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Die Product Applications

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  • 1. Die Product Applications Chris Windsor Portelligent Inc. DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Furthermore, Portelligent extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.
  • 2. Outline • CDMA Phones – Past & Present • GSM Phones – Past & Present • Example of “Extreme” IC Packaging • Key IC Metrics for CDMA Phones and PDAs WWW.PORTELLIGENT.COM 2
  • 3. CDMA Phones Past & Present 1997 Qualcomm Q Phone 2001 Samsung SPH-x4200 102 mm x 56 mm x 25 mm 89 mm x 50 mm x 24 mm 147 grams 94 grams WWW.PORTELLIGENT.COM 3
  • 4. Qualcomm Q Phone Dual-Mode Phone (CDMA 800 MHz & Analog) • All ICs packages have peripheral leads. 1 12 • All 12 of the ICs directly support phone functions in some way 6 1. Flash Memory 5 2. SRAM Memory 3. EEPROM Memory 2 11 7 4. Baseband CDMA Processor 5. Controller 6. Multiplexer 3 7. Dual Frequencey Synthesizer 8. Rx AGC Amplifier 9. Baseband Analog Processor 10. Tx AGC Amplifier 4 8 11. Power Amplifier 12. Linear Amplifier 10 • 20.1 cm2 of IC packaging 9 • 608 IC Pins WWW.PORTELLIGENT.COM 4
  • 5. Samsung SPH-x4200 CDMA-2000 Phone 12 1 • Almost all ICs are packaged into 11 area array type packages. 2 • The phone functions performed by 13 ICs: 1. Fujitsu Flash and NEC FCRAM memory 3 2. Atmel EEPROM (WL-CSP) 10 3. Tx Processor 4. Tx ASIC 9 4 5. Voltage Regulator 6. PLL / Synthesizer 7. LNA / Mixer 8. Rx Processor 8 9. Dual Comparator 10. Audio Processor 5 11. Audio Synthesizer 12. AMD Flash & Samsung SRAM 7 • 9.5 cm2 of IC packaging 6 13 • 714 IC Pins WWW.PORTELLIGENT.COM 5
  • 6. Multi-Chip BGAs Stacked packages that combine Flash and SRAM are common place in today’s cellular phones. Some of the components combine ICs from different fabricators as exemplified by these two memory products from AMD and Fujitsu. Notice that the components noted below, as well as the large BGA to their left, are underfilled with a clear material. Approximately 30% of the relatively large fine-pitch BGA components Portelligent sees are underfilled. AMD DS42585 Underfilled Stacked Memory Package (73-Ball Fine-Pitch Grid Array 8 x 11 mm; 0.80 mm pitch) Contains an AMD/Fujitsu 4 Mbyte Flash die and a Samsung 1 Mbyte SRAM Die • The AMD/Fujitsu die is on bottom, and measures 10.00 x 4.82 mm • The Samsung SRAM die measures 8.07 x 5.32 mm • For more info, see www.amd.com/us-en/assets/content_type/white_papers_and_tech_docs/25032.pdf Fujitsu MB84VD23280FA Underfilled Stacked Memory Package (65-ball plastic FBGA; 0.80 mm pitch) Contains an AMD/Fujitsu 8 Mbyte Flash die and a NEC 1 Mbyte FCRAM Die • The AMD/Fujitsu die is on bottom; measures 7.72 x 6.86 mm Main Board • The NEC FCRAM die measures 8.00 x 4.53 mm • For more info, see http://edevice.fujitsu.com/fj/DATASHEET/e-ds/e550221.pdf WWW.PORTELLIGENT.COM 6
  • 7. Wafer Level CSP Many vendors are starting to offer small, commodity ICs in a simple WL-CSP formats, as exemplified by this EEPROM part from Atmel. Given the small size of these components, underfilling is deemed unnecessary. Atmel 24C256 Wafer Level CSP • 32 Kbyte EEPROM • Die Size = 3.78 x 2.32 mm • Atmel’s 8-ball 0.75 pitch, Die Ball Grid Array Package format (dBGA) • For more info, see http://www.atmel.com/atmel/acrobat/doc0670.pdf Main Board WWW.PORTELLIGENT.COM 7
  • 8. Adhesive Flip Chip Flex Circuit Assembly for the Display NEC Power Supply IC adhesive flip chip bonded 2-Layer Polyimide Substrate Side 1 Side 2 WWW.PORTELLIGENT.COM 8
  • 9. Anisotropic Conductive Film Adhesive Flip Chip Bonding ACF Flip Chip has been used for several years as an attachment method for Chip-On-Glass (e.g. attaching display drivers to displays. It is now starting to be used in other applications – such as this flex circuit – that would otherwise have used a packaged IC or a Tape-Automated Bonded (TAB) IC. ACF Adhesive Film NEC One of the inherent attributes of ACF flip Display Power Supply chip bonding is the ACF underfills the IC #uPD161660 bonded device. The bead of material Die Size = 4.19 x 4.34 mm seen around the bottom edge of the chip 68 IO with gold bumps is a result of the material being squeezed IO Pitch = 0.20 mm out during the thermocompression bonding process. WWW.PORTELLIGENT.COM 9
  • 10. GSM Phones Past & Present 2001 Nokia 8310 97 mm x 43 mm x 17 mm 1996 Nokia 1610 84 grams 160 mm x 58 mm x 28 mm 250 grams WWW.PORTELLIGENT.COM 10
  • 11. Nokia 1610 900 MHz GSM Phone 1 2 3 • All ICs packages have peripheral leads. • All 12 of the ICs directly support phone functions in some way 1. Power Controller 2. Transceiver 3. Synthesizer / PLL 5 4 4. RF Front End 5. Battery Charge Controller 6 7 8 9 6. Flash Memory 7. Controller ? 8. SRAM Memory 9. Power Amplifier 10. Analog Interface 11. Baseband Processor 12. Interface Controller • 20.7 cm2 of IC packaging 12 11 10 • 636 IC Pins WWW.PORTELLIGENT.COM 11
  • 12. Nokia 8310 900/1800 MHz GSM Phone 1 • All ICs except one are packaged into various area array packages. • The phone functions of the 8310 performed by 4 ICs: 1. Nokia GSM Transceiver 2. AMD Flash Memory 3. TI Baseband Processor Dual Band 4. STMicroelectronics Power Mgmt PA Module AM/FM Radio 2 • All phones have some amount of SRAM memory, but this 8310 had no separate device present, so it is assumed the SRAM is integrated into one of the ASICs • 6.7 cm2 of IC packaging • 568 IC Pins 3 4 WWW.PORTELLIGENT.COM 12
  • 13. The Mitsubishi D2101V An Outlier or an Example of Phones to Come? Released by NTT DoCoMo in March 2002, the D2101V is a continuation of the FOMA handset line and the first to use i-motion video-clip and music transmission service with a videophone. The 3G phone features a single, fixed digital camera that allows viewing from two directions: one for real time videoconferencing and the other for taking photographs or making videos. The phone also features a large 132x162-pixel color display and has a data transfer rate of 384Kbps (packet transmission) or 64Kbps for videophone calls. WWW.PORTELLIGENT.COM 13
  • 14. Mitsubishi D2101V “Extreme” IC Packaging Techniques • Dual Chip BGA Package assembled with Adhesive Flip Chip – The first use of adhesive flip chip bonding of a large processor type IC that was made even more notable by having two chips bonded on both sides of a substrate. Also notable was that the chips were extraordinarily thin. • Stacked Processor ICs – Stacked memory chips (e.g. combinations of Flash and SRAM) have become common place; but this is the first observed instance of two large processor ICs being stacked. • Multi-Chip Modules – Two custom (hybrid) components in the form of fine-pitched BGAs. WWW.PORTELLIGENT.COM 14
  • 15. Baseband & Application Processors Dual Chip BGA Top Die Size 10.6 x 11.8 x 0.2 mm B- B’ Package Size 22.0 x 22.0 x 1.0 mm B - B’ Adhesive Flipchip #1 (face-down) Adhesive Flipchip #2 (face-up) 1.00 mm 6-layer,Microvia Substrate Epoxy around the Main Board component’s perimeter Two chips assembled by adhesive flip chip on both sides of 6 layer, build-up substrate. Chip thicknesses were 0.15 mm on bottom side and 0.20 mm on top. The stacked package was underfilled at the package perimeter after surface mount. WWW.PORTELLIGENT.COM 15
  • 16. Bottom Side of Baseband / Application Processor 620 IOs on a 0.5 mm pitch. Bottom Die Size 10.6 x 10.6 x 0.15 mm WWW.PORTELLIGENT.COM 16
  • 17. Video Processor Dual Chip BGA A -A ’ Package 20.0 x 20.0 x 1.24 mm 465 Connections 0.5 mm Pitch Solder FlipChip bonded bottom die; 12.25 x 12.25 Wirebonded top die; 12.0 x 12.0 A - A’ 1.24 mm Main Board Top chip is wire-bonded; bottom chip is solder flip chip bonded. The package is not underfilled. WWW.PORTELLIGENT.COM 17
  • 18. Display Assembly Multi-Chip BGA Components 3-Chip BGA Package LCD Controller 2-Chip BGA Package Display Driver Display Driver Unknown Function Voltage Generator Wirebonded chips, laid side-by- Wirebonded chips, laid side-by- side onto organic substrate side onto organic substrate 14 x 13 x 1.5 mm 8.3 x 9.6 x 1.35 mm 134 connections 72 connections 0.8 mm pitch 0.8 mm pitch WWW.PORTELLIGENT.COM 18
  • 19. Key IC Component Metrics • CDMA Phones • PDAs WWW.PORTELLIGENT.COM 19
  • 20. CDMA Mobile Phones IC Component Counts '97 Qualcomm 2700 '01 Audiovox CDM-9100 '99 Qualcomm 860 '00 Motorola P8767 '01 Sanyo SCP5000 CDMA / Analog; Avg. = 16 '01 Samsung SPH-T100 '01 Kyocera QCP3035 '01 LG TM510 '01 Panasonic 2101v '01 NEC N2001 W-CDMA; Avg. = 27 '01 Samsung SPH-X4200 CDMA-2000 '99 Qualcomm PDQ 1900 '97 Qualcomm Q Phone '99 NeoPoint NP1000 '98 Sony Z100 '99 Sprint Touchpoint CDMA; Avg. = 18 '99 Samsung SCH-A100 (Median = 16) '00 Motorola V.8162 '01 Withus WCE-100 0 5 10 15 20 25 30 35 40 Yellow bars indicate phones made before year 2000. Average number of ICs for phones made before 2000 is 21; average for 2000 and later is 14. WWW.PORTELLIGENT.COM 20
  • 21. CDMA Mobile Phones IC Pin Counts '00 Motorola P8767 '01 Sanyo SCP5000 '01 Audiovox CDM-9100 '97 Qualcomm 2700 '99 Qualcomm 860 CDMA / Analog; Avg. = 634 '01 Kyocera QCP3035 (Median = 578) '01 Samsung SPH-T100 '01 LG TM510 '01 Panasonic 2101v '01 NEC N2001 W-CDMA; Avg. = 1577 '01 Samsung SPH-X4200 CDMA-2000 '99 Qualcomm PDQ 1900 '00 Motorola V.8162 '99 NeoPoint NP1000 CDMA; Avg. = 623 '97 Qualcomm Q Phone (Median = 589) '98 Sony Z100 '99 Sprint Touchpoint '01 Withus WCE-100 '99 Samsung SCH-A100 0 200 400 600 800 1000 1200 1400 1600 1800 2000 Yellow bars indicate phones made before year 2000. Average IC pin count for phones made before 2000 is 623; average for 2000 and later is 643. WWW.PORTELLIGENT.COM 21
  • 22. CDMA Mobile Phones IC Package Areas (cm²) '97 Qualcomm 2700 '00 Motorola P8767 '01 Audiovox CDM-9100 '99 Qualcomm 860 '01 Sanyo SCP5000 CDMA / Analog; Avg. = 10.5 '01 Samsung SPH-T100 '01 Kyocera QCP3035 '01 LG TM510 '01 Panasonic 2101v W-CDMA; Avg. = 14.8 '01 NEC N2001 '01 Samsung SPH-X4200 CDMA-2000 '99 Qualcomm PDQ 1900 '97 Qualcomm Q Phone '99 NeoPoint NP1000 '98 Sony Z100 '99 Sprint Touchpoint CDMA; Avg. = 16.8 '99 Samsung SCH-A100 (excluding the PDQ 1900) '00 Motorola V.8162 '01 Withus WCE-100 0 5 10 15 20 25 30 35 40 45 Yellow bars indicate phones made before year 2000. Average IC package area for phones made before 2000 was 18.9; average for 2000 and later is 8.6. WWW.PORTELLIGENT.COM 22
  • 23. CDMA Mobile Phones IC Die Area to Package Area Ratios (Total Die Area ÷ Total Package Area) '01 LG TM510 '01 Sanyo SCP5000 '01 Kyocera QCP3035 '99 Qualcomm 860 '00 Motorola P8767 CDMA / Analog; Avg. = 0.20 '01 Samsung SPH-T100 '01 Audiovox CDM-9100 '97 Qualcomm 2700 '01 Panasonic 2101v '01 NEC N2001 W-CDMA; Avg. = 0.56 '01 Samsung SPH-X4200 CDMA-2000 '00 Motorola V.8162 '01 Withus WCE-100 '99 Samsung SCH-A100 '98 Sony Z100 '97 Qualcomm Q Phone CDMA; Avg. = 0.18 '99 Qualcomm PDQ 1900 '99 Sprint Touchpoint '99 NeoPoint NP1000 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 Yellow bars indicate phones made before year 2000. Average IC chip area to package area ratio for phones made before 2000 was 0.17; average for 2000 and later is 0.27. WWW.PORTELLIGENT.COM 23
  • 24. CDMA Mobile Phones Average IC Pins per CM2 of Package Area '00 Motorola P8767 '01 Kyocera QCP3035 '01 Sanyo SCP5000 '01 LG TM510 CDMA / Analog; Avg. = 60 '01 Samsung SPH-T100 '99 Qualcomm 860 '01 Audiovox CDM-9100 '97 Qualcomm 2700 '01 NEC N2001 W-CDMA; Avg. = 120 '01 Panasonic 2101v '01 Samsung SPH-X4200 CDMA-2000 '00 Motorola V.8162 '01 Withus WCE-100 '99 Samsung SCH-A100 '98 Sony Z100 '99 Sprint Touchpoint CDMA; Avg. = 37 '99 NeoPoint NP1000 '97 Qualcomm Q Phone '99 Qualcomm PDQ 1900 0 20 40 60 80 100 120 140 Yellow bars indicate phones made before year 2000. Average IC pins per cm2 of package area for phones made before 2000 was 37; average for 2000 and later is 76. WWW.PORTELLIGENT.COM 24
  • 25. PDAs IC Component Counts '01 Royal daVinci DV1 <$100 PDA '01 Allstar Protégé Avg. = 5 '01 Compaq iPAQ Pocket PC '99 Vadem Clio WinCE '00 HP Jornada 548 Avg. = 28 '02 Handspring Treo 180 '99 Palm VII '02 Sony Clie PEG-NR70V Palm OS '00 Sony Clie Avg. = 19 '01 Palm i705 '00 Handspring Visor '99 Palm V '99 Epson Locatio '01 Nokia Communicator 9210 Other OS and >$100 '98 Nokia Communicator 9110 Avg. = 19 Avg. = 23 '00 Panasonic Pocket-E '00 Vtech Phusion '99 Psion Revo EPOCH OS 0 5 10 15 20 25 30 35 40 45 Yellow bars indicate PDAs made before 2000. Hatch filled bars indicate PDAs that are also mobile phones. Average number of ICs for PDAs made before 2000 is 22; average for 2000 and later is 19. WWW.PORTELLIGENT.COM 25
  • 26. PDAs IC Pin Counts '01 Royal daVinci DV1 <$100 PDA '01 Allstar Protégé Avg. = 307 '01 Compaq iPAQ Pocket PC '99 Vadem Clio WinCE '00 HP Jornada 548 Avg. = 1119 '02 Sony Clie PEG-NR70V '02 Handspring Treo 180 '00 Sony Clie Palm OS '01 Palm i705 Avg. = 636 '99 Palm VII '00 Handspring Visor '99 Palm V '99 Epson Locatio '98 Nokia Communicator 9110 '01 Nokia Communicator 9210 Other OS and >$100 '00 Panasonic Pocket-E Avg. = 1095 '00 Vtech Phusion '99 Psion Revo EPOCH OS 0 200 400 600 800 1000 1200 1400 1600 1800 Yellow bars indicate PDAs made before 2000. Hatch filled bars indicate PDAs that are also mobile phones. Average IC pin count for PDAs made before 2000 is 893; average for 2000 and later is 758. WWW.PORTELLIGENT.COM 26
  • 27. PDAs IC Package Areas (cm²) '01 Royal daVinci DV1 <$100 PDA '99 Vadem Clio '01 Compaq iPAQ Pocket PC WinCE '00 HP Jornada 548 Avg. = 32.15 '00 Sony Clie '99 Palm VII '00 Handspring Visor Palm OS '01 Palm i705 Avg. = 13.46 '02 Handspring Treo 180 '02 Sony Clie PEG-NR70V '99 Palm V '99 Epson Locatio '00 Panasonic Pocket-E '00 Vtech Phusion Other OS and >$100 '98 Nokia Communicator 9110 Avg. = 25.19 '01 Nokia Communicator 9210 '99 Psion Revo EPOCH OS 0 5 10 15 20 25 30 35 40 45 Yellow bars indicate PDAs made before 2000. Hatch filled bars indicate PDAs that are also mobile phones. Average IC package area for phones made before 2000 was 24.0 cm²; average for 2000 and later is 17.2 cm². WWW.PORTELLIGENT.COM 27
  • 28. PDAs IC Die Area to Package Area Ratios (Total Die Area ÷ Total Package Area) '01 Royal daVinci DV1 <$100 PDA '00 HP Jornada 548 '99 Vadem Clio WinCE '01 Compaq iPAQ Pocket PC Avg. = 0.21 '02 Sony Clie PEG-NR70V '02 Handspring Treo 180 '99 Palm V Palm OS '00 Sony Clie Avg. = 0.19 Avg. = 0.14 '01 Palm i705 '00 Handspring Visor '99 Palm VII '01 Nokia Communicator 9210 '98 Nokia Communicator 9110 '99 Epson Locatio Other OS and >$100 '00 Panasonic Pocket-E Avg. = .23 '00 Vtech Phusion '99 Psion Revo EPOCH OS 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 Yellow bars indicate PDAs made before 2000. Hatch filled bars indicate PDAs that are also mobile phones. Average IC chip area to package area ratio for PDAs made before 2000 was 0.21; average for 2000 and later is 0.26. WWW.PORTELLIGENT.COM 28
  • 29. PDAs Average IC Pins per CM2 of Package Area (Total Pins ÷ Total Package Area) '01 Royal daVinci DV1 <$100 PDA '00 HP Jornada 548 '01 Compaq iPAQ Pocket PC WinCE '99 Vadem Clio Avg. = 35 '02 Sony Clie PEG-NR70V '02 Handspring Treo 180 '01 Palm i705 '99 Palm V Palm OS Avg. = 51 '00 Sony Clie Avg. = 39 '00 Handspring Visor '99 Palm VII '01 Nokia Communicator 9210 '98 Nokia Communicator 9110 '99 Epson Locatio Other OS and >$100 '00 Vtech Phusion Avg. = 51 '00 Panasonic Pocket-E '99 Psion Revo EPOCH OS 0 20 40 60 80 100 120 Yellow bars indicate PDAs made before 2000. Hatch filled bars indicate PDAs that are also mobile phones. Average IC pins per cm2 of package area for PDAs made before 2000 was 39; average for 2000 and later is 50. WWW.PORTELLIGENT.COM 29

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