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How Eliminating Flying Lead IGBT Driver Interconnect Improves Performance and Reliability
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How Eliminating Flying Lead IGBT Driver Interconnect Improves Performance and Reliability

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  • http://www.i-micronews.com/news/Mitsubishi-Electric-targets-European-markets,6526.html
  • Transcript

    • 1. How Eliminating Flying Lead IGBT Driver Interconnect Improves Performance and Reliability CONFIDENTIAL (c) 2012 AgileSwitch, LLC 1
    • 2. Renewable Energy Trends• Solar/PV installations to reach 24 GW, up from 19 GW in 2010. (IMS Research)• Wind power installations will increase from 236 GW in 2011 to 563 GW in 2017. (Pike Research, 2011)• 5 million cars manufactured in 2016 will be full HEV, plug-in HEV or EV. (Yole Développement, 2011) CONFIDENTIAL (c) 2012 AgileSwitch, LLC 2
    • 3. Renewable Energy Applications Have Increased Performance Requirements For IGBTs• Decreased $/Watt• Higher current and voltage requirements• Faster switching speeds• Increased heat sensitivity• Higher efficiencies• Reducing switching losses CONFIDENTIAL (c) 2012 AgileSwitch, LLC 3
    • 4. “Tuning” Drivers To IGBTs Help Address These Requirements• IGBT Driver requirements will vary across IGBT manufacturers and within their product line.• Optimizing driver design includes adjusting: – Gate resistor values – Desat requirements – Cross over timing – Soft turn off and/or Active HV Clamping CONFIDENTIAL (c) 2012 AgileSwitch, LLC 4
    • 5. Increasing Fault Detection Further Enables Safe And Secure Operation• Increased requirements to continuously monitor the performance and functionality of the driver and overall system• IGBT driver designs should account for monitoring the following fault scenarios and conditions: – Separate Hi/Lo fault signals – Desat timing and levels – UVLO – IGBT temperature – Ambient temperature CONFIDENTIAL (c) 2012 AgileSwitch, LLC 5
    • 6. Plug And Play Improves Manufacturability• A much more efficient mechanical footprint• Integrating the IGBT module and driver into a single subassembly – Dramatic increase in producibility and serviceability• Combined offering allows a more compact and robust design CONFIDENTIAL (c) 2012 AgileSwitch, LLC 6
    • 7. Direct Connection To The IGBT Lowers Inductance And Improves Overall PerformanceMeasurable benefits include: – Higher frequency operation – Faster driver transitions – Reduced Heat – Improved lifetime reliability CONFIDENTIAL (c) 2012 AgileSwitch, LLC 7
    • 8. Plug and Play vs. Flying Lead: DirectGate Drive with 1.8 Ohm Resistor - Direct Connection; 1700V/1000A Fuji PrimePack Note: 1.0 usec turn on after rising edge CONFIDENTIAL (c) 2012 AgileSwitch, LLC 8
    • 9. Plug and Play vs. Flying Lead: Flying Lead Gate Drive with 1.8 Ohm Resistor - 6 inch lead; 1700V/1000A Fuji PrimePACKNote: 1.1 usec turn on after rising edge CONFIDENTIAL (c) 2012 AgileSwitch, LLC 9
    • 10. Plug and Play vs. Flying Lead: DirectGate Drive with 1.8 Ohm Resistor - Direct Connection; 1700V/1000A Fuji PrimePack Note: IGBT turns off 4.15 us after the falling edge. CONFIDENTIAL (c) 2012 AgileSwitch, LLC 10
    • 11. Plug and Play vs. Flying Lead: Flying Lead Gate Drive with 1.8 Ohm Resistor - 6 inch lead; 1700V/1000A Fuji PrimePACKNote: IGBT turns off 4.3 us after the falling edge. CONFIDENTIAL (c) 2012 AgileSwitch, LLC 11
    • 12. Lead Length Correlation to Gate ResistorsThe previous slides indicate that flying leads have areal effect on the switching speed of the IGBT.This slowing is the equivalent of increasing the GateResistor from 1.8 Ohms to 3.0 Ohms in a directconnect system using the same gate driver. How does this affect performance? CONFIDENTIAL (c) 2012 AgileSwitch, LLC 12
    • 13. Power Dissipation of the IGBT: Direct ConnectionNote: Tj ave is 107.7 C . Inverter loss is 184W and 304W ON/OFF. CONFIDENTIAL (c) 2012 AgileSwitch, LLC 13
    • 14. Power Dissipation of the IGBT: Flying LeadNote Tj ave is 113.4 C. (+6C) Inverter loss is 277W (+93W) and 322W (+18W) ON/OFF(111W total). CONFIDENTIAL (c) 2012 AgileSwitch, LLC 14
    • 15. Direct Connect = Increased EfficiencyThis indicates that there is additional wattage lost inthe slower turn on/off times and reflected in higherjunction temperature.This translates to better performance withimproved Long Term Life and Reliability. CONFIDENTIAL (c) 2012 AgileSwitch, LLC 15
    • 16. Future: Increasing Fault Detection Further Enables Safe And Secure Operation• Increased monitoring of the performance and functionality of the driver and IGBT can lead to better reliability.• Next generation IGBT driver designs should account for monitoring the following fault scenarios and conditions: – Separate Hi/Lo fault signals – Desat timing and levels – UVLO – High Voltage monitoring – IGBT temperature – Ambient temperature CONFIDENTIAL (c) 2012 AgileSwitch, LLC 16
    • 17. Designing for Plug And Play is Challenging, But Worth It• The electrical performance and isolation requirements for a gate driver are the same for a plug and play design and a flying lead design.• However, Plug and play design is more demanding since the ambient temperature of the Driver may be higher due to the close proximity to the IGBT.• And, additional mechanical requirements and a smaller PCB footprint can make it longer to design and more costly to manufacture. CONFIDENTIAL (c) 2012 AgileSwitch, LLC 17
    • 18. How to Reach Us Rob Weber Albert Charpentier 1650 Arch Street Suite 1905 Philadelphia, PA 19103info@AgileSwitch.com 484-483-3256 CONFIDENTIAL (c) 2012 AgileSwitch, LLC 18

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