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    Spansion Spansion Document Transcript

    • Spansion WS-N Family TM with MirrorBit technology TM Spansion, the industry’s leading producer of NOR Flash memory, offers a highly scalable, cost effective memory platform for 1.8-volt wireless applications. Manufactured using second-generation MirrorBit™ technology, the Spansion™ WS-N Flash memory family delivers the next industry standard for mobile handsets and is available today from AMD. attractive cost structure. As a result, handset designers can create higher levels of functionality – including At-a-glance multimedia messaging services, push-to-talk, and location- based services – at more compelling price points. • The industry’s best price-performance NOR Flash memory solution The Spansion WS-N family has been optimized for both • Optimized for 1.8-volt wireless chipsets (TI, Qualcomm, current and upcoming generations of 1.8-volt wireless Motorola, etc.) chipsets and processor cores. For example, the WS-N • Consistent pinout facilitates design reuse and Flash memory family sustains high-frequency read speeds accelerates time-to-market up to 80 MHz to complement high-performance processor cores from ARM and MIPS® Technologies. • Multi-chip product (MCP) options support memory densities up to 4 Gigabits in a consistent footprint and The Spansion WS-N product family also includes pinout Advanced Sector Protection, featuring password-level protection, to fortify the security of code and data. So Industry's best price-performance for 1.8-volt wireless no matter which chipset or operating system you’re Spansion’s WS-N memory solutions deliver the industry’s using, Spansion’s S29WS-N family provides outstanding best price-performance for mobile phones by combining performance and security for your memory subsystem. the industry’s fastest reads with the industry’s most DESIGNED FOR USE WITH LEADING CHIPSETS, SOFTWARE, AND PROGRAMMERS INCLUDING: Processor Cores and Chipsets Software and Operating Systems Automated Programming ARM Java™ BP Microsystems OMAP™ Platform Linux® Data I/O MIPS® Technologies Palm OS™ Flash Support Group (FSG) Motorola Spansion™ File System HI-LO Systems Philips Symbian OS™ Minato Electronics Qualcomm Windows Mobile™ System General Texas Instruments Xeltek
    • Single pinout for single-die and multi-chip products “SAMSUNG Electronics is very pleased with Spansion’s focus on customer needs in the development of second-generation MirrorBit technology. Designed to help reduce time-to-market for handset Spansion’s new technology provides exactly the kind of price-performance designers and manufacturers, the Spansion WS-N family needed for us to continue delivering many of the industry’s most innovative utilizes a consistent pinout and command set for densities and unique mobile phones.” as high as 4 Gigabits. What’s more, a single pinout supports both single-die and multi-chip products KS Hyun, Vice President of Telecommunication Networks SAMSUNG Electronics (e.g. Flash memory + SRAM, Flash memory + pSRAM, Flash memory + media storage). As a result, customers who standardize on Spansion’s Spansion WS-N Family Pinout 1.8-volt memory platform can reuse and repurpose a AVD# VSS CLK F2-CE# F-VCC F-CLK# RFU F2-OE# single design for different market segments and F-WP# A7 R-LB# ACC WE# A8 A11 F3-CE# geographies. Because future Spansion WS-N memory A3 A6 R-UB# F-RST# R1-CE2 A19 A12 A15 plans include a wide variety of densities and MCP A2 A5 A18 F-RDY/ A20 A9 A13 A21 LEGEND combinations, you can easily scale your designs together R-WAIT# FLASH/xRAM/MEDIA SHARED A1 A4 A17 R2-CE1 A23 A10 A14 A22 with regional infrastructures or changing market demand. A0 VSS DQ1 R2-VCC R2-CE2 DQ6 A24 A16 FLASH/MEDIA SHARED FLASH ONLY F1-CE# OE# DQ9 DQ3 DQ4 DQ13 DQ15 R-CRE In addition, Spansion’s close collaboration with chipset R1-CE1# DQ0 DQ10 F-VCC R1-VCC DQ12 DQ7 VSS xRAM SHARED designers, software vendors, and automated programming R-VCC DQ8 DQ2 DQ11 A25 DQ5 DQ14 F-WP# MEDIA STORAGE ONLY vendors means that we're already at work developing A27 A26 VSS F-VCC F4-CE# R-VCCQ F-VCCQ R-OE# RESERVED FOR FUTURE USE resources to facilitate future chipset and software upgrades. Component Read Performance Write Performance – 1MB MPEG4 Download 2.5G network at 384 kbps 3G network at 2mbps Spansion WS-N 80 MHz Spansion WS-N 21 sec Spansion WS-N 4.7 sec Intel W18 66 MHz NAND 21 sec NAND 4.0 sec Intel L18 54 MHz Intel W18 21 sec Intel W18 6.0 sec NAND 20 MHz Intel L18 21 sec Intel L18 6.9 sec 15 25 35 45 55 65 75 85 MHz 0 5 10 15 20 0 5 10 15 Source: Published specifications, May 2004 Source: Published specifications, May 2004 Total Memory Subsystem Cost Typical Standby Power Consumption / Total Memory Subsystem 154% Intel W18 (2x Flash + pSRAM) NAND Intel L18 Pricing not found (Flash + pSRAM) Intel W18 NAND 109% (NAND + SDRAM) Intel L18 Spansion WS-N 100% (Flash + pSRAM) Spansion WS-N 90% 100% 110% 120% 130% 140% 150% 160% Relative pricing 0 1000 2000 3000 4000 5000 6000 Source: Published prices, May 2004 Source: Published specifications, May 2004
    • Aggressive roadmap to future cost reduction Currently manufactured using second-generation As the world’s leading supplier of NOR Flash memory MirrorBit technology, the Spansion WS-N Flash memory solutions, Spansion expects to move quickly along its family is the industry’s best price-performance NOR aggressive roadmap for 1.8-volt wireless markets. With Flash memory solution. In fact, second-generation third-generation MirrorBit technology, new MCP solutions MirrorBit technology delivers the following advantages (e.g. Flash memory + media storage), and higher densities over multi-level cell (MLC) floating gate technology: already in development, the Spansion WS-N memory platform is positioned to become the next industry • Intrinsic manufacturing yields as much as 30% higher standard in Flash memory. than multi-level cell (MLC) floating-gate technology, • Number of critical mask layers reduced by 40% as For more information about Spansion WS-N Flash compared to MLC floating-gate technology memory solutions, as well as other Spansion memory products, visit us at www.amd.com or contact your local • Streamlined manufacturing process for 10% higher fab sales office. throughput than MLC floating-gate technology Technology Roadmap for Wireless Markets: 1.8 volts Performance Flash Memory for XIP Spansion WS-N Family 110 nm 90 nm 65 nm 45 nm 64, 128, 256 Mb 128, 256, 512 Mb 256, 512+ Mb Flash Memory for XIP or Media 110 nm 90 nm 65 nm 256, 512 Mb 256, 512, 1024 Mb Flash Memory for Media 90 nm 65 nm 45 nm 1024, 2048 Mb 2048+ Mb MirrorBit Technology TM Planned roadmaps, June 2004 Technology Roadmap for Wireless Markets: 3.0 volts Performance Flash Memory for XIP Spansion PL-J Family 110 nm 32, 64, 128 Mb Spansion PL-N Family 90 nm 110 nm 128, 256, 512 Mb 65 nm 64, 128, 256 Mb Flash Memory for XIP or Media Spansion GL-N Family 110 nm 90 nm 65 nm 45 nm 128, 256, 512 Mb 128, 256, 512, 1024 Mb 256, 512, 1024, 2048 Mb Flash Memory for Media 90 nm 65 nm 45 nm 2048, 4096 Mb 4096+ Mb MirrorBit Technology TM Floating-gate Technology Planned roadmaps, June 2004
    • About Spansion™ Flash Memory Products Spansion™ Flash memory products encompass a broad spectrum of densities and features to support a wide range of markets. Spansion Flash memory customers represent leaders in the wireless, cellular, automotive, networking, telecommunications and consumer electronics markets.There are a variety of Spansion Flash memory products, such as devices based on the innovative MirrorBit™ technology; the award-winning simultaneous read-write (SRW) product family; super low-voltage 1.8-volt Flash memory devices; and burst- and page-mode devices. Information about Spansion Flash memory solutions is available at http://www.spansion.com/overview. Spansion was formed by the integration of AMD’s and Fujitsu’s Flash memory operations in 2003. It is the largest NOR Flash memory company in the world. Spansion Flash memory solutions are available worldwide from AMD (NYSE: AMD) and Fujitsu (TSE:6702). About AMD AMD (NYSE:AMD) designs and produces innovative microprocessors, Flash www.amd.com memory devices and low-power processor solutions for the computer, One AMD Place communications and consumer electronics industries. AMD is dedicated to P.O. Box 3453 delivering standards-based, customer-focused solutions for technology users, Sunnyvale, CA 94088-3453, USA Tel: (408) 732-2400 or (800) 538-8450 ranging from enterprises and governments to individual consumers. For more TWX: 910-339-9280 TELEX: 34-6306 information visit www.amd.com. © 2004 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo and combinations thereof are trademarks of Advanced Micro Devices, Inc. Spansion, the Spansion logo, FASL, MirrorBit, and combinations thereof, are trademarks of FASL LLC. Other company and product names used in this publication are for identification purposes only and may be trademarks of their respective companies.