Mr Fournier Qualcomm LTE

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  • CDMA ~20% of total Wireless Subs -> long runway for 3GSome industry analysts believe 3G handset shipments into emerging regions could exceed 50% of total in 2011 (Internal believe a bit less than 50%)New Device categories– USBs still strong, tablets and in future M2M (smartgrid, wireless health)
  • Spectrum Initiatives (Approved messaging from Govt. Affairs)Qualcomm strives to encourage the most efficient possible use of scarce spectrum by inventing techniques to enable operators to gain the greatest capacity for voice and data.  These techniques include the use of femtocells and the deployment of a new, more dense network topology to encourage spectrum reuse.  Nevertheless, Qualcomm strongly supports the allocation of additional spectrum by regulators around the world, including Australia, which is absolutely necessary to keep pace with the ever-increasing demand from consumers for mobile broadband services.  In the case of Australia, we urge the Government to ensure spectrum is made available as soon as possible in the 700 MHz and 2.5 GHz bands, which are spectrum bands that are already in use by mobile broadband in other countries around the world. 
  • Part of our platform approach is to support broad choice of OS and device types. Only company supporting this many HLOSAnd, as a result, only company supporting so many diverse device types
  • To do this, need have built and industry leading portfolio of technologiesThis opens up new device types, new network opportunitiesOur platform is also able to smartly choose among available connections to choose the best one available
  • Focus on the connected networks, devices, appliances,….. portraying a web of connectedness that can capture anything that involves your daily life.
  • Platform approach is enabling consumers to get content of choice on any device. Content choice because of Snapdragon processors strength and broad availability Advance GPU – you see leading gamer choosing Snapdragon when they move into mobileYou see:Leaders in gaming from other platforms, Sony and MSFT Xbox, choosing us to go mobileCompanies like netflix who distribute premium content relying on us for securityMobile banking tying into our security features to enable a broad range of transaction sizesContent EverywhereMulti screen experience
  • 2012 = 3.3 DMIPS/MHz x 1.7GHz x 2 cores2014 = 3.3 DMIPS/MHz x 2.5GHz x 4 cores
  • Battery Technology and the Energy GapThe energy gap is the difference between the linear improvement in Li-ion technology vs. the exponential energy utilized by smart phonesLi-Ion battery technology will saturate in about 5 yearsAnticipate 40% improvement due to process optimizationThe next level of energy density will require new technology, new materials and new chemistryWe will need about a 10x increase in battery capacity by 20201J. Ofversten, “Mobile Internet Impact on Battery Life,” IWPC, 2008
  • This, at a greater level of detail, demonstrates everything that goes into the snapdragon systemAnd it is building these best in class technologies and integrating them to work together into a single, complete chipset which is helping Snapdragon drive innovation for our partners
  • Integration is also key to taking advantage of the trend of adding more and more capabilities to the phone. As we add more and more capabilities, we need to doe this extremely efficiently. Computing must be done at low power because power is limited by battery size and consumer desire to not have to plug in their phones mid-day. PCB size is limited by how large a phone consumers will want to carry, and purses and pockets are not changing size.It is only through integration that phones will continue to expand what they can do.And Qualcomm is the only silicon company with all this expertise in house, which means only we can integrate it effectively.There are many advantages to integration, and you have probably heard me talk about several of them before. For example:Size: today we are delivering much of the capabilities of recent PCs in a package the size of a postage stamp, including a 3G modem.Power: today we are up to 35% more efficient than general ARM chips, delivering more performance at less power which can turns into more talking, texting and browsing between charges.Cost: Integration is generally less expensive than assembling discrete solutions from multiple vendors and then having to package them together yourself. We’ve estimated that an integrated solution can be up to 15% lower on silicon and 20% lower on packaging. These are important amounts, especially when you consider that the most market growth will be at lower price points.Engineering Savings: it is probably self evident, but it is more efficient for an OEM to integrate fewer vs more chips. With Qualcomm, there is also the added benefit that we are offering a solution where everything is designed and tested to work together. For test alone, this could reduce an OEMs test time (or costs) by up to 30%. Again, this size of # matters when time to market and cost are becoming so important.Today I want to look more deeply at the superior performance of Qualcomm’s solution
  • Focus on the connected networks, devices, appliances, using different wireless technologies (3G, WiFi, Bluetooth….)….. portraying a web of connectedness that can capture anything that involves your daily life.
  • Mr Fournier Qualcomm LTE

    1. 1. LTE : A driver to devicecomplexity for smartexperiencesIDATE 2011
    2. 2. GROWTH DRIVERS 2G to 3G Emerging New Device Advanced Smartphones Migration Regions Categories Technology2
    3. 3. Addressing Data Demand Growth  Deploy 3G enhancements that increase capacity and performance  Leverage advanced topology solutions  Deploy next-gen LTE to complement 3G and boost data capacity  Continue to optimize Airlink technology  Spectrum3
    4. 4. 3G and 4G continue parallel evolution 2011 2012 2013 2014+ CDMA2000 1X Advanced 1X Up to 4x voice capacity increase SIMULTANEOUS 1X VOICE AND EV-DO/LTE DATA (SVDO/SVLTE) Rev A Multicarrier H/W Upgrade EV-DO EV-DO Rev. B DO Advanced (Commercial) DL: 3.1 Mbps DL: 9.3 Mbps DL: 14.7 Mbps DL: 14.7 Mps UL: 1.8 Mbps UL: 5.4 Mbps UL: 5.4 Mbps UL: 5.4 Mbps Rel-7 Rel-8 Rel-9 Rel-10 Rel-11 & Beyond HSPA+ HSPA+ HSPA+ HSPA DL: 14.4 Mbps DL: 28 Mbps (Commercial) DL: 42 Mbps (Future) Advanced DL: 84 Mbps (10 MHz) DL: 168 Mbps (20 MHz) DL: 336+ Mbps (40MHz) 1 UL: 5.7 Mbps UL: 11 Mbps UL: 11 Mbps UL: 23 Mbps (10 MHz) UL: 23 Mbps (10 MHz) UL: 46+ Mbps Rel-8 Rel-9 Rel-10 Rel-11 & Beyond LTE Leverages new, wider LTE LTE LTE and unpaired spectrum FDD andTDD (Future) Advanced DL: 73 – 150 Mbps2 (10 MHz – 20 MHz) DL: 1+ Gbps3 (Up to 100 MHz) UL: 36 – 75 Mbps2 (10 MHz – 20 MHz) UL: 375+ Mbps3 (Up to 100 MHz) Commercial 1R11 expands multicarrier to 40 MHz to reach up to 336 Mbps, 2Peak rates for 10 and 20 MHz FDD using 2x2 MIMO, standard supports 4x4 MIMO enabling peak rates of 300 Mbps. Peak data rates takes overhead into account, per standards 172 Mbps is achievable in 20 Mhz. 3Peak rates can exceed 300 Mbps by4 Note: Estimated commercial dates. aggregating multiple 20 MHz carriers planned for LTE Advanced (LTE Rel-10). Peak data rate can exceed 1 Gbps using 4x4 MIMO and at least 80 MHz of spectrum Created 09/19/2011
    5. 5. More RF Bands for Mobile Broadband China Japan North America UMTS/CDMA2100 CDMA/UMTS850 UMTS /CDMA AWS CDMA850 UMTS/CDMA2100 UMTS/CDMA1900 CDMA450 UMTS1700 UMTS/CDMA850 TD-SCDMA1900 UMTS/LTE1500 (B11) Extended AWS TD-SCDMA2000 LTE1500(B21) LTE700 TD-LTE2300 LTE850 TD-LTE2600 (B41) TD-LTE 2600 (B38) LTE900 MSS 1500 (L-Band) TD-LTE2600 (Bxx) MSS2100 (S-band) India CDMA850 Europe UMTS2100 South America UMTS900 UMTS2100 TD-LTE2300 S Korea UMTS2100 UMTS900 UMTS1800 CDMA450 UMTS850 UMTS1900 LTE1800 LTE850 UMTS850 UMTS1800 Australia UMTS2100 UMTS2600 CDMA1700 LTE800 UMTS2100 LTE2600-FDD UMTS850 TD-LTE2100 (B34) UMTS900 LTE26005
    6. 6. LTE Carrier #3 LEVERAGE WIDER LTE Carrier #1 Aggregated PRIMARILY HIGHER LTE Up to BANDWIDTH Carrier #4 LTE Data Pipe 100 MHz DATA RATES Carrier aggregation across Carrier #2 (bps) multiple carriers and multiple bands LTE Carrier #5 CARRIER AGGREGATION ENHANCES USER HIGHER PEAK AND LEVERAGES ALL EXPERIENCE USER DATA RATES SPECTRUM ASSETS (OVER 1 GBPS POSSIBLE)6
    7. 7. Device and OS Choice7
    8. 8. Multi-Mode Connectivity 2G, 3G, 4G, LTE, WiFi, Powerline, NFC, Bluetooth, FM, Location8
    9. 9. MACROMICROPICO
    10. 10. FEMTOCELL CONSUMER SMART ELECTRONICS METERS HOME BODY AREA AUTOMOBILESAPPLIANCES SENSORS
    11. 11. Smart Experiences Combining Powerful Local Processing and Cloud Connectivity12
    12. 12. The Future Mobile Experience Everything The World Organized Devices Personified Connected Around You13
    13. 13. Increasing Smartphone Compute Power DMIPS 35,000 3.3 DMIPS/MHz x 30,000 2.5GHz x 4 Cores 25,000 20,000 15,000 10,000 5,000 0 1996 1998 2000 2002 2004 2006 2008 2010 2012 201414
    14. 14. The Power Management Crisis Balancing Usage and Battery Management—An Ongoing Crisis Improvement Application and Services Requirements Power Battery Battery Capacity Crisis Hardware and Power Management Improvement 2G < 1W 2.5G~2-3W 3G up to 5W 4G up to 10W 2000 2008 2010 Source: Informa Telecom and Media15
    15. 15. Modems need to be Complete Built Smarter to Work Smarter Multimode 3G/4G Voice Power OS Support Optimization GPS Broadcast Soft AP RF Multiband Qualcomm Designs, Integrates and Delivers all the Pieces Advanced DSP Receivers Connectivity Simplified APIs16
    16. 16. Modems need to be Complete Solutions That Adapt to Network Conditions Delivering Faster, Smoother Real-time Connections Smoothest Always Fastest Voice and Data Connected Connections  Real-time optimized  3G/4G, WLAN, BT, FM  Industry leading capacity loads technologies  Multimode/Multiband  Seamless handoffs  Real-time connection  Strong reliable connection choices  HD Voice in more places  Smart signal clean-up  Noise cancellation  Smart power management and savings  Pre-designed to work best with apps  Support for connected processors applications17
    17. 17. Processors need to be Complete Built Smarter to Work Smarter Multimedia Power Mgmt GPS RF GPU Software/ HLOS CPU Qualcomm Memory Designs, Integrates and Delivers all the Pieces DSP Connectivity Modem18
    18. 18. Industry needs to Deliver Full Benefits of Integration SMALLER FOOTPRINT 10–20% smaller LOWER SYSTEM COSTS LOWER CHIP COSTS ~$3–$6 BOM savings ~10–20% savings LESS ENGINEERING, FASTER TIME TO MARKET POWER EFFICIENT >745 devices launched Up to 35% better in Fiscal 2010 Source: Qualcomm estimates.19
    19. 19. World’s First Multi-Mode 3G / 4G Integrated Chipset MSM8960 CPU UPGRADE MULTI-MODE MODEM  New micro-architecture  Integrated LTE Multi-Mode  ~5x performance  All 3G modes supported MDM 8960  ~75% lower power LTE/TD LTE MULTI-MODE 3G DUAL CORE GRAPHICS UPGRADE INTEGRATED  ~4x performance CONNECTIVITY  WLAN, GPS, Bluetooth, FM FIRST CHIP OF THE NEW SNAPDRAGON FAMILY20
    20. 20. Thanks

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