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RFID in the world of Printed Electronics
 

RFID in the world of Printed Electronics

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RFID in the world of Printed Electronics Application/Cost/Supply Chain

RFID in the world of Printed Electronics Application/Cost/Supply Chain

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    RFID in the world of Printed Electronics RFID in the world of Printed Electronics Presentation Transcript

    • RFID in the world of Printed ElectronicsApplication/Cost/Supply ChainDr. Andreas SchallerASCAndreas Schaller Technology Consultinginfo@andreas-schaller.deDr. Andreas SchallerRFID in the world of Printed Electronics1
    • SMT HierarchyRFID in the world of Printed Electronics2Connections between physically separatesystems such as host computer toterminals, computer to printers, and so on.Level 5 Connections between systemsLevel 4 SubassemblyLevel 3 Connections between PWBsLevel 2 Printed Wiring Board (PWB)Level 1 Integrated CircuitsLevel 0 Monolithic Silicon Chip Gate-to-gate interconnections on amonolithic silicon chipConnections between two subassemblies.For example, a rack or frame may holdseveral shelves of subassemblies thatmust be connected together to make up acomplete system.Connections between PWBs, includingPWB-to-PWB interconnections or card-to-motherboard interconnections.Printed wiring board (PWB) level ofinterconnections. Printed conductor pathsconnect the device leads of componentsto PWBs and to the electrical edgeconnectors for off-the-boardinterconnection.Packaging of silicon chips into dual-in-linepackages (DIPs), small outline integratedcircuit (SOICs), chip carriers, multichippackages, and so on, and the chip-levelinterconnects that join the chip to the leadframes.
    • PET HierarchyRFID in the world of Printed Electronics3Level 5 Connections between systems Ambient IntelligenceLevel 4 Subassembly System IntegrationLevel 3 Connections between PWBs Smart SystemLevel 2 Printed Wiring Board (PWB) System-in-FoilLevel 1 Integrated Circuits Functional LayersLevel 0 Monolithic Silicon Chip Printable InkSilver InkPrintedAntennaRFID LabelBattery AssistedLabelSmart PackageRFID SystemSMT PET Example
    • PET Applications and KPIRFID in the world of Printed Electronics4PET ProductsLarge Area PrintingSmall Feature Printingmin
    • PET Market Players examples onlyRFID in the world of Printed Electronics5
    • PET Benefits beyond costRFID in the world of Printed Electronics6Smart Objects are driven by LEVEL 5(Content driven) Connectivity enables an object to become ”smart”Flexible Electronics is driven by LEVEL 4Customer Benefits is flexible-to-install vs. flexible-to-useIntegrated Smart Systems are driven by LEVEL 3Application driven system integrationLarge Area Electronics is driven by LEVEL 2Macro electronics for functional area maximization (vs. microminiaturization)Printed Electronics is driven by LEVEL 1Low cost and environmental preferred manufacturingOrganic(Inorganic) Electronics is driven by LEVEL 0Multi-functional materials for electronic and sensing functions
    • Printed RFID MarketsRFID in the world of Printed Electronics7Ticketing (Disposable)(Integrated Smart System)Pharma (New Services )(Smart Objects)ehealth ( Hygiene )(Integrated Smart System)eMarketing ( HMI )(Large Area Electronics )Games (New Services)(Smart Objects)All use cases are disposable !
    • System Integration (SMT)RFID in the world of Printed Electronics8<40<20<10Gross Margin in %
    • System Integration (RFID)RFID in the world of Printed Electronics9PackagingBattery> 0,10 €< 5 €
    • System Integration (pRFID V1)RFID in the world of Printed Electronics10R2R Q↑BatteryPackaging Packaging> 10 €€ TBD
    • System Integration (pRFID V2)RFID in the world of Printed Electronics11S2S Q↑BatteryPackaging Packaging~ 0,10 €
    • System Integration (pRFID V3)RFID in the world of Printed Electronics12R2RBatteryPackaging Packaging€ TBD> 10 €Packaging
    • System Integration (PET)RFID in the world of Printed Electronics13
    • Additional Printed RFID ComponentsRFID in the world of Printed Electronics14Contact Readout Conductive Readout RF ReadoutPassiveActive(Sensing)ROM /WORMRAM ROM /WORMROM /WORMWORM / RAMPrimary Batteries Primary / Secondary BatteriesSensing !
    • Smart Packaging ExamplesRFID in the world of Printed Electronics15Smart PackagingNon-Inductive Tag Printed EAS Tag Printed RFID Tag UHF RFID Tag Hybrid TagComparison………… …… …………
    • Smart Packaging CostsRFID in the world of Printed Electronics16Ink(Organic and/or Inorganic)Foils and/or Paper Inkjet / Gravure / ScreenPrintingAssembly(Lamination)LaminationLabeling(none if integrated)Battery and/or ICAntenna and/or SensorConnectingwire / wirelessTagged Object( included in BOM)
    • Costs ComparisonRFID in the world of Printed Electronics17RFIDRFID
    • Optimized CostsRFID in the world of Printed Electronics18RFIDRFIDPrintingFoilsInksAdded Value ?
    • Active SystemsRFID in the world of Printed Electronics19ActiveSystem
    • Smart Packaging Cost DriversRFID in the world of Printed Electronics20Component SystemPassive Harvesting ActiveActivePassiveDriven by Higher PET LevelsDrivenbyLowerPETLevelsLevel 0 / Level 1 / Level 2 / Level 3 Level 0 / Level 1 / Level 2 / Level 3 Level 0 / Level 1 / Level 2 / Level 3Cost%Cost%TBD TBD
    • Printed Sensor TagRFID in the world of Printed Electronics21System-in-FoilWriteFunction : SensingEnergy HarvestingEventDataFunction : StoringInformationFunction : ComputingFunction : ConnectingEnergy HarvestingKnowledgeRead/Write
    • Cost BreakdownRFID in the world of Printed Electronics22Passive SystemRunning CostsFoilsRow Material InkScreen GravureAlignment Lamination% Cost = Bill Of Material (BOM) + Conversion Costs (CC)Bill Of Material (BOM)= cost of purchased row materials, sub-assemblies, components, partsConversion Costs (CC)= cost of changing row materials into finished or semi-finished products
    • Optimization Potential (Theoretical)RFID in the world of Printed Electronics23Level Action Potential for Reduction• Level 5 : Update only Infrastructure Firmware• Level 4 : Integrate Automated Inline Customization - 50%• Level 3 : Focus on Passive Solutions• Level 2 : Reduce Numbers of Layers (Avoid Alignment) - 85%• Level 1 : Switch from Batch to Inline Printing Processes - 50%• Level 0 : Change from Contactless (13.56 MHz) to aSweep/Contact Readout - 40%Passive SystemRunning CostsFoilsRow Material InkScreen GravureAlignment Lamination- 60%% Cost = Bill Of Material (BOM) + Conversion Costs (CC)
    • Net Present Value BreakdownRFID in the world of Printed Electronics24% Net Present Value (NPV)Net Present Value (NPV) = Method for using the time value of money to appraise long-term projectsInterest Rate =15%Profit Margin [Level]
    • Questions ?RFID in the world of Printed Electronics25Andreas Schaller Technology Consulting Unternehmergesellschaft (haftungsbeschränkt)Dr. Andreas SchallerEmail : Andreas.Schaller@t-online.deAndreas Schaller Technology Consulting Unternehmergesellschaft (haftungsbeschränkt)Office : Schulstr. 11, 95676 WiesauManagement : Dr. Andreas SchallerDistrict Court : AG Weiden, HRB 3499