®
Ortronic
FROM THT TO SMT
From THT to SMT: Evolution of manufacturing technology in Ortronic®

From the first equipment's designed, and manually man...
From THT to SMT: Evolution of manufacturing technology in Ortronic®

It is from the year 2010 when Mr. Ortigosa, president...
From THT to SMT: Evolution of manufacturing technology in Ortronic®

The surface-mount technology, is the way or processes...
From THT to SMT: Evolution of manufacturing technology in Ortronic®

3.

The automation of the manufacturing process is an...
From THT to SMT: Evolution of manufacturing technology in Ortronic®

DISADVANTAGES OF SMT TECHNOLOGY
1.

The slowness of t...
From THT to SMT: Evolution of manufacturing technology in Ortronic®
Rapid prototyping system
System for prototype PCB manu...
More information:

EDUARDO MORENO LATORRE
INDUSTRIAL ENGINEER
R&D ORTRONIC TECHNOLOGY
eduardo.moreno@ortronic.com
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From THT to SMT

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Transcript of "From THT to SMT"

  1. 1. ® Ortronic FROM THT TO SMT
  2. 2. From THT to SMT: Evolution of manufacturing technology in Ortronic® From the first equipment's designed, and manually manufactured, by Mr. Ortigosa in the 1980s, until those manufactured and marketed by Ortronic Technology, S.L. during the last decade, the technology used for the manufacture of printed circuit boards (PCB), was the called Through-Hole Technology (THT). The Through-Hole Technology (THT), is a type of technology that uses the holes that are practised in the printed circuit boards for the various electronic components mounting, to create electrical bridges between one of the faces of the mounting plate to the other, using a lead pipe, which is generally an alloy of zinc copper and silver, to prevent oxidation and allow your welding. Old PCB of Ortronic® equipment's manufactured with THT technology.
  3. 3. From THT to SMT: Evolution of manufacturing technology in Ortronic® It is from the year 2010 when Mr. Ortigosa, president and technical director of Ortronic® , due to the high demand for the products developed from the Ortronic technology, decided to go one step towards innovation redesigning all of its products to manufacture by SMT technology, with the objective of be ready to meet the future needs of the market. There are two main advantages provided by the use of SMT technology and supporting the decision to carry out all the redesign of products to a new technology: firstly, the improvement of the performance in the production due to the automation in the components placement, and secondly the reduction of the size and weight of the printed circuit boards in more than 50%. Although the cost is not a determining factor in the manufacture of products of a technology without competence as Ortronic®, always provide that the products of this technology reach a greater market share, mainly those consumers belonging to developing countries, one of the main beneficiaries of the advantages of our technology. Therefore, the cost will also mean in this case an indirect advantage.
  4. 4. From THT to SMT: Evolution of manufacturing technology in Ortronic® The surface-mount technology, is the way or processes used to solder micro miniaturized surface-mount components, SMC, on the same surface of a printed circuit board PCB without need to traverse the card as in the previous THT technique. Although we have already mentioned some of the main advantages of using SMT technology, we are going to explain in detail the advantages and disadvantages of this technology: ADVANTAGES OF SMT TECHNOLOGY 1. Reduce the size of the printed circuit boards because of placing components on both sides of the PCB and remove the insertion holes and the contacting annular rings with the component. 2. Weight reduction due to the use of micro-miniaturized components.
  5. 5. From THT to SMT: Evolution of manufacturing technology in Ortronic® 3. The automation of the manufacturing process is an improvement in the production efficiency and also in the quality because of the repeatability. The use of computercontrolled manufacturing process makes the control much easier. 4. In the case of passive components such as resistors and capacitors, the values are much more precise. 5. The fact that the external terminals of the components are miniaturized allows a reduction of electromagnetic interference, a higher noise immunity as well as a decrease in signal delay caused by the inductances and parasitic resistances, that are created at the weld points of the components. 6. SMT is an economic solution to the integrated circuits of high number of components and a cost reduction in each component individually.
  6. 6. From THT to SMT: Evolution of manufacturing technology in Ortronic® DISADVANTAGES OF SMT TECHNOLOGY 1. The slowness of the domestic market to technological change causes almost exclusive dependence of markets in Central Europe and the United States. On many occasions and especially in the early phase of design this implies delays due to component search and receiving them. SOLUTION: In recent years, Ortronic Technology, S.L. has been in contact with major suppliers and manufacturers of electronic components in Central Europe and the United States getting ensure product quality and shorten the times production in the future. 2. The reduced size of components makes virtually impossible the manual assembly, which is very important in the development phase of the product. SOLUTION: The rapid Prototyping System of Technology, SL 3. R&D+I Laboratory of Ortronic By reducing the size of components so does the heat dissipation area. SOLUTION: The technological evolution of the heatsinks used by Ortronic ® systems.
  7. 7. From THT to SMT: Evolution of manufacturing technology in Ortronic® Rapid prototyping system System for prototype PCB manufacturing including multilayer up to 8 layers. Systems: o o o o o Protomat S63: Milling machine for prototyping of multilayer PCBs up to 8 layers. Multipress: Printing press for the production of multilayer PCB prototypes. Contact RS: Galvanic metallization. Protoplace S: Semiautomatic Pick & Place for the production of PCB Prototypes, SMD technology. Protoflow S: Reflow Oven for SMT soldering. Protomat S63 Multipress Contact RS Protoplace S Protoflow S Examples of SMD Multilayer PCBs developed by Ortronic®
  8. 8. More information: EDUARDO MORENO LATORRE INDUSTRIAL ENGINEER R&D ORTRONIC TECHNOLOGY eduardo.moreno@ortronic.com

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