Solving Assembly Challenges in Reduced Footprint Applications
 

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Solving Assembly Challenges in Reduced Footprint Applications

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Smaller, lighter, and thinner electronic devices and their inherently restrictive design envelopes present several challenges on the road to their assembly and manufacture. Hardware for component ...

Smaller, lighter, and thinner electronic devices and their inherently restrictive design envelopes present several challenges on the road to their assembly and manufacture. Hardware for component attachment must perform reliably, despite the shrinking and limited footprints for fastener placement and installation. In addition, designers face reduced parts counts for weight savings and production economies.
An entirely new generation of micro-fasteners has been introduced to help resolve these challenges when size and space matter. ??
This presentation will expand on the hardware demands and profile several advanced micro-fastener technologies gaining traction as suitable attachment solutions in the marketplace. It will include an evolving line of self-clinching and flaring micro fasteners serving today – and tomorrow — as practical and cost-effective alternatives to conventional loose hardware, welding, and adhesives. Specific applications and capabilities will be highlighted, based on existing end-product designs and anticipated packaging requirements down the road. The presentation will underscore how micro fasteners ultimately can help (and not hinder) key design and function objectives. By attending this special, free 1-hour webinar you will gain a better understanding of the new alternatives you now have available for your reduced footprint designs.

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Solving Assembly Challenges in Reduced Footprint Applications Presentation Transcript

  • 1. Solving Assembly Challenges in Reduced Footprint Applications
  • 2. Before We Start This webinar will be available afterwards at designworldonline.com & email Q&A at the end of the presentation - Post your questions in questions box in gotowebinar panel on the right Hashtag for this webinar: #DWwebinar
  • 3. Moderator Presenter Leslie Langnau Jay McKenna Design World Penn Engineering
  • 4. PennEngineering microPEM™ Fastener Technology Presented by Jay McKenna Global Product Mgr – New and Micro Products Solving Assembly Challenges in Reduced Footprint Applications 5
  • 5. Who is PennEngineering? • Penn Engineering & Manufacturing Corp. (PEM) founded in 1942 in Doylestown, Pennsylvania, USA is the global leader in the design and manufacture of thin sheet fastening devices and installation systems. • PEM is the inventor and continues to be the sole manufacturer of genuine PEM® brand fasteners. • We currently have regional manufacturing and technical centers in two U.S. locations, Ireland and China. 6
  • 6. PENNENGINEERING FASTENER INSTALLATION METHODS • • • • • • • • Self-Clinching Broaching Surface mount Weld Flaring Swaging Inserts for plastics Blind threaded rivet 7
  • 7. PENNENGINEERING Technical Services • On-Site training. • Comprehensive website includes complete fastener 3D modeling capabilities. • Trained field technical representatives • Global testing laboratories. • Cost Savings Investigations (C.S.I.). • Prototype development. • Installation solutions. 8
  • 8. What is the “micro” in microPEM? • • • • • Threads as small as M1. Pin diameters as small as 1mm. Standoff lengths as short as .040”/1mm. Attach sheets as thin as .003”/0.08mm. Clinching into sheets as thin as .012”/0.3mm. Smaller products are in development. 9
  • 9. Why so small? We actively conduct Product Teardowns and CSI reviews for our customers. We have found in our analysis and investigations that they often need smaller and smaller clinch fasteners for thinner and thinner panels, to replace the adhesives, rivets or welds they have been using. This is driving us to provide more assembly options for when they are designing their next product. 1
  • 10. Micro Fasteners Overview A new family of solutions from PennEngineering 1
  • 11. MPP MPP - Micro Pin • Satisfies micro positioning and alignment requirements with pin diameters as small as 1.0mm. • Flush installation into materials as thin as .020” / 0.5mm and as hard as HRB 92 / HB 195, such as stainless steel. • Made from A286 - excellent corrosion resistance. • Chamfered end eases mating hole alignment. • RoHS compliant. 1
  • 12. MPP – Application Example Phone: Pin used as a spring anchor. 13
  • 13. MPP – Application Example 400,000 per day, replacing weld pins 14
  • 14. MSO4 MSO4™ - Self-clinching Micro Standoffs • Thread sizes: M1.0, M1.2, M1.4, M1.6, #0-80, #2-56 • Made from 400 Series Stainless Steel • Installs into materials with a maximum hardness of HRb 88 and as thin as 0.4mm / .016” (0.3mm / .012” possible with modification) • Lengths as short as 1mm or .04” • Round, knurled head for close centerline to edge placement. • RoHS compliant 15
  • 15. MSO4 – Application Example Phone: Standoffs clinched into 0.4mm/.016” stainless. 16
  • 16. MSO4 – Application Example Cell phone: M1.4 Standoff clinched into 0.43mm/.017” stainless. 17
  • 17. MSO4 – Application Example Cell phone: M1.4 Standoff welded onto 0.4mm/.016” stainless. 18
  • 18. MSO4 – Application Example Laptop: M2 standoffs clinched into 0.5mm/.020” stainless heatsink mounting plate. 19
  • 19. MSOFA – Flaring Standoff – Application Example Camera: M1.6 standoffs flared into 0.2mm/.008” stainless heatsink mounting plate. 20
  • 20. SMTSO Micro SMTSO • Surface mounted to PCB. • Thread sizes down to M1. • Material choices: Brass, Steel • Bright or Matte Tin plated • Sold Loose or Tape-And-Reel • Hex body for additional strength. 21
  • 21. SMTSO – Application Example Laptop: M2 SMT nuts 1mm tall on PCB 2.5mm ID spacer 22
  • 22. Inserts for Plastic SI® Brand Micro Inserts for Plastics • Thread Sizes from M1.0 • Material choices: Brass, Stainless Steel • Style Choices: Ultrasonic, Heat-Stake, Molded-In, Press-In 23
  • 23. Do you use micro screws? 1. Yes – only to hold an assembly together. 2. Yes – to allow for disassembly and reassembly. There are now two new engineered solutions. 24
  • 24. Micro TackPin Yes – to hold an assembly together. Solution = Micro TackPin 25
  • 25. Micro TackPin • Intended for attaching two surfaces together, much the way a screw would. The part clinches into the bottom member while retaining the top member with a head. • Tapered tip assists in assembly into the very small mounting hole. • Interference band sizes hole during assembly to alleviate tolerance concerns. 26
  • 26. Micro TackPin 27
  • 27. Micro TackPin Value = Significant Cost Reduction 28
  • 28. Micro TackPin – Application Example Over 250 million screw replacements this year for this project Over 150 million more for two other projects 29
  • 29. Micro TackPin – Application Example PCB to copper busbar 30
  • 30. Micro TackPin • What is the benefit to use a PEM® TackPin instead of a screw? o The PEM® TackPin is stronger in pullout than the thread strength of a screw of the same length. o No risk of cross-threading. o Less weight than a screw. o Smaller than a screw, so designs can be thinner/smaller. o No need for the cost of a nylon locking patch. 31
  • 31. Micro TackPin • What is the process cost savings? Simplified assembly - press-in versus turned screw. Throughput is faster. No need to control torque settings to drive screws. No scrap costs due to cross-threading, over installation, or screw breakage during assembly. o If adhesives are used, a PEM® TackPin can be used without any recycling concerns that adhesives can cause. o o o o 32
  • 32. Micro TackPin 33
  • 33. Do you use micro screws? 1. Yes – only to hold an assembly together. 2. Yes – to allow for disassembly and reassembly. There are now two new engineered solutions. 34
  • 34. Mortorq® Super Screw Yes – to allow for disassembly and reassembly. Solution = licensed MTS® Screw 35
  • 35. Mortorq® Super Screw 36
  • 36. Mortorq® Super Screw 54% reduction 37
  • 37. Mortorq® Super Screw 38
  • 38. Mortorq® Super Screw 39
  • 39. Mortorq® Super Screw 40
  • 40. PennEngineering microPEM™ Fastener Technology Solving Assembly Challenges in Reduced Footprint Applications 41
  • 41. Questions? Ask a question by submitting it in the Questions tab in the GoToWebinar panel on the right of your screen Design World Leslie Langnau llangnau@wtwhmedia.com Phone: 440.234.4531 Twitter: @DW_RapidMfg Penn Engineering Jay McKenna JMcKenna@pemnet.com Phone: 215-766-8853 x1229 LinkedIn: linkedin.com/in/jaymckenna
  • 42. Thank You  This webinar will be available at designworldonline.com & email  Tweet with hashtag #DWwebinar  Connect with  Twitter: @DesignWorld  Facebook: /engineeringexchange  LinkedIn: Design World Group  YouTube: /designworldvideo  Discuss this on EngineeringExchange.com