each of the other platforms, and assigning them a relative performance number that correlates with the performance improvements reported. SPEC, SPECint, SPECfp, SPECrate. SPECpower, SPECjAppServer, SPECjbb, SPECjvm, SPECWeb, SPECompM, SPECompL, SPEC MPI, SPECjEnterprise* are trademarks of the Standard Performance Evaluation Corporation. See http://www.spec.org for more information. TPC-C, TPC-H, TPC-E are trademarks of the Transaction Processing Council. See http://www.tpc.org for more information. Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see here Intel® Turbo Boost Technology requires a Platform with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your platform manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see http://www.intel.com/technology/turboboost Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to: Learn About Intel® Processor Numbers Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. All dates and products specified are for planning purposes only and are subject to change without notice Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel’s current plan of record product roadmaps. Xeon® is a trademark of Intel Corporation in the U.S. and/or other countries. Copyright © 2013 Intel Corporation. All rights reserved. Intel, the Intel logo, Xeon and Intel Core are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. All dates and products specified are for planning purposes only and are subject to change without notice INTEL CONFIDENTIAL *Other names and brands may be claimed as the property of others. 5
  • 6. This slide MUST be used with any slides with performance data removed from this presentation Optimization Notice Optimization Notice Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice. Notice revision #20110804 6 INTEL CONFIDENTIAL
  • 7. Intel Xeon Processor E5-2600 v2 Product Family ® ® Solve Real Problems, Deliver Real Results INTEL CONFIDENTIAL
  • 8. Intel® Xeon® Processor E5-2600 v2 Product Family Tick-Tock Development Model: Sustained Microprocessor Leadership Intel® Core™ Microarchitecture Intel® Microarchitecture Codename Nehalem Intel® Microarchitecture Codename Sandy Bridge Xeon® 5300 Xeon® 5400 Xeon® 5500 Xeon® 5600 Xeon® Xeon® E5- 2600 E5- 2600 v2 65nm 45nm 45nm 32nm 32nm New Microarchitecture New Process Technology New Microarchitecture New Process Technology TOCK TICK TOCK TICK Intel® Microarchitecture Codename Haswell Haswell Future 22nm 22nm 14nm New Microarchitecture New Process Technology New Microarchitecture New Process Technology TOCK TICK TOCK TICK Latest Micro-architecture on Leading Process Technology 8 INTEL CONFIDENTIAL
  • 9. Intel® Xeon® Processor E5-2600 v2 Product Family At the Heart of a Modern Data Center Intel ® Xeon ® E5-2600 v2 product family Efficient Leading 22nm manufacturing process reduces power usage. Supports Intel® Node Manager & Intel® Data Center Manager Software Powerful Up to 12 cores and 30MB cache expected to deliver up to 30%1 more performance in same power envelope vs previous generation . 2 Secure Improved security with Intel® Secure Key & Intel® OS Guard for additional HW embedded security plus enhanced AES-NI 1 Source: Intel internal measurements. {SPECint*_rate_base2006, 28 March 2013, E5-26xxv2 (12C, 2.5GHz,) vs. E5-2600 (8C, 2.9Ghz, ). Results have been simulated and are provided for informational purposes only. Results were derived using simulations run on an architecture simulator or model. Any difference in system hardware or software design or configuration may affect actual performance. Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel’s current plan of record product roadmaps.. For more information go to http://www.intel.com/performance *Other names and brands may be claimed as the property of others. INTEL CONFIDENTIAL Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. 9
  • 10. Unrelenting Focus on Power Efficiency Xeon E5-2600 v2 Active Power Dynamic Power Idle Power Delivering up to 45%1 power efficiency improvements through enhanced fine grain power controls and 22nm trigate process Efficient Turbo that intelligently adapts to peak workloads conditions and disengages when Memory and I/O are the bottlenecks Low leakage process technology and power gating technology contribute to Idle Power of up to 23%1 lower than previous generation 1. Source: Intel internal measurements: [Baseline Configuration and Score on SPECPower_ssj2013* benchmark. Idle power based on , Intel® Xeon ® processor E5- 26xx v2 (12C, 2.5GHz, 95W), 28 March 2013]. Results have been simulated and are provided for informational purposes only. Results were derived using simulations run on an architecture simulator or model. Any difference in system hardware or software design or configuration may affect actual performance. Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel’s current plan of record product roadmaps. For more information go to http://www.intel.com/performance *Other names and brands may be claimed as the property of others. 10 INTEL CONFIDENTIAL
  • 11. Intel® Xeon® Processor E5-2600 v2 Product Family REAL Performance Where it Counts Xeon E5-2600 v2 50% MORE IMPROVED IMPROVED NEW cores / threads faster memory integrated IO (PCIe 3.0) virtualization feature 50% MORE ~30%1 less NEW last-level cache idle power security features 1. Source: Intel internal measurements: [idle power, Intel® Xeon ® processor E5- 26xx v2 (12C, 2.5GHz, 95W), 28 March 2013]. Results have been simulated and are provided for informational purposes only. Results were derived using simulations run on an architecture simulator or model. Any difference in system hardware or software design or configuration may affect actual performance. Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel’s current plan of record product roadmaps. For more information go to http://www.intel.com/performance * Other names and brands may be claimed as the property of others Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. INTEL CONFIDENTIAL 11
  • 12. Intel® Xeon® Processor E5-2600 v2 Product Family Reduce Bottlenecks with Intel® Integrated I/O Better Together Unleash the full I/O capabilities of Xeon® E5 with Intel® Ethernet X540 Server10GbE Adapter or Intel® True Scale 7300 series HCAs Increase I/O Performance NETWORKING APPLIANCES Reduce I/O Latency HPC TRADING STORAGE LARGE SCALE ANALYTICS 1. Source: Intel internal measurements of average time for an I/O device read to local system memory under idle conditions comparing Intel® Xeon® processor E5-2600 product family (230 ns) vs. Intel® Xeon® processor 5500 series (340 ns). See notes in backup for configuration details .2. Source: 8 GT/s and 128b/130b encoding in PCIe* 3.0 specification enables double the interconnect bandwidth over the PCIe* 2.0 specification (www.pcisig.com/news_room/November_18_2010_Press_Release/). * Other names and brands may be claimed as the property of others with Intel® Integrated I/O 12 INTEL CONFIDENTIAL
  • 13. Intel® Xeon® processor E5-2600 v2 Product Family Intel Xeon Processor E5-2600 v2 Socket compatible replacement for Intel® Xeon® processor E5-2600 product family Up to 12 cores and 30MB cache expected to deliver up to 50%1 more performance in same power envelope Up to 30MB Shared Cache 4 channels of up To DDR3 1866 MHz memory * Other names and brands may be claimed as the property of others Integrated PCI Express* 3.0 Up to 40 lanes per socket Improved security with Intel® Secure Key & Intel® OS Guard for additional HW embedded security 1 1Baseline Configuration and Score on SPECVirt_sc2013* benchmark. Please contact your Intel representative to obtain Intel’s current plan of record product roadmaps. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance 13 INTEL CONFIDENTIAL
  • 14. Intel® Xeon® Processor E5-2600 v2 Product Family World Record Performance • E5-2600 v2 featured in the #1 supercomputer “Milky Way-2” on the Top500 list • With 12 cores running up to 2.7 GHz, E5-2600 v2 delivers 259 GFlops per socket, a 56% increase over the previous generation • E5-2600 v2 also in 2 other supercomputers on the Top500 list - #54 and #329 Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. 14 Source: http://newsroom.intel.com/community/intel_newsroom/blog/2013/06/17/intel-powers-the-worlds-fastest-supercomputer-reveals-new-and-future-high-performance-computing-technologies
  • 15. Intel® Xeon® Processor E5-2600 v2 Product Family LGA2011 (E5) Advanced  8C-20MB, 10C-25MB cache  8.0 GT/s QPI  Intel® HT Technology  DDR3-1866 (skt R)  DDR3-1600 (skt B2)  Intel® Turbo Boost Technology 10C 3.0GHz E5-2690 v2 10C 2.8GHz E5-2680 v2 10C 2.5GHz 10C 2.2GHz 130W  6C-15MB, 8C-20MB cache  7.2 GT/s QPI  Intel® HT Technology  DDR3 1600  Intel® Turbo Boost Technology Basic  4C-10MB, 2C-5MB cache  6.4 GT/s QPI  DDR3 1333 Segment Optimized 115W 115W E5-2670 v2 95W E5-2660 v2 8C 2.6GHz Standard LGA2011 (E5) E5-2650 v2 8C 2.0GHz 150W E5-2687W v2 8C 130W 3.3GHz 25M E5-2667 v2 T 6C 130W 3.5GHz 25M E5-2643 v2 T 6C 2.1GHz 4C 130W 3.5GHz 15M E5-2637 v2 95W 80W E5-2630 v2 80W E5-2620 v2 4C 2.5GHz E5-2609 v2 4C 1.8GHz 2.5MB/c cache 10C 8.0 GT/s QPI 6C 7.2 GT/s QPI DDR3-1600 Intel® HT Technology  Intel® Turbo Boost Technology      80W E5-2603 v2 80W T Tray only SKUs 15 15 8C 3.4GHz E5-2640 v2 6C 2.6GHz 95W  2.5MB/c cache More cache as noted  8.0 GT/s QPI  Intel® HT Technology  DDR3-1866  Intel® Turbo Boost Technology 12C 130W 2.7GHz 30M E5-2697 v2 12C 115W 2.4GHz 30M E5-2695 v2 INTEL CONFIDENTIAL Low Power 70W T 10C 1.7GHz E5-2650L v2 6C 2.4GHz E5-2630L v2 60W T Workstation Only SKU
  • 16. Intel® Xeon® Processor E5-2600 v2 Product Family LGA2011 (E5) Advanced  8C-20MB, 10C-25MB cache  8.0 GT/s QPI  Intel® HT Technology  DDR3-1866 (skt R)  DDR3-1600 (skt B2)  Intel® Turbo Boost Technology 10C 3.0GHz E5-2690 v2 10C 2.8GHz E5-2680 v2 10C 2.5GHz 10C 2.2GHz 130W  6C-15MB, 8C-20MB cache  7.2 GT/s QPI  Intel® HT Technology  DDR3 1600  Intel® Turbo Boost Technology Basic  4C-10MB, 2C-5MB cache  6.4 GT/s QPI  DDR3 1333 Segment Optimized 115W 115W E5-2670 v2 95W E5-2660 v2 8C 2.6GHz Standard LGA2011 (E5) E5-2650 v2 8C 2.0GHz 150W E5-2687W v2 8C 130W 3.3GHz 25M E5-2667 v2 T 6C 130W 3.5GHz 25M E5-2643 v2 T 6C 2.1GHz 4C 130W 3.5GHz 15M E5-2637 v2 95W 80W E5-2630 v2 80W E5-2620 v2 4C 2.5GHz E5-2609 v2 4C 1.8GHz 2.5MB/c cache 10C 8.0 GT/s QPI 6C 7.2 GT/s QPI DDR3-1600 Intel® HT Technology  Intel® Turbo Boost Technology      80W E5-2603 v2 80W T Tray only SKUs 16 16 8C 3.4GHz E5-2640 v2 6C 2.6GHz 95W  2.5MB/c cache More cache as noted  8.0 GT/s QPI  Intel® HT Technology  DDR3-1866  Intel® Turbo Boost Technology 12C 130W 2.7GHz 30M E5-2697 v2 12C 115W 2.4GHz 30M E5-2695 v2 INTEL CONFIDENTIAL Low Power 70W T 10C 1.7GHz E5-2650L v2 6C 2.4GHz E5-2630L v2 60W T Workstation Only SKU
  • 17. Intel® Xeon® Processor E5-2600 v2 Product Family LGA2011 (E5) Advanced  8C-20MB, 10C-25MB cache  8.0 GT/s QPI  Intel® HT Technology  DDR3-1866 (skt R)  Intel® Turbo Boost Technology 10C 3.0GHz E5-2690 v2 10C 2.8GHz E5-2680 v2 10C 2.5GHz 10C 2.2GHz 130W  6C-15MB, 8C-20MB cache  7.2 GT/s QPI  Intel® HT Technology  DDR3 1600  Intel® Turbo Boost Technology Basic  4C-10MB, 2C-5MB cache  6.4 GT/s QPI  DDR3 1333 Segment Optimized 115W 115W E5-2670 v2 95W E5-2660 v2 8C 2.6GHz Standard LGA2011 (E5) E5-2650 v2 8C 2.0GHz 150W E5-2687W v2 8C 130W 3.3GHz 25M E5-2667 v2 T 6C 130W 3.5GHz 25M E5-2643 v2 T 6C 2.1GHz 4C 130W 3.5GHz 15M E5-2637 v2 95W 80W E5-2630 v2 80W E5-2620 v2 4C 2.5GHz E5-2609 v2 4C 1.8GHz 2.5MB/c cache 10C 8.0 GT/s QPI 6C 7.2 GT/s QPI DDR3-1600 Intel® HT Technology  Intel® Turbo Boost Technology      80W E5-2603 v2 80W T Tray only SKUs 17 17 8C 3.4GHz E5-2640 v2 6C 2.6GHz 95W  2.5MB/c cache More cache as noted  8.0 GT/s QPI  Intel® HT Technology  DDR3-1866  Intel® Turbo Boost Technology 12C 130W 2.7GHz 30M E5-2697 v2 12C 115W 2.4GHz 30M E5-2695 v2 INTEL CONFIDENTIAL Low Power 70W T 10C 1.7GHz E5-2650L v2 6C 2.4GHz E5-2630L v2 60W T Workstation Only SKU
  • 18. Intel® Xeon® Processor E5-2600 v2 Product Family LGA2011 (E5) Advanced  8C-20MB, 10C-25MB cache  8.0 GT/s QPI  Intel® HT Technology  DDR3-1866 (skt R)  Intel® Turbo Boost Technology 10C 3.0GHz E5-2690 v2 10C 2.8GHz E5-2680 v2 10C 2.5GHz 10C 2.2GHz 130W  6C-15MB, 8C-20MB cache  7.2 GT/s QPI  Intel® HT Technology  DDR3 1600  Intel® Turbo Boost Technology Basic  4C-10MB, 2C-5MB cache  6.4 GT/s QPI  DDR3 1333 Segment Optimized 115W 115W E5-2670 v2 95W E5-2660 v2 8C 2.6GHz Standard LGA2011 (E5) E5-2650 v2 8C 2.0GHz 150W E5-2687W v2 8C 130W 3.3GHz 25M E5-2667 v2 T 6C 130W 3.5GHz 25M E5-2643 v2 T 6C 2.1GHz 4C 130W 3.5GHz 15M E5-2637 v2 95W 80W E5-2630 v2 80W E5-2620 v2 4C 2.5GHz E5-2609 v2 4C 1.8GHz 2.5MB/c cache 10C 8.0 GT/s QPI 6C 7.2 GT/s QPI DDR3-1600 Intel® HT Technology  Intel® Turbo Boost Technology      80W E5-2603 v2 80W T Tray only SKUs 18 18 8C 3.4GHz E5-2640 v2 6C 2.6GHz 95W  2.5MB/c cache More cache as noted  8.0 GT/s QPI  Intel® HT Technology  DDR3-1866  Intel® Turbo Boost Technology 12C 130W 2.7GHz 30M E5-2697 v2 12C 115W 2.4GHz 30M E5-2695 v2 INTEL CONFIDENTIAL Low Power 70W T 10C 1.7GHz E5-2650L v2 6C 2.4GHz E5-2630L v2 60W T Workstation Only SKU
  • 19. Intel® Xeon® Processor E5-2600 v2 Product Family Neusoft CT Intel® Advance Vector Extensions – Float 16 “The Intel Xeon Processor E5-2600 V2 generates complex CT images about 45 percent faster than the previous Intel Xeon Processor E5-2600. A study that took 20 minutes can now be completed in just 11. Multiply that by the hundreds of patients in a busy clinic and the time savings stretch to hours per day. We also see performance gains of up to 1.54X using Float16 Instructions for select workloads. This is absolutely a preferred hardware platform for Neusoft CT.” www.neusoft.com Intel AVX The Higher the Better Shuangxue Li, Vice President of Neusoft Medical Systems Co., Ltd., General Manager of Diagnostic Imaging Systems Division 1.80  Neusoft CT scanners depend, in part, on the efficiency of the underlying image-generation software and its ability to deliver high quality images quickly.  Benefits of the Intel® Xeon® processor E5 v2 family—Fast image generation reduces wait times for patients and medical teams in busy clinical settings. Intel® AVX reduces the diagnosis latency, and helps doctors to make the right decision in the shortest time 1.60 On Intel® Xeon® Processor E52600 V2 series without AVX Float 16 Optimization 1.54X 1.40 1.20 1.00 0.80 On Intel® Xeon® Processor E52600 V2 series with AVX Float 16 Optimization 0.60 0.40 0.20 0.00 19 INTELINTEL CONFIDENTIAL UNDER NDA ONLY UNLESS TAGGED “PUBLIC AT LAUNCH”. CONFIDENTIAL - USE *Other names and brands may be claimed as the property of others
  • 20. Intel® Xeon® Processor E5-2600 v2 Product Family SunGard ALM Benchmark 5.8.6 Risk Analytics www.sungard.com “Having successfully migrated to Intel® Xeon® E5-2600 v2, we have seen significant increases in processing power. We have run the large scenario simulation engine that is able to take advantage of the increased number of cores in the new Intel platform; the new platform increased our performance by more than 38%. These improved results come at a time when our customers are demanding faster results with even greater granularity.” 80 Joe Sass, Director of Product Strategy for SunGard’s Ambit ALM business 70 Finance Elapsed time in sec 60 1.38x Faster 50  SunGard’s Asset & Liability Risk Management solution provides complete multidimensional analysis of the balance sheet, incorporating interest rate risk, income simulation and market valuation using deterministic and stochastic modeling. 40 30 20 10 Better Information and Analysis Means Better Decisions. SunGard ALM Risk Management Solutions 0 Intel® Xeon® processorE5-2600 Intel® Xeon® processor E5-2600 V2 20 INTELINTEL CONFIDENTIAL UNDER NDA ONLY UNLESS TAGGED “PUBLIC AT LAUNCH”. CONFIDENTIAL - USE *Other names and brands may be claimed as the property of others
  • 21. Intel® Xeon® Processor E5-2600 v2 Product Family Paradigm GeoDepth* v2011.3 Seismic Imaging “Our continued investment in the optimization of the GeoDepth software, leveraging the Intel compliers and the Intel MKL library, enables our customers to take immediate advantage of the 50% increase in compute cores in this latest generation of Intel Xeon processors.” Duane Dopkin, Executive Vice President, Technology.” www.paradigm.com ENERGY Duane Dopkin, Senior Vice President, Technology  Customer Benefits—Geophysicists can choose to apply the scalable performance improvements to produce higher resolution images of the subsurface, or to improved throughput of their existing workload. 1.45 1.59 12 core Intel® Xeon® processor E5-2697 V2 CSFWMIG Benchmark 1  Key Intel® Xeon® processor E5 v2 advantage—Increased memory speed reduces communications overhead; 24-cores per two-socket server provides application scalability; Intel® Hyper-Threading Technology and Intel® Turbo Boost Technology provide much higher price performance. 8 core Intel® Xeon® processor E5-2670 1  GeoDepth* is the leading system for 3D and 2D velocity model building and seismic imaging in time and depth. Through the integration of interpretation, velocity analysis, model building, model updating, model validation, depth imaging and time-to-depth conversion, GeoDepth provides the continuity needed to produce high-quality, interpretable images consistent with other available data. Paradigm 2011.3 Benchmarks Relative Performance Higher is better CRAM Benchmark Scalable performance for high resolution seismic imaging 21 INTELINTEL CONFIDENTIAL UNDER NDA ONLY UNLESS TAGGED “PUBLIC AT LAUNCH”. CONFIDENTIAL - USE *Other names and brands may be claimed as the property of others
  • 22. Intel® Xeon® Processor E5-2600 v2 Product Family Star-CCM+* Engineering Analysis (Multi-Disciplinary) “We redesigned the front end of our chassis almost exclusively using simulations with CD-adapco software, the redesign added about 50 lbs. of down force which is enough extra grip to give us about a tenth of a second a lap.” www.cd-adapco.com HPC Andy Hogg, Aerodynamics manager, Michael Waltrip Racing  CD-adapco STAR-CCM+* provides comprehensive support for solving complex engineering problems involving flow (of fluids or solids), heat transfer and stress. It helps engineers automate workflows to perform iterative design studies with minimal user interaction.  Faster simulation runtimes reduce simulation/prototyping timelines, to improve design quality, and speed time to market.  Increased memory bandwidth of the E5-2600 v2 series allows better utilization of its computational resources, significantly improving run times. Faster performance; High quality digital cinema; Faster time to Market STAR-CCM+ 8.04.007 Lemans 17M Iteration time, sec - lower is better 20.000 18.000 16.000 14.000 12.000 10.000 8.000 6.000 4.000 2.000 0.000 17.7 13.0 Sandy Bridge 8-core @ 2.7 GHz Ivy Bridge 10-core @ 2.8 GHz 22 INTELINTEL CONFIDENTIAL UNDER NDA ONLY UNLESS TAGGED “PUBLIC AT LAUNCH”. CONFIDENTIAL - USE *Other names and brands may be claimed as the property of others 1.53x Faster 11.5 Ivy Bridge 12-core * 2.7 GHz
  • 23. Intel® Xeon Phi™ Co-processor Update 23 INTEL CONFIDENTIAL
  • 24. PARALLELISM IS THE PATH FORWARD Intel is Your Roadmap Most Commonly Used Parallel Processor • Performance and energy efficiency for most workloads • Parallel, Serial, Multicore + Vector • Robust security and reliability • Flexible foundation for growth and innovation 24 Optimized for Highly Parallel Application • More cores and more threads per core • Wider Vector instructions • Higher memory bandwidth • Common languages, directives, libraries & tools • Complements Intel® Xeon® processors
  • 25. PRODUCT LINEUP Intel® Xeon Phi™ Coprocessor 3xxx Family Outstanding Parallel Computing Solution Performance/$ leadership 5xxx Family Optimized for High Density Environments 6GB GDDR5 240GB/s >1TF DP 3120P 3120A 5110P 5120D 7120P 7120X 8GB GDDR5 >300GB/s >1TF DP Performance/watt leadership 225-245W 7xxx Family 16GB GDDR5 Highest Performance, Most Memory Performance leadership 352GB/s >1.2TF DP Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance 25 25
  • 26. BIG GAINS FOR PARALLEL APPLICATIONS 7.00 5.00 Performance 3.00 1.00 Efficient vectorization, threading, and parallel execution drives higher performance for many applications 0.80 1.00 0.60 0.40 0% 25% % Vector 0.20 50% * Theoretical acceleration using a highly-parallel Intel® Xeon Phi™ coprocessor versus a standard multi-core Intel® Xeon® processor 26 0.00 75% 100% Fraction Parallel
  • 27. 27 PARALLELIZING FOR HIGH PERFORMANCE A Two Step Process STARTING POINT Typical serial code running on multi-core Intel® Xeon® processors 67.097 SECONDS Current Performance STEP 1. OPTIMIZE CODE Parallelize and vectorize code and continue to run on multi-core Intel Xeon processors STEP 2. USE COPROCESSORS Run all or part of the optimized code on Intel® Xeon Phi™ coprocessors 27 0.46 SECONDS 0.197 SECONDS 145X FASTER 2.3X FASTER 340X FASTER Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. Source: Intel Measured results as of October 26, 2012 Configuration Details: Please reference slide speaker notes. For more information go to http://www.intel.com/performance
  • 28. Highly-parallel Processing for Unparalleled Discovery Seamlessly solve your most important problems of any scale Intel® Xeon Phi™ product family Based on Intel® Many Integrated Core (Intel® MIC) architecture Leading performance for highly parallel workloads Common Intel® Xeon® programming model seamlessly increases developer productivity Single Source Launching on 22nm with >50 cores Compilers and Runtimes Intel® Xeon® processor Ground-breaking real-world application performance Industry-leading energy efficiency Meet HPC challenges and scale for growth 28 28
  • 29. A GROWING ECOSYSTEM Developing today on Intel® Xeon Phi ™ Co-processors Shown at SC’12, November 2012 29 Other brands and names are the property of their respective owners.
  • 30. PERFORMANCE PROOF POINT: ENERGY INDUSTRY Sinopec iCluster PSDM “ Speedup (Higher is Better) This will provide an amazing boost for the performance of the Sinopec iCluster seismic imaging system.” Zhao Gaishan VP of Sinopec Geophysical Research Institute, November, 2012 6 5 5 4 3 2 1 1 1.06 0 • Application: Sinopec iCluster PSDM is a key module in the Sinopec iCluster* seismic imaging system. The split step fourier prestack depth migration (SSF PsDM) algorithm is ideal for mild lateral velocity variations. It provides one-way approximation with wave propagation performed in the frequency domain. • Status: In house code • • • 2S Intel® Xeon® processor E5-2680 • Usage Model: Offload Intel® Xeon Phi™ Coprocessor (pre-production HW/SW) • Demonstrated Results: Dramatic scaling (5.3x) over baseline using two server nodes, each with two Intel® Xeon® processors and two Intel® Xeon Phi™ coprocessors 2S Intel ® Xeon® processor E5-2680 + 2 Intel® Xeon Phi™ Coprocessor Two node (pre-production HW/SW) Code Optimization Strategies: software.intel.com/en-us/articles/optimize-seismic-imaging-processing-on-intel-xeon-phi 30 30 SOURCE: INTEL RESULTS AS OF JULY, 2013
  • 31. PERFORMANCE PROOF POINT: FINANCIAL SERVICES Black-scholes formula valuation • Application: Black-Scholes financial modeling requires raw computational power plus high bandwidth between execution cores and memory Speedup (Higher is Better) • Status: Case Study available 7 • Highlights: Dramatic scaling for both single- and double-precision computations 5.81 6 5 4 2.85 3 2 1 0 • • 1 Single Precision 1 Double Precision 2S Intel® Xeon® processor E5-2670 2S Intel Xeon processor E5-2670 + Intel® Xeon Phi™ Coprocessor (pre-production HW/SW) Read the Case Study: • Demonstrated Results: • Intel® Xeon Phi™ coprocessor streaming store provides optimized cache and bandwidth usage • Intel Xeon Phi coprocessor fast transcendental functions exp2(), log2() increase performance and accuracy on SP • Intel® Xeon® processors also benefit from using exp2()/log2() • Compiler based code generation enables plain C++ code, which delivers higher performance than vector intrinsics software.intel.com/en-us/articles/case-study-achieving-superior-performance-on-black-scholes-valuation-computing-using 31 31 SOURCE: INTEL MEASURED RESULTS AS OF JULY, 2013
  • 32. PERFORMANCE PROOF POINT: GOVERNMENT AND ACADEMIC RESEARCH LRZ/TUM SG++ • Application: Extends MATLAB with a toolbox for employing spatially adaptive sparse grids in a flexible, modular way Speedup (Higher is Better) • Status: not released yet 4.5 3.92 4 • Uses MPI, intrinsics, offload pragmas, and OpenMP 3.5 3 • Floating-point intensive and has a complex, non-linear kernel 2.5 2 1.5 1 1 0.5 0 • • 2S Intel® Xeon® processor E5-2670 2S Intel Xeon processor E5-2670 + 2* Intel® Xeon Phi™ Coprocessors (pre-production HW/SW) 32 32 • Workload Characteristics: SOURCE: THIRD PARTY MEASURED RESULTS AS OF NOVEMBER, 2012 • Innermost loop contains an if statement for efficient handling of high-dimensional grid boundaries (reduces computational complexity) - Demonstrated Results: • Highlight: Performance scales well to four Intel® Xeon Phi™ coprocessors per node • Supports symmetric configurations with Intel® Xeon® processors and Intel® Xeon Phi™ coprocessors
  • 33. PERFORMANCE PROOF-POINT: WEATHER AND CLIMATE RESEARCH WRF v3.5 • Application: Weather Research and Forecasting (WRF) • Status: WRF V3.5 was released 4/18/13 • Code Optimization: Speedup (Higher is Better) 1.6 1.4 • Approximately two dozen files with less than 2,000 lines of code were modified (out of approximately 700,000 lines of code in about 800 files, all Fortran standard compliant) 1.4 1.2 1 1 0.8 0.6 • Most modifications improved performance for both the host and the co-processors 0.4 0.2 0 • • Performance Measurements: Pre release of WRF 3.5 (V3.5Pre) and NCAR supported CONUS2.5KM benchmark (a high resolution weather forecast) • Acknowledgments: There were many contributors to these results, including the National Renewable Energy Laboratory and The Weather Channel Companies 2S Intel® Xeon® processor E5-2670 with eight-node cluster configuration 2S Intel® Xeon® processor E5-2670 + Intel® Xeon Phi™ coprocessor (pre-production HW/SW) with eight-node cluster configuration 33 33 • SOURCE: INTEL MEASURED RESULTS AS OF JULY, 2013
  • 34. Next Generation Intel® Xeon Phi™ Product Family (Codenamed Knights Landing)  Available in Intel cutting-edge 14 nanometer process  Stand alone CPU or PCIe coprocessor – not bound by ‘offloading’ bottlenecks  Integrated Memory - balances compute with bandwidth Parallel is the path forward - Intel is your roadmap All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. 34 34 Note that code name above is not the product name
  • 35. Intel® HPC Fabric Update 35 INTEL CONFIDENTIAL
  • 36. Next Front of System Innovation: Fabrics HPC Expertise Fabric Management & Software Highest Performance, Scalable IB Products HPC Expertise Intellectual Property World-class Interconnects Low-latency Ethernet Switching Data Center Ethernet Expertise High Radix & Low Radix Switch Products Intel’s Comprehensive Connectivity and Fabric Portfolio Market Leading Compute & Ethernet Products Platform Expertise Unprecedented Rate of Innovation in HPC Fabric 36 Other brands and names are the property of their respective owners.
  • 37. Intel® True Scale HPC Fabric Key Differentiators Connectionless - Minimal on-adapter state - No Chance of cache misses as the cluster/fabric scales - Maintains low end-to-end latency, even at scale PSM Layer - Performance Scaled Messaging light weight interface between MPI (Message Passing Interface) and the InfiniBand device driver - High MPI message rate performance - Excellent short message efficiency - Collective performance at scale without requiring special/hardware acceleration 37
  • 38. The Advantages of Fabrics Integration Intel® Processor 32 GB/sec Fabric Controller System IO Interface (PCIe) 10-20 GB/sec Fabric Interface Today Problem: • Power – System IO Interface Adds “10s Of Watts” Incremental Power • Cost & Density – More Components On A Server Node • Scalability – Processor Capacity & Memory Bandwidth Scaling Faster Than System IO Bandwidth Solution: Fabric Interface Intel® Processor 100+ GB/sec Fabric Controller Tomorrow • Removing The System IO Interface From The Fabrics Solution Reducing Power • An Integrated Fabrics Results In Fewer Components On The Server Node • An Integrated Fabric Balances Fabric and Compute  Scaling Application Performance & Efficiency Fabrics Integration Required to Scale Performance & Power 38
  • 39. Thank You