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Ca To Enhance The Breakthrough Of Intelligent Textile Systems

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  • 1. Information über die Sensorik-relevanten Förderprogramme der EU Sensor + Test 2008 Nürnberg , 6 Mai 2008 Thomas REIBE Microsystems Unit European Commission, Brussels
  • 2. Presentation outline
    • Microsystems + Flexible, organic & large area electronics + Microelectronics + Embedded Systems
      • Sensors in the EU Framework Programmes
      • European Technology Platforms (ETP)
      • FP7 outcome of the first 2 ICT calls
      • The way ahead in Work Programme 2009-2010
  • 3. Micro and nanosystems technologies play a crucial role in modern knowledge-based economies Europe has a traditional leading position in Microsystems and related advanced technologies and should capitalize on this competitive advantage
    • Microsystems technologies is one of the most important drivers of ICT, which account for about 40% of Europe’s productivity growth
    • The relevance of Microsystems comes from:
      • The importance of the semiconductor and micro/nanoelectronics market
      • The added value that the smart systems provide to the applications and systems where they are integrated
    • R&D institutes play an important role in the early phase of the MNT development, prior to industrialization
  • 4. R&D in Microsystems in the EU Framework Programmes: from MEMS to Smart Systems FP4 MEMS Micro and Nanosystems Micro and Nanotechnologies Industrial applications of MEMS Smart Systems: Complex systems combining sensing, processing and actuating The EU Framework Programmes have always paid attention to the area of Microsystems, from a focus on MEMS in the early 90’s to heterogeneous technologies for multifunctional systems now FP5 FP6 Smart Systems: Heterogeneous technologies for multifunctional systems FP7
  • 5. Microsystems is an enabling technology, bringing together separate technologies and sciences Applications
    • Inter-disciplinarity
    • Mechanics, electronics, fluidics, biology, magnetism, optics, photonics, chemistry,
    • Multiple functionalities
    • Sensing, processing, actuating, energy harvesting and storage, communication, memory, logic
    • Convergence of heterogeneous technologies
    • Micro/nanotechnologies, ICT, bioengineering
    • Heterogeneous Materials
    • Semiconductors, ceramic, glass, organics and polymers, metals
    • Biomedical
    • Transport
    • Telecommunications
    • Automotive
    • Safety
    • Environment
    • Smart textiles, …
  • 6. Flexible, Organic and Large Area Electronics (OLAE), towards heterogeneous integration
      • Inorganics/organics combinations, bio & heterogeneous integration in foils, lab-on-chips, printed logic and RFIDs also addressed
      • New manufacturing paradigms & very low cost applications
      • Enabling functions: logic, memory, RFIDs, sensing, lighting, signage, energy scavenging/storage & power management, visualisation systems and displays
  • 7. Sensors/Microsystems + OLAE activities in FP6 10 projects (3 IPs, 1 NoE) 31 M € 11 projects (4 IPs) 54 M € 5 projects (3 IPs, 1 NoE) 35 M € 10+4 projects (2+1 IPs, 2 NoEs) 101 M € 24 projects (6 IPs) 55 M € 11 projects 6 M € Total budget 301M€ 8 projects (4 IPs) 47 M € Micro/Nano-bio ICT AmI Sensor-based systems & storage Smart textiles Support & Coordination Organic electronics & displays Mfg/Process integr. Wireless sensor networks 6 projects
  • 8. ETPs, an industry led forum conceived to support the European Research and Innovation Area A spiral model of innovation
    • Capitalising on the multiple reciprocal relationships between public & private stakeholders,
    • Addressing major technological challenges in specific domains
    • Aiming to leverage public & private investment for R&D & innovation
    • Bundling fragmented R&D efforts towards agreed goal
    • Boosting Europe’s competitiveness via research and innovation
    ETPs are defining and implementing the Strategic Research Agendas (SRAs): medium to long term key objectives for the technology POLICY RESEARCH BUSINESS
  • 9. ETPs, a key organisational innovation in the creation and exploitation of innovation-friendly markets
    • ... And some figures
    • 34 ETPs, 9 in ICT
    • More than 700 organizations involved in ETPs (large companies, SMEs, universities, research labs, ...)
    • 9 SRAs in ICT field, a very important input to ICT WPs
    • Some benefits from ETPs
    • Speed up innovation by knowledge sharing
    • Pool of resources to overcome technology roadblocks
    • Build partnership to share risk
    • Attract higher research investment in Europe
    • Optimise the return of public & private research investment
    • Help turn research results into marketable products and services
    • Boost industrial competitiveness and meet society´s needs
    PARADES
  • 10. There are 34 ETPs successfully working, 9 in ICT www.roboticsplatform.com To boost the development of robotics business & bring robotics services to Europe’s citizens New software & services architecture based on open standards To reinforce Europe’s world leadership in mobile & wireless communications & services To explore the almost limitless applications of light for ICT, lighting, manufacturing and health applications Convergence of existing and new media technologies creating advanced personalised services An integral Satcom initiative covering all aspects of satellite communication To address the needs of silicon-based technologies & beyond Ubiquitous, interoperable & cost-effective embedded systems www.nessi-europe.com www.emobility.eu.org EUROP www.photonics21.de www.nem-initiative.org www.isi-initiative.eu.org www.artemis-office.org www.eniac.eu
  • 11. EPoSS, the ETP in Smart System Integration A multi-disciplinary endeavour: Combining optics, mechanics, electronics, fluidics, thermodynamics, chemistry, biology Converging scientific disciplines: Looking at the overlapping areas between nano-, bio-, information & cognitive sciences Multi-material integration: Semiconductors, polymers (plastics), ceramics, glass, … Multi-technology integration: Monolithic, hybrid, multichip, large-area, … miniaturisation techniques Multi-functional integration: Combining sensing, processing, actuating www.smart-systems-integration.org
  • 12. Results from ICT first calls
    • ICT call 1 « Next generation Nanoelectronics Components and electronics integration » related to More than Moore
    • ICT call 1 « Organic & large area electronics, visualisation and display systems »
    • ICT call 2 « Micro/nanosystems »
    • ICT call 2 « Networked Embedded and Control Systems » related to wireless sensor networks
  • 13. FP7 Projects - Nanoelectronics “More than Moore”
    • FP7 Call 1 in Nanoelectronics covered:
    • More Moore: “to advance miniaturization in baseline CMOS technology”
    • More than Moore: “to master diversification targeting non-digital applications, heterogeneous integration in Systems-on-Chip (SoC) or Systems-in-a-Package (SiP)”
    • Beyond CMOS: “to prepare for the technology generation beyond the CMOS scaling”
    • FP7 ICT Call 1 on Nanoelectronics
    • Total budget: 86 M€
    • More than Moore: 32 M€
    • Beyond CMOS: 3 M€
    • More Moore – Miniturisation: 51 M€.
  • 14. FP7 “More than Moore” Example of projects Wadimos: “To develop a generic technology for the realization of complex electro-photonic integrated ICs using standard CMOS processing technologies.” Rec. Fund: 2.3 M€ Coordinator: Interuniversity Micro-Electronics Center, IMEC Icestars: “Integrated Circuit/EM simulation and design technologies for advanced Radio Systems-on-chip.” Rec. Fund: 2.8 M€ Coordinator: NXP Semiconductor B.V. Elite: “Extended Large (3-D) Integration Technology” Rec. Fund: 3.6 M€ Coordinator: Qimonda Flash GmbH Athenis: “Automotive Tested High Voltage and Embedded Non-Volatile Integrated System on Chip” Rec. Fund: 5.15 M€ Coordinator: Austriamicrosystems AG Mocha: “MOdelling and CHAracterization for SiP Signal and Power Integrity Analysis” Rec. Fund: 1.85 M€ Coordinator: STMicroelectronics S.r.l, Italy NANOPACK IP: “Nano Packaging Technology for Interconnects and Heat Dissipation” Rec. Fund: 7.4 M€ Coordinator: Thales SA
  • 15. Flexible, Organic and Large Area Electronics, an emerging field
    • FP7 ICT Call 1 on Organic and Large Area Electronics
    • Total budget: 63 M€
    • 20 new projects funded in Organic and Large Area Electronics
    • 13 new projects in the field with a EU funding of ≈43M€
    • Emergence of large area/inorganics: large area sensor and memory.
    • Flexible, organic and large area electronics have a high potential market growth
    • New large area electronic device processing capabilities are acting as a powerful driver
    • In FP6 and FP7, the EC has funded 31 projects in this field with a contribution exceeding 140 M€
    • The focus is on large area electronics and materials for low cost manufacturing and subcomponents like energy scavenging and storage, memories, sensors and OLEDs and flexible displays
  • 16. (a): Organic & Large Area Electronics POLYNET (NoE) FACESS PRODI (CSA) OLATRONICS 3PLAST PRIMEBITS OLEDs COMBOLED FAST2LIGHT (IP) OPERA (CSA) AEVIOM POLYMAP (CSA) (b): Display Systems & Visualisation Real3D MAXIMUS IMVIS MEMI HELIUM3D AMAZOLED HYPOLED FLAME BIND 20.5M€ 42.5M€ Flexible, Organic and Large Area Electronics in FP7 http://cordis.europa.eu/fp7/ict/organic-elec-visual-display/projects_en.html
  • 17. Micro and nanosystems in FP7 FP7 ICT Call 2 “ Micro and nanosystems” Total budget: 83 M€
    • Next generation smart systems Sensor- & actuator-based systems High density mass storage
    • Micro/Nano-Bio-ICT convergence
    • Biosensors, lab-on-a-chip, bioMEMS, autonomous implants
    • Integration of smart materials
    • Integration of MST and smart systems into new & traditional materials, e.g. textiles, glass, paper
    • From smart systems to viable products
    • Microsystems manufacturing technologies
    • Smart systems for communications & data management
    • Smart micro/nanosystems enabling wireless access & facilitating intelligent networking
    • Support actions
    • Technology access, education & training, coordination and dissemination at EU level
  • 18. Areas covered after Call 2 on Micro/nanosystems* Manufacturing (1IP, 3 STPs, 16.85 m€) * Under negotiation MST for Energy/power (4 STPs, 12.3 m€) Support actions (3 CSA, 2.25 M€) Materials, Sensors, Actuators, etc MEMS-NEMS and Integration (6 STPs, 18m€) Micro-Nano-Bio Convergence (7 STPs, 2IPs, 33.6 m€)
  • 19. Micro-Nano-Bio Convergence
    • Micro/nano/bio technologies, biosensors, LoC:
      • LabonFoil: Ultra low cost laboratories on chip
      • PYTHIA: Monolithically Integrated Interferometric Biochips for label-free Early Detection of Human Diseases
      • MicroFLUID: Micro-Fabrication of polymeric Lab-on-a-chip by Ultrafast lasers with Integrated optical Detection
      • ULTRA: Ultra-fast electronics for Terahertz Rapid Analysis in compact lab-on-chip applications
    • Micro-robotics and integrated micro-systems for endoluminal surgery (ARAKNES)
    • Micro-Nano Sensors & transducer based systems
      • ULTRAsponder: In vivo Ultrasonic Transponder System for Biomedical Applications
      • MiniSurg: Miniaturized Stereoscopic Distal Imaging Sensor for Minimally Invasive Surgery
      • NANOMA: Nano-Actuators and Nano-Sensors for Medical Applications
    • Multichannel Electrode systems
      • TIME: Transverse, Intrafascicular Multichannel Electrode system for induction of sensation and treatment of phantom limb pain in amputees
  • 20. Micro/Nanosystems for Energy/power
    • DATA STORAGE
      • SUPARSS: Super-Resolution for Advanced Storage Systems
      • TERAMAGSTOR: Terabit Magnetic Storage technologies
    • ENERGY STORAGE
      • E-STARS: Efficient Smart sysTems with enhAnced eneRgy Storage
      • GREENBAT: GREEN and SAFE thin film Batteries for flexible cost efficient energy storage
  • 21. MEMS-NEMS and Integration
    • MEMSPACK: Zero- and First-level packaging of RF-MEMS
    • NEMSIC: Hybrid Nano-Electro-Mechanical/Integrated Circuit Systems for Sensing and Power Management Applications
    • ARASCOM: MEMS and Liquid Crystal based, Agile Reflect-array antennas for Security and Communication
    • TUMESA: MEMS tuneable Metamaterials for Smart Wireless Applications
    • MAC-TFC: MEMS Atomic Clocks for Timing, Frequency control and Communications
    • MEMFIS: Ultra-small MEMS FTIR Spectrometer
  • 22. Manufacturing
    • MEMS4MMIC: Enabling MEMS-MMIC technology for cost-effective multifunctional RF-system integration
    • SMARTHIES: Smart inspection system for high speed and multifunctional testing of MEMS and MOEMS
    • TIPS: Thin Interconnected Package Stacks
    • HERMES: Large area manufacturing and high density integration of electronic circuits
  • 23. Support Actions
    • EuroTraining-MST: SA on Microsystems and smart systems integration training
    • SYSTEX: CA to enhance the breakthrough of intelligent textile systems
    • CEPoSS: Coordination action on smart systems integrated technologies
  • 24. Call 2 – Strategic Objective Wireless Sensor Networks
    • Target for sub-area “wireless sensor networks”:
      • TWO orders of magnitude more sensors
      • HALF the maintenance time and cost
      • ONE order of magnitude less effort
    • New services and applications tailored to specific needs
    FP7 ICT Call 2 “ Networked Embedded and Control Systems” Total budget: 47 M€
  • 25. EU-funded Research in FP7 Wireless Sensor Networks
    • Networked Embedded and Control Systems
      • CHOsen – Automotive and Aerospace
      • CONET – WSNs and Cooperating Objects
      • GINSENG – Energy Distribution
      • IPAC – Plant control; Traffic Management; Crisis management
      • LocON – Localisation; large-scale infrastructures
      • PECES – Automotive; Localisation
      • POBICOS – Home Automation and Energy-Efficient Buildings
      • SM4ALL – Smart Homes and Home Care
  • 26. Photonic Sensors Projects Supported by DG-INFSO Photonics Unit DOTSENSE Group III-nitride quantum dots as optical transducers for chemical sensors MARISE Materials for avalanche receivers for ultimate sensitivity MINIGAS Miniaturised photo-acoustic gas sensor based on mid-infrared lasers PHOSFOS Photonic skins for optical sensing SENSHY Photonic sensing of hydrocarbons based on mid-infrared lasers
  • 27. The way ahead: the preparation of WP2009-2010 Orientation paper Draft WP Dec 07 June 08 Dec 08 June 09 Final WP Consultations Drafting Decision Call 4 Call 5 ETPs ICTC EC
  • 28. Microsystems and Smart Systems Work programme 2009-10
    • Strengthen project portfolio in the area
    • FP6 and FP7 call 2
    • Emphasis on intelligence integration
      • Multisensing, context awareness
    • Smart systems based on innovative nanosensing principles
      • Nanowires, CNT-based MEMS
    • Specific chapter on autonomous energy efficient smart systems
      • Energy scavenging, power generation, efficient communication
  • 29. WP ’09-10 – Flexible, organic and large area electronics
    • Objective should continue the orientation defined in the previous work programme, if no additional budget is becoming available.
    • Research should focus on material-device co-developments and system integration, based on functional building blocks, measurement & inspection, quality control and automation.
    • Building blocks are important: TFTs, sensors, memories, energy sources and power management, OLEDs for displays & lighting, organic photovoltaics etc.
    • Emphasis on inorganic / organic material thin layer structuring
    • Fundamental research should be in parallel with applied research leading to device demonstrators for short term applications, including field tests.
    • Support measures should facilitate standardisation, training and education
    • International collaboration might be beneficial but also difficult.
    • All instruments IPs, Streps, NoEs, CA & SSAs are appropriate, but STREPs and IPs should not compete for the same budget.
    • Next call should be published as soon as possible.
    Vision from 20.2.2008 consulation meeting:
  • 30. Future calls: Nanoelectronics
    • FP7 WP09/10
    • Miniaturisation and functionalisation
    • Manufacturing technologies
    • Design of semiconductor components and electronic based miniaturised systems (in a separate call)
    • ENIAC Call 1 (to be published on 8 May 08 at http://www.eniac.eu )
    • Nanoelectronics for Transport and Mobility
    • Nanoelectronics for security and safety
    • Nanoelectronics for energy and environment
    • Design methods and tools for nanoelectronics
    • Equipment and materials for nanoelectronics
  • 31. WP ’09-10 - Engineering of Large-Scale, Complex Networked Systems
    • Wireless Sensor Networks
    • Facilitate the deployment, activation, operation and low-cost maintenance of distributed systems composed of heterogeneous networked smart objects, e.g. in manufacturing, process plants, buildings and large scale infrastructures, aiming at flexibility, reliability, dependability, safety, security and energy efficiency, as well as lower cost
    • Focus on:
      • semantics that allow object/service definition and instantiation
      • abstractions and support tools to facilitate (re)programming
      • lightweight operating systems and kernels
      • open wireless communication protocols for harsh (industrial) environments
      • virtual sensing/actuation through aggregation of sensors/actuators
      • novel large-scale applications of wireless sensor networks
  • 32. Photonics Work programme 2009-10
    • Key applications and social needs
        • Lighting and light sources
        • Biophotonics
        • Communications
        • Cost effective high-performance imaging for Safety & Security
        • Highly integrated components for high average and high peak power lasers ( ICT & industrial applications )
    • Organic Photonics
    • Disruptive technologies
    Particularly relevant for Heterogeneous Integration
  • 33.
    • European research on the web:
      • http://cordis.europa.eu
      • http://cordis.europa.eu/fp7
      • http://ec.europa.eu/comm/research/future/
    • Information Society and Media:
      • http://cordis.europa.eu/fp7/ict/programme/challenge3_en.html
    • Contact:
      • [email_address]
      • [email_address]
    Thank you! …