Spansion NOR Flash Memory 3.0V Spansion NOR AL-J Family 1.8V ...
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Spansion NOR Flash Memory 3.0V Spansion NOR AL-J Family 1.8V ... Document Transcript

  • 1. Spansion NOR New Products Flash Memory Spansion NOR Flash Memory 3.0V Spansion NOR AL-J Family 1.8V Spansion NOR AS-J Family Spansion now offers the 3.0V Spansion NOR AL-J family, enabling easy migration from conventional products, and the 1.8V Spansion AS-J family, which is optimal for portable applications requiring miniaturization, weight reduction, and lower power consumption. Overview simplify migration. Density types are 8Mb and 16Mb. In addition to the The 3.0V Spansion NOR AL-J and 1.8V AS-J families are conventional TSOP and BGA, 16Mb product has been added NOR Flash memories manufactured using 110nm floating as a fortified BGA package to the product line. gate technology. The AS-J family is an optimal solution for portable applications The AL-J family is the successor of the current 200nm AL-D requiring miniaturization, weight reduction, and lower power family offering improved performance and advanced functions consumption. It supports the 1.8V (1.65V to 1.95V) operation of the AL-D family. Maximum consideration has been given voltage required in portable applications. to compatibility with prior generations of the AL family to In addition to the TSOP and KGD/KGW package options Figure 1 Expected Demands for Portable Applications 2008 No.3 FIND Vol.26 1
  • 2. Spansion NOR New Products Flash Memory from the current MBM29SL family, we have added WLCSP Sector protection (Wafer-L evel C hip-S cale Package), the smallest package for CFI (Common Flash Interface) compliant NOR Flash memories to the product line. Figure 1 presents the expected demands for portable applications. s Main features of the Spansion NOR AS-J Family Density: 8Mb/16Mb Package: 48-pin TSOP/WLCSP Target Applications Spansion s universal footprint with consistent packaging and pinouts across product families, process technologies, and s 3.0V Spansion NOR AL-J Family densities The AL-J family offers extended temperature ranges and can 110nm floating gate technology be used in various environments. It can be applied in a wide 1.65V to 1.95V read/write operation appropriate for battery range of applications, from DVD players to industrial and operated applications automotive applications. A secured silicon region may be programmed and locked at Figure 2 presents the target application examples of the AL-J the factory or by the customer family. s 1.8V Spansion NOR AS-J Family The AS-J family is suited for small and light portable applications such as MP3 players, GPS and Bluetooth applications, the demands for which are expected to Figure 2 AL-J Family Application Examples grow rapidly in the future. Figure 3 presents the target application examples of the AS-J family. Product Features s Main features of the Spansion NOR AL-J Family Density: 8Mb/16Mb Package: 48-pin TSOP/48-ball FBGA/64-ball fortified BGA (16Mb only) Spansion s universal footprint with consistent packaging and pinouts across product families, process technologies, and densities Figure 3 AS-J Family Application Examples 110nm floating gate technology Fastest access time in the industry: 55ns 3.0V read and write single power supply operation Sector architecture is compatible with the AL-D family, a secured silicon region may be programmed and locked at the factory or by the customer 2008 No.3 FIND Vol.26 2
  • 3. Spansion NOR New Products Flash Memory Ultra-small Package WLCSP Product Lineup Spansion added WLCSP, the smallest package size for NOR Table 2 lists the product lineup of the AL-J/AS-J family and Flash memories, to the AS family. Since miniaturization Figure 4 presents the migration to the AL-J/AS-J family. ✱ equivalent to die size is possible with WLCSP, it can satisfy the strict board space requirements of small or slim applications such as Bluetooth, GPS, and MP3 players. NOTES Table 1 presents a comparison of package sizes (with our * Spansion , the Spansion logo, MirrorBit , MirrorBit EclipseTM, conventional products). ORNANDTM, ORNAND2TM, HD-SIMTM, Spansion EcoRAMTM, and combinations thereof, are trademarks of Spansion LLC in the U.S. and other countries. Other names used are for informational Advantages of WLCSP purposes only and may be trademarks of their respective owners. Allows further design miniaturization Potential board savings reduces board cost Allows further flexibility in application design Better moisture sensitivity no dry bake required Directly solderable leverages existing SMT assembly equipments Same product quality grade as standard packages Table 1 Comparison of Package Size (with our Conventional Products) Table 2 AL-J/AS-J Product Lineup 2008 No.3 FIND Vol.26 3
  • 4. Spansion NOR New Products Flash Memory Figure 4 Migration to AL-J/AS-J Family 2008 No.3 FIND Vol.26 4