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TeoSys Engineering is a laser micromachining systems integrator and custom laser micromachining services provider.
We specialize in deep UV but use all wavelengths when the situation demands. Our intra-cavity gain control allows us to obtain less taper and thus greater aspect ratios when drilling holes through thick material.
Full size, industrial laser micromachining systems are also offered which house the above as well as up to 8 additional integrated axes of motion and full parts handling subsystems. These systems come with any type of laser (or wavelength (CO2) 10um, (Nd:YAG) 1.064um, 532nm, (UV) 355nm, (UV) 248nm, (UV)193nm) depending on the needs of the customer application. All of the underlying subsystems remain the same. TeoSys has designed the electrical, motion and software interfaces which are applicable to any type of laser (light bulb).
TeoSys offers custom contract services in laser cutting, laser drilling and laser marking. We can laser mark any text, graphics,1 and 2-D barcodes. Our text is as small as 10 microns in character height. Our spot sizes are as small as 1 micron. Our laser systems range from fully automated 5-axis systems to semi-automated 2 axis.
Examples of the materials on which we process: Plastics, Ceramics and Glass.
Polyimide (Kapton) (Kalrez) Polyurethane PTFE Teflon PEBAX Polystyrene Parylene Nylon Polycarbonate Alumina Zirconia Silicon Carbonate Pyrex Glass Borofloat Borosilicate
Diamond Quartz Fused Silica All colored gemstones Steel Stainless Steel Nickle (Mu-metal) Brass Other Metals Organic Materials
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