TeoSys Engineering LLC                                                        Capabilities & Products                Intro...
TeoSys Engineering LLC                                                                Capabilities & ProductsWhat Drives U...
TeoSys Engineering LLC                                                 Capabilities & ProductsApplications – Micro Hole Dr...
TeoSys Engineering LLC                                                   Capabilities & ProductsApplications – Deep Hole D...
TeoSys Engineering LLC                                                 Capabilities & ProductsApplications – Deep Hole Dri...
TeoSys Engineering LLC                                                 Capabilities & ProductsApplications – 532nm Polyure...
TeoSys Engineering LLC                                                 Capabilities & ProductsApplications – 532nm Polyure...
TeoSys Engineering LLC                                                               Capabilities & ProductsApplications –...
TeoSys Engineering LLC                                          Capabilities & ProductsApplications – Generic High-Speed L...
TeoSys Engineering LLC                                                                         Capabilities & Products App...
TeoSys Engineering LLC                                                             Capabilities & ProductsCapabilities – M...
TeoSys Engineering LLC                                                   Capabilities & ProductsApplications – Transparent...
TeoSys Engineering LLC                                             Capabilities & ProductsApplications – Glass Marking & P...
TeoSys Engineering LLC                                                   Capabilities & ProductsApplications – Glass Marki...
TeoSys Engineering LLC                                                         Capabilities & ProductsVisible Glass Markin...
TeoSys Engineering LLC                                                          Capabilities & ProductsCapabilities – Part...
TeoSys Engineering LLC                                                       Capabilities & ProductsApplications –Channel ...
TeoSys Engineering LLC                                                                            Capabilities & ProductsA...
TeoSys Engineering LLC                                      Capabilities & ProductsApplications – Channel Drilling        ...
TeoSys Engineering LLC                                      Capabilities & ProductsApplications – Channel DrillingTeoSys E...
TeoSys Engineering LLC                                                                        Capabilities & ProductsOther...
TeoSys Engineering LLC                                                     Capabilities & ProductsCustom Laser Systems Dev...
TeoSys Engineering LLC                                                                        Capabilities & Products LMS-...
TeoSys Engineering LLC                                                                             Capabilities & Products...
TeoSys Engineering LLC                                                                           Capabilities & ProductsCu...
TeoSys Engineering LLC                                          Capabilities & ProductsCustom Systems - LMS-1500, IR / Gre...
TeoSys Engineering LLC                                         Capabilities & ProductsStandard Systems – LMS-2500 - Heavy ...
TeoSys Engineering LLC                                                   Capabilities & Products    Standard Systems – LMS...
TeoSys Engineering LLC                                                                     Capabilities & Products    Stan...
TeoSys Engineering LLC                                           Capabilities & ProductsLMS-550 – Fully Automated Wire Str...
TeoSys Engineering LLC                                                                       Capabilities & Products  Cust...
TeoSys Engineering LLC                                                            Capabilities & ProductsCustom Systems   ...
TeoSys Engineering LLC                                                                   Capabilities & ProductsOffline NI...
TeoSys Engineering LLC                                      Capabilities & ProductsOffline NIST Traceable MeasurementThe f...
TeoSys Engineering LLC                                                             Capabilities & ProductsIn-Situ NIST Tra...
TeoSys Engineering LLC                                                                        Capabilities & Products In-S...
TeoSys Engineering LLC                                                            Capabilities & Products Software Enginee...
TeoSys Engineering LLC                                                              Capabilities & Products Software Engin...
TeoSys Engineering LLC                                                                            Capabilities & Products ...
TeoSys Engineering LLC                                                                     Capabilities & Products        ...
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TeoSys Laser Micromachining Capabilities - Low Res Version

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TeoSys Engineering is a laser micromachining systems integrator and custom laser micromachining services provider.
We specialize in deep UV but use all wavelengths when the situation demands. Our intra-cavity gain control allows us to obtain less taper and thus greater aspect ratios when drilling holes through thick material.
Full size, industrial laser micromachining systems are also offered which house the above as well as up to 8 additional integrated axes of motion and full parts handling subsystems. These systems come with any type of laser (or wavelength (CO2) 10um, (Nd:YAG) 1.064um, 532nm, (UV) 355nm, (UV) 248nm, (UV)193nm) depending on the needs of the customer application. All of the underlying subsystems remain the same. TeoSys has designed the electrical, motion and software interfaces which are applicable to any type of laser (light bulb).
TeoSys offers custom contract services in laser cutting, laser drilling and laser marking. We can laser mark any text, graphics,1 and 2-D barcodes. Our text is as small as 10 microns in character height. Our spot sizes are as small as 1 micron. Our laser systems range from fully automated 5-axis systems to semi-automated 2 axis.
Examples of the materials on which we process: Plastics, Ceramics and Glass.

Polyimide (Kapton) (Kalrez) Polyurethane PTFE Teflon PEBAX Polystyrene Parylene Nylon Polycarbonate Alumina Zirconia Silicon Carbonate Pyrex Glass Borofloat Borosilicate
Diamond Quartz Fused Silica All colored gemstones Steel Stainless Steel Nickle (Mu-metal) Brass Other Metals Organic Materials

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Transcript of "TeoSys Laser Micromachining Capabilities - Low Res Version"

  1. 1. TeoSys Engineering LLC Capabilities & Products Introducing TeoSys Engineering LLC g y g g Precision Microfabrication, Laser Systems and Integrated Automation Solutions TeoSys Engineering, LLC 2138 Priest Bridge Ct. Ste. 10 Crofton, Maryland 21114 Tel: 410 451 8058 410-451-8058 Fax: 410-451-8059 www.teosys.com Emre Teoman Dana Lee ChurchTeoSys Engineering LLC Confidential
  2. 2. TeoSys Engineering LLC Capabilities & ProductsWhat Drives Us – What we like to do• Finding new and innovative ways of applying lasers and laser solutions to resolve difficult, customer driven applications.• Finding and developing robust solutions where others could not.• Demonstrating lasting and persistent value of our services to our clients and customers.• Seeking to obtain complete customer satisfaction while maintaining a nurturing, creative and fulfilling work environment. Currently installed customer base. We are global!TeoSys Engineering LLC Confidential Page 2
  3. 3. TeoSys Engineering LLC Capabilities & ProductsApplications – Micro Hole Drilling Micro-Hole Drilling In Ceramic Deep Hole Boring 3.6um hole deep bored In Glass 36 h l d b d I Gl In Glass High Speed Micro Hole Drilling in Stainless Steel Laser Hole Drilling Hole Drilling in Silicon (Micro Hole Array) (10um and 50um) (Ø 0.001”)TeoSys Engineering LLC Confidential Page 3
  4. 4. TeoSys Engineering LLC Capabilities & ProductsApplications – Deep Hole Drilling in 1MM thick glass slide Micro-Hole Drilling In Ceramic Deep Hole Boring 3.6um hole deep bored In Glass 36 h l d b d I Gl Hole Drilling in 1MM Soda Lime Glass Close up view of intra-glass nozzle restriction In GlassHole Drilling in 1MM Soda Lime Glass(30um deep bore , 9um spout entrance and30um spout exit) Example of Sub-surfaceshaping.TeoSys Engineering LLC Confidential Page 4
  5. 5. TeoSys Engineering LLC Capabilities & ProductsApplications – Deep Hole Drilling in 1MM Thick Glass Slide Micro-Hole Drilling In Ceramic Hole Drilling in Deep Hole Boring 1MM Soda Lime 3.6um hole deep bored In Glass 36 h l d b d I Gl Glass Gl 31.8um deep bore drill thru 1MM Glass Slide There is less than 3-4 microns of taper throughout the entire 1MM of glass. High aspect ratios are capable via our intra-cavity gain control in our proprietary excimer laser technology.TeoSys Engineering LLC Confidential Page 5
  6. 6. TeoSys Engineering LLC Capabilities & ProductsApplications – 532nm Polyurethane film hole drilling Micro-Hole Drilling In Ceramic 50um Exit holes in Deep Hole Boring thin polyurethane 3.6um hole deep bored In Glass 36 h l d b d I Gl Cheaper and better capability than using an excimer which has a higher maintenance cost. The software seen to the l f i an example h left is l of how we measure our parts. All objective on the 4 p piece turret are calibrated to a NIST traceable slide so that we can guarantee actually measurement and tolerance dt l specifications.TeoSys Engineering LLC Confidential Page 6
  7. 7. TeoSys Engineering LLC Capabilities & ProductsApplications – 532nm Polyurethane film hole drilling Micro-Hole Drilling In Ceramic Deep Hole Boring Line scribe -- Laser entrance side of the polyurethane (27 micron line p y ( 3.6um hole deep bored In Glass 36 h l d b d I Gl width) Indicative of performance for thin (25-125um) polyurethane membrane micromachining using sing diode pumped 532nm as a low cost and fast micromachining solution. Typically this application always performed using an excimer laser.TeoSys Engineering LLC Confidential Page 7
  8. 8. TeoSys Engineering LLC Capabilities & ProductsApplications – Hole Drilling High Speed Micro Hole Drilling in Stainless Steel (Ø 0.001”) Hole Drilling in Silicon (Ø 10um and Ø 50um) Hole Drilling in Stainless Steel Ø 50um through 0.007” thick material (left). Polymer (silicon) hole drilling (right) using 193nm. Small holes are Ø 10um and large holes are Ø 50um.TeoSys Engineering LLC Confidential Page 8
  9. 9. TeoSys Engineering LLC Capabilities & ProductsApplications – Generic High-Speed Large Format Part Marking (Macro – Marking) Slate PlasticGalvo basedmotion controlutilizing all laserwavelengths toperformtraditional partmarking foridentification andserialization.Many materialscan be markedusing manydifferentwavelengths. l h Anodized MetalTeoSys Engineering LLC Confidential Page 9
  10. 10. TeoSys Engineering LLC Capabilities & Products Applications – Micro-Marking / Inscription Excimer marking using line widths 100 um Inscription on High Speed Inscriptions in Polyimide Diamond down to 5 microns. (Text, (Text Logos and 2-D barcode) Small feature micro marking on transparent media. 1mm Square Bounding Box 75 Micron tall characters with 26 micron line thickness (fully adjustable via ICVA) internal to the excimer laser. 2-D Barcodes on MetalTeoSys Engineering LLC Confidential Page 10
  11. 11. TeoSys Engineering LLC Capabilities & ProductsCapabilities – Micro Marking in the Very Small Excimer marking using line widths down to 5 microns. Spot overlap up to 0.33µm in pulse synchronized output mode This means that we mode. are guaranteed a spot at every 0.33µms. Small feature micro marking on transparent media.Custom TeoSys user interface aids the operator in making smallmarks without the knowledge of a CAD system interface.“No prior experience necessary.”TeoSys Engineering LLC Confidential Page 11
  12. 12. TeoSys Engineering LLC Capabilities & ProductsApplications – Transparent Media Marking Judged ‘Best Sample’ 19.9um KerfTeoSys Engineering LLC Confidential Page 12
  13. 13. TeoSys Engineering LLC Capabilities & ProductsApplications – Glass Marking & Precision Reticule Fabrication PROJECT: Marking custom glass optics with ultra low g g p debris micro-inscriptions TeoSys Engineering LLC Confidential Page 13
  14. 14. TeoSys Engineering LLC Capabilities & ProductsApplications – Glass Marking & Precision Reticule Fabrication Second test, most samples had excessive Third Lot, all parts considered OK! debris TeoSys Engineering LLC Confidential Page 14
  15. 15. TeoSys Engineering LLC Capabilities & ProductsVisible Glass Marking - TeoSys Recipe and AdvantagesTeoSys Process Recipe• Final sample set was run @193nm, high rep rate for excimers, excimers with high demagnification low fluence and demagnification, multiple internal (ICGC) and external spatial apertures to control groove shape, reflectivity and translucence.• No additional material or substances were used to enhance inscription q p quality. y• Groove shape is extremely important in controlling the bright and dark field performance of the optic.• Current marking times run from 12min to 35min, without optimization. Faster speeds are p p p probable with additional process development.Advantages• TeoSys can GUARANTEE that this process will never crack or d k damage th substrate (unlike some other laser and deposition processes). the b t t ( lik th l dd iti )• The current process produces very little debris (all submicron in nature) and minimal recast.• May not need post inscription cleaning of any kind. IPA wipes was the only post process used.• None of the samples produced were post process treated in any way.• The TeoSys inscriptions will not degrade, nor loose contrast and are totally insensitive to temperature, humidity, or vibration (unlike other reticule constructions).TeoSys Engineering LLC Confidential Page 15
  16. 16. TeoSys Engineering LLC Capabilities & ProductsCapabilities – Part Marking for Identification High Speed Precision STENT Marking Single pulse implementation of a 2D Data Matrix barcode Barcode i B d is readable via a video microscope display screen using a Data Matrix 2D barcode scanner device. Data Matrix 2-D Barcode on Stent LegTeoSys Engineering LLC Confidential Page 16
  17. 17. TeoSys Engineering LLC Capabilities & ProductsApplications –Channel Drilling 27um Kerf Lines on Aluminum – Cross Pattern Laser Ablation 25um Channel in Plastic Excimer laser Top Hat Shape – Strict Bottom Profile channel drilling for microfluidics (left) as well as thin film ablation (right). bl ti ( i ht) Channel drilling for tube bending applications where the entire wall is removed (bottom 27um Lines on Aluminum right). Using Back Lighting as illuminationTeoSys Engineering LLC Confidential Page 17
  18. 18. TeoSys Engineering LLC Capabilities & ProductsApplications – Channel Drilling Parameter Definition Key Tube Cut Design Parameters • Cut width (kerf) • Spacing between groups • Spacing within a group • Number of groups • Rotation between each line in a group Varying of these parameters will result in successful flexibility for the different tube diameters and flex requirements TeoSys Engineering LLC Confidential
  19. 19. TeoSys Engineering LLC Capabilities & ProductsApplications – Channel Drilling Custom Motion Systems and Fixtures Tube cutting in proprietary pattern.Channel drilling in steel bar stockusing 532nm, frequency doubledNd:YAG laser.Channel widths of 25um through500ums which spans the gamutbetween micromachining andtraditional mechanical machining.TeoSys Engineering LLC Confidential Page 19
  20. 20. TeoSys Engineering LLC Capabilities & ProductsApplications – Channel DrillingTeoSys Engineering LLC Confidential
  21. 21. TeoSys Engineering LLC Capabilities & ProductsOther Applications Laser Micro MoldingLaser 31mmMicrowelding Mold Master - Stainless 1mm 32 AWG 100 micron gears Polyimide on diamond Stainless Tube on diamond MasterCustom Applications Completed Assemblies Polyimide Fiber Optic Print Head Medical Sensor Ablate Window Paralyene and Titanium NitrideTeoSys Engineering LLC Confidential Page 21
  22. 22. TeoSys Engineering LLC Capabilities & ProductsCustom Laser Systems Development – LMS 5000 Automated Part Loading , Drilling, Measurement• Custom designed system to drill 50um Ø and Ejection in Laser Drilling Systemholes in steel mini-cups comprised of Loads and Orients up to 6 Different Part Typesmostly nickel.•Laser is an 1064nm Nd:YAG frequencydoubled to 532nm.•Automation consists of a feeding A t ti i t f f dimechanism, transfer system, pick andplace tool, rotary index plate with 8individual stations.• Motion and laser system is integrated viaexecutive control software which alsoprovides for a simplified man machineinterface for production operators.TeoSys Engineering LLC Confidential Page 22
  23. 23. TeoSys Engineering LLC Capabilities & Products LMS-5000 Laser System Development 4. Parts put onto the index Parts Automation System plate in the appropriate1. Automatic part loading via rung system which alignmentgathers parts from a bin with a single orientation ith orientation. •Each part type has a different drill location •The part is rotated by the index plate to 3. Parts are picked the drill station up via vacuum tool where it is laser and placed onto the drilled indexing plate at the loading station 5. After drilling, the part rotates to the measurement station where it is measured2. Parts arerotated whilefacing upwardsand roll down atrack where theyare placed onto a 6. Based on theplate which measurement, the t thseparates each part is then ejectedpart from the into a good or aother bad binTeoSys Engineering LLC Confidential Page 23
  24. 24. TeoSys Engineering LLC Capabilities & Products • Motion system stageLMS-5000 feedback for operator (axis(Software & Control) position)• Automatic generation of tool • Automatic calibration (in-cut path programs based on situ) of the optical ( ) p (flow) )user specified parameters measurement systemincluding the following: which measures hole •Part type diameter •Hole Diameter •Stage Speed • Automatic statistical •Trepan Number of process control – display Passes and recording t status d di to t t •Laser Energy files• Real time display of systemstatus bits•Real time display of drillingoperation• Operational modes such asdry run and full auto drill • In-Situ Measurement of the machining features (hole diameter) •Vertical distance between calipers, horizontal distance and point to point distance between horizontal and vertical intersecting lines • Bright field dark field illumination top field, illumination, and bottom illumination • Camera switching for operator feedback of multiple automation stations TeoSys Engineering LLC Confidential Page 24
  25. 25. TeoSys Engineering LLC Capabilities & ProductsCustom Systems’ Software – LMS-5000 – Integrated Automatic Inspection • Diameter measurement via light extinction sensor made of dual laser diodes / photo detector combination • Measure hole diameters with 1 micron resolution from 20um Ø through 75um Ø • Basic hole positional information within 25um of true position • Diameter measurement calculated within 500 s a d pos t o measurement within 1 seco d a ete easu e e t ca cu ated t 500ms and position easu e e t t second. • Incorporation of an Ophir Profilometer to measure beam profile • Creation of 3rd order regression curve for calibration of photo detector with actual hole diameters to create the relationship between diameter and application flow rates. • Ability to take real time measurements from instrument • Status and feedback during operationTeoSys Engineering LLC Confidential Page 25
  26. 26. TeoSys Engineering LLC Capabilities & ProductsCustom Systems - LMS-1500, IR / Green Micromachining System (532nm and 1,064um) Semi-Automatic Parts Handling High Speed Precision RotaryTeoSys Engineering LLC Confidential Page 26
  27. 27. TeoSys Engineering LLC Capabilities & ProductsStandard Systems – LMS-2500 - Heavy Duty Excimer Laser System Heavy Duty T300, 193nm Deep UV 300 Hz High Speed Excimer Laser with Power Output of 14-16mJ per pulse at 100 Hz. 2x4” 1/4um accurate precision stages (X, Y, Z, U) Automated Gas Handling. System Two zoom levels Integrated UV and Visible Imaging with projected focusing reticule Four Axis monochromatic illumination systemTeoSys Engineering LLC Confidential Page 27
  28. 28. TeoSys Engineering LLC Capabilities & Products Standard Systems – LMS-650 Professional Excimer Laser System• Heavy Duty T100 Laser.• 193nm Deep UV 100-200 Hz Excimer Laser . p• 10 - 12mJ per pulse.• 2x2” 1um accurate stages (X, Y automated Axis).• 1” 2um accurate manual z-stage.• Manual Gas Handling Handling.• Integrated UV and Visible Imaging with projected focusing reticule.• Two Axis monochromatic illumination system (Top and Bottom) Exclusive Excimer System of Harvard Robotics LaboratoryTeoSys Engineering LLC Confidential Page 28
  29. 29. TeoSys Engineering LLC Capabilities & Products Standard Systems – LMS-500 / 550 Desktop Excimer Laser System• Heavy Duty T20 Laser.• 193nm D 193 Deep UV 25 H E i Hz Excimer L Laser .• 7 - 10mJ per pulse at 100 Hz.• 2x1” 3um accurate stages (automated X, Y manual Z Axis).• 1” 5um accurate manual Z-Stage.• Manual Gas Handling. u G s d g. 193nm Deep UV Laser Source Fully Integrated Desktop Portable Version LMS-550 User FriendlyTeoSys Engineering LLC Confidential Page 29
  30. 30. TeoSys Engineering LLC Capabilities & ProductsLMS-550 – Fully Automated Wire StrippingTeoSys Engineering LLC Confidential Page 30
  31. 31. TeoSys Engineering LLC Capabilities & Products Custom Systems – UV Excimer Laser Integration Custom Drilling System for Medical Custom Systems Retrofitted Into Existing Applications Automation Lines • Integration of custom laser solutions into existing manufacturing systems. • Clean room class 1000 • System Controller with Advanced Burst Mode Power Leveling and Smart • Flow System • Advanced Gas Cabinet with Tank Minder Feature • Ultra-Stable Class I EnclosureTeoSys Engineering LLC Confidential Page 31
  32. 32. TeoSys Engineering LLC Capabilities & ProductsCustom Systems Custom High Speed CO2 Pill Drilling System Generic Rapid Release Windows In medication Custom precision four beam Excimer medical catheter drilling systemTeoSys Engineering LLC Confidential Page 32
  33. 33. TeoSys Engineering LLC Capabilities & ProductsOffline NIST Traceable Measurement for Job Shop The verification of each calibration constant was performed by measuring a known feature size using the NIST traceable calibration slide: The features size according to the documentation that came with the slide is 50 microns. The circles outlined in RED indicate the measurements that we made using the calibration constant. We are good with this measurement.TeoSys Engineering LLC Confidential Page 33
  34. 34. TeoSys Engineering LLC Capabilities & ProductsOffline NIST Traceable MeasurementThe final phaseof the calibrationandmeasurementportion of thepurchase orderwas to password pprotect thecalibrationconstant.This cal constantisi used f th d for themeasurementfor both in-situand offlinemetrology.The screen tothe rightillustrates thepasswordpprotection.TeoSys Engineering LLC Confidential Page 34
  35. 35. TeoSys Engineering LLC Capabilities & ProductsIn-Situ NIST Traceable Measurement for Upgraded Laser with Inspection New Laser System Station and Kinematic TubeCatheter Drilling with In-Situ Holding Fixture Measurement Setup Handling Table Fixture #2 New Magnetic Kinematic Holding Fixture with Aerodynamic Slug Ejection FeatureTeoSys Engineering LLC Confidential Page 35
  36. 36. TeoSys Engineering LLC Capabilities & Products In-Situ Measurement Implementation for Catheter DrillingThe idea of this The next phase of the work that TeoSys took upon itself to perform is the transition from 100% offlineview is to provide measurement to 100% on-line or in-situ , measurement. All measurement deliverables will be100% collected during the drilling process itself. See below:measurementwhile actuallymachining thepart. If the part isleft in-situ, we canmeasure th theactual exitdimensions non-destructively.To the right is apart that had justbeen drilled andwhat themeasurement ofthe exit holewould be.This picture willbe one of thedeliverables asverification of the ifi ti f thdrilling process.TeoSys Engineering LLC Confidential Page 36
  37. 37. TeoSys Engineering LLC Capabilities & Products Software Engineering – Machine Vision Application Micro Inspector: Post-process Micro Operator: Custom Real Time Machine Vision System Measurement and Inspection Tool Aligns part during Full video microscope capability process andd Provides saving and loading of compensates for rotation previously processed images error Allows images to be non-destructively Halts process if pre- overlaid with user supplied text programmed such as titl date, etc. h title, d t t conditions are not met thereby Fully integrated with motion system reducing for complete process inspection improperly processed parts Notifies operator of ifi f processing status Micro View Simple video microscope capability p yTeoSys Engineering LLC Confidential Page 37
  38. 38. TeoSys Engineering LLC Capabilities & Products Software Engineering – Proprietary Products MicroMMI: Real Time Machine Vision System • Multiple image processing algorithms (source code) available via proprietary vision system language (Based on RS 274) RS-274) • Image processing source automatically generated via MicroCaliper program and may be copied into MicroMMI editor • Fully integrated with motion system for pre/post/in-processing inspection, measurement and quality control • Provides full in process laser and system control in-process • Provides an integrated development environment for operator to single step, edit, and debug motion control programs written in the vision system language Allows operator to make measurements of features within the live video image once the software has been calibrated to the optics and motion systemTeoSys Engineering LLC Confidential Page 38
  39. 39. TeoSys Engineering LLC Capabilities & Products The machine vision prototyping application will automatically generate the machine vision PRG programming syntax for each of the commands that the user applies via the user interface. This PRG code can then be copied and pasted into any PRG program that is capable of running with MicroMMI. In order to aid the engineers during experimentation, TeoSys has provided an image and machine vision prototyping application, which can be used to apply the various machine vision algorithms without writing a single line of PRG code. This tuning program allows the user to experiment with all of the machine vision commands before p actually using them in a PRG program. Due to the many variables involved when using any kind of image processing, this user interface was designed to provide a nondestructive method of testing which image processing and measurement functions should be used for a particular video stream. All of the functions that are available in this prototyping interface are available via PRG programming commands to the MicrOperator application so that they may be used in real-time in a motion control program.TeoSys Engineering LLC Confidential Page 39
  40. 40. TeoSys Engineering LLC Capabilities & Products The geometrical Search tool is a very good tool to use when searching for a pattern that moves around the master image, changes intensity, suffers from blurring or defocusing, and for patterns that reverse their contrast. Image number 1 was used to train a fiducial pattern. The ROI was drawn around the fiducial so that the ROI bounding box just enclosed the fiducial fully. After the training was complete, a new image was loaded that was a picture of the same fiducial but its location within the master image had changed and it was severely defocused. The geometrical search algorithm had no problem finding the fiducial in picture number 2. 1. Original Fiducial Image Used to Train Fiducial PatternThe Search tool can be used to find a trained pattern within themaster iimage (fi ld of view) and make a d i i to continue (field f i ) d k decision ibased on the presence or absence of the fiducial or on thefiducial’s location. All patterns must have geometricalcharacteristics that can be seen such as the fiducial above. Thepattern must be unique and different from the rest of the image.It is best to have images that respond well to the Bi-Levelthreshold. If the master image (or field of view) responds well tothe Bi-Level, then most characteristics should be able to befound. 2. Image of Defocused and Moved FiducialTeoSys Engineering LLC Confidential Page 40
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