<ul><li>Mass Market Wireless Multimedia </li></ul><ul><li>The Chipset Challenge of Smaller, Faster, Cheaper… </li></ul>Tom...
Evolution in TI Wireless Chipset Business Diverse Customers with Varying Product Requirements TI has shipped over  1 Billi...
Small size, stylish design Handsets as a fashion statement Long battery life Learn from the mistakes of initial WCDMA hand...
Architectural and Technology Solutions for Wireless Multimedia Required -- A multi-pronged approach to meeting the challen...
2.5G/3G Handset System Integration Wireless Terminals require “Antenna to Applications” solutions <ul><li>Optimized 2.5G a...
2.5G/3G Terminal Functions Integration at the Chipset Level Increased functionality, smaller size, reduced power consumpti...
 
2.5G & 3G Communications Processing Complexity   Requirements-- More silicon, More SW, More MIPS <ul><li>Baseband Processi...
<ul><li>Three options for multimedia processing </li></ul>Power-efficient Multimedia Processing   Balancing flexibility, h...
2.5G & 3G Terminals as  Open Platforms Application SW innovation will drive mobile Internet market growth <ul><li>2.5G and...
First Tri-Wireless PDA Concept Design GSM/GPRS, Wireless LAN, and Bluetooth <ul><li>Simultaneous functions with multiple w...
Upcoming SlideShare
Loading in...5
×

Tom Pollard

307

Published on

Published in: Technology, Business
0 Comments
0 Likes
Statistics
Notes
  • Be the first to comment

  • Be the first to like this

No Downloads
Views
Total Views
307
On Slideshare
0
From Embeds
0
Number of Embeds
0
Actions
Shares
0
Downloads
4
Comments
0
Likes
0
Embeds 0
No embeds

No notes for slide
  • As I’ve mentioned, one of the market trends that TI is enabling is the increasingly competitive landscape of wireless device manufacturers. Several new entrants have emerged in recent years….that include China local companies and service providers who are introducing mobile devices with their own brands. In addition, ODMs in Taiwan and Korea are playing an increasing role supporting both the emerging players and the established mobile device manufactuers. Each of these types of companies have a variety of needs when it comes to wireless SC solutions – and these needs vary within a company depending on the program. Considerations include time-to-market, desire to differentiate, level of engineering support and wireless systems support required from the SC vendor. (CLICK FOR SLIDE BUILD) To support the needs of all types of companies, across all types of programs TI offers flexible solution delivery and engagement model – ranging from custom solutions, to chipset solutions, to complete hardware and software reference designs – all the way to wireless modules available from third party companies using TI technology.
  • Tom Pollard

    1. 1. <ul><li>Mass Market Wireless Multimedia </li></ul><ul><li>The Chipset Challenge of Smaller, Faster, Cheaper… </li></ul>Tom Pollard Worldwide Chipset Marketing Director Texas Instruments Incorporated
    2. 2. Evolution in TI Wireless Chipset Business Diverse Customers with Varying Product Requirements TI has shipped over 1 Billion cellular digital baseband processors for wireless handsets Hardware & Software Reference Designs Chipsets & OMAP Application Processors Third-Party Modules Custom Solutions TI Wireless Technology Custom Turnkey Flexible Solution Delivery TI Wireless Technology Consumer Brand OEMs Communications OEMs China Local Brands ODMs PDA/PC OEMs Service Provider Branded Devices Smartphone Platform Series60 <ul><ul><li>Time to market </li></ul></ul><ul><ul><li>Product differentiation </li></ul></ul>Varying needs: <ul><ul><li>Engineering support </li></ul></ul><ul><ul><li>Wireless system support </li></ul></ul>Established Emerging
    3. 3. Small size, stylish design Handsets as a fashion statement Long battery life Learn from the mistakes of initial WCDMA handsets Rapid reductions in handset cost Consumer market pricing for broad acceptance Giving Consumers What They Want Expectations derived from 2G Wireless and the Internet Simplicity and immediate gratification Fully integrated “wireless appliances” User choice of applications and content In search of the “killer app” The Challenge – Handheld Wireless Multimedia for the Mass Market
    4. 4. Architectural and Technology Solutions for Wireless Multimedia Required -- A multi-pronged approach to meeting the challenge <ul><li>Power-efficient applications and communications processing </li></ul><ul><li>Open Platforms for SW Innovation </li></ul><ul><li>System Integration for Handset Optimization </li></ul><ul><li>Integration at the Chipset Level for Power and Size Reduction </li></ul>
    5. 5. 2.5G/3G Handset System Integration Wireless Terminals require “Antenna to Applications” solutions <ul><li>Optimized 2.5G and 3G solutions require system expertise and integration of all handset blocks! </li></ul><ul><li>Applications Processing </li></ul><ul><ul><li>OMAP TM Applications Processors </li></ul></ul><ul><ul><li>Operating system support and Java </li></ul></ul><ul><ul><li>OMAP Developers Network </li></ul></ul><ul><li>Complete handset and smartphone reference designs </li></ul><ul><ul><li>Modules, handsets, smartphones, PDAs </li></ul></ul><ul><li>Communications processing </li></ul><ul><ul><li>Digital, Analog, and RF chipsets </li></ul></ul><ul><ul><li>Protocol stack software </li></ul></ul><ul><li>Additional wireless technologies </li></ul><ul><ul><li>Bluetooth, 802.11, and GPS </li></ul></ul>SOFTWARE Protocol Stack Analog, Power Management RF OMAP Developer Applications OS and Smart Phone SOFTWARE SOFTWARE Media engines OMAP Applications Processor Applications Hardware and Software Reference Designs System Solutions Communications Processor Communications Bluetooth 802.11 Complementary Technologies GPS
    6. 6. 2.5G/3G Terminal Functions Integration at the Chipset Level Increased functionality, smaller size, reduced power consumption <ul><li>Coming Soon – the Single Chip Cell Phone! </li></ul><ul><li>Reduced cost-per-function </li></ul><ul><li>Cost reductions at the system level </li></ul><ul><li>Increased performance for multimedia features </li></ul><ul><li>Longer battery life – better talk and stand-by times </li></ul><ul><li>Smaller form factor to enable small, sleek mobile devices </li></ul><ul><li>Easier design and test for wireless designers due to new turn-key, ready-to-manufacture solutions </li></ul>Why Integrate?
    7. 8. 2.5G & 3G Communications Processing Complexity Requirements-- More silicon, More SW, More MIPS <ul><li>Baseband Processing Trends </li></ul><ul><li>Increased digital baseband horsepower for higher data rates </li></ul><ul><li>Logic migration from SW to HW for performance and power consumption </li></ul><ul><li>Higher memory requirements for protocol stack and applications </li></ul><ul><li>Support for data standards </li></ul><ul><ul><li>TCP/IP </li></ul></ul><ul><ul><li>H.263 videoconferencing </li></ul></ul><ul><ul><li>SMS / EMS / MMS </li></ul></ul><ul><li>Integration of: </li></ul><ul><ul><li>Communications and applications </li></ul></ul><ul><ul><li>Functions – Bluetooth, USB, 802.11, GPS, etc. </li></ul></ul><ul><li>Encryption and security requirements </li></ul>Logic Gates 2G 2.5G 3G Comms MIPS Comms Memory 1x 1x 1x 1.5x 10x 1.5x 5x 2x 6x Digital Baseband Complexity
    8. 9. <ul><li>Three options for multimedia processing </li></ul>Power-efficient Multimedia Processing Balancing flexibility, horsepower, and power consumption TI OMAP Processor (OMAP1610) <ul><li>Optimized wireless multimedia requires appropriate use of each processor </li></ul><ul><li>A multi-processor approach allows more intelligent power management strategies </li></ul><ul><ul><li>Different operational modes use different processor subsets </li></ul></ul><ul><ul><li>Processor engines are powered-off when not in use </li></ul></ul><ul><li>Parallel processing increases effective MIPS and guarantees QoS </li></ul><ul><li>Power-efficient wireless multimedia requires optimal silicon-level and system-level integration of all three types of processing engines </li></ul><ul><ul><li>General purpose RISC processor </li></ul></ul><ul><ul><li>Programmable DSP </li></ul></ul><ul><ul><li>Dedicated HW accelerators </li></ul></ul><ul><ul><li>RISC for maximum flexibility, high-level language and OS support </li></ul></ul><ul><ul><li>DSPs provide flexible acceleration with proven power consumption benefits </li></ul></ul><ul><ul><li>HW acceleration trades reduced flexibility for minimum die-size and maximum performance </li></ul></ul>
    9. 10. 2.5G & 3G Terminals as Open Platforms Application SW innovation will drive mobile Internet market growth <ul><li>2.5G and 3G must deliver compelling applications and content </li></ul><ul><li>Applications SW design and architecture directly impact the user experience </li></ul><ul><ul><li>Speed and responsiveness </li></ul></ul><ul><ul><li>Handset power efficiency and battery life </li></ul></ul><ul><li>Handsets are evolving into more open platforms </li></ul><ul><ul><li>Open software environment at the handset and chipset level </li></ul></ul><ul><ul><li>Flexibility for the handset OEM, wireless operator, and consumer </li></ul></ul><ul><li>High-level OS and/or Java will become standard for 2.5G & 3G </li></ul><ul><li>The search for “killer apps” requires a thriving SW developer base </li></ul><ul><li>ISV diversity ensures the best applications and wireless experience </li></ul>
    10. 11. First Tri-Wireless PDA Concept Design GSM/GPRS, Wireless LAN, and Bluetooth <ul><li>Simultaneous functions with multiple wireless connections </li></ul><ul><li>GSM phone calls </li></ul><ul><li>Always-on cellular GPRS or high-speed Wireless LAN web browsing and e-mail </li></ul><ul><li>Bluetooth file transfer, printing, and headset </li></ul><ul><li>DSP-accelerated Multimedia Applications </li></ul><ul><li>High performance digital still camera </li></ul>Announced March 17 WANDA Enables: Integrates unique:
    1. A particular slide catching your eye?

      Clipping is a handy way to collect important slides you want to go back to later.

    ×