AMD Opteron 6000 Series Platform Press Presentation

The AMD Opteron™ 6000 Series Platform:More Cores, More Memory, Better Value

AMD is Changing Server Market Dynamics Again
AMD Opteron™ Processor, World’s First x86 Processor with 64- and 32-bit capability, integrated memory controller, HyperTransport™ technology high-speed serial system bus and glueless 1- to 8-P scalability
World’s First Native Quad-Core x86 Processor with HW-based virtualization features
AMD Opteron™ Processor HE/EE, First Low-Power x86Processors
World’s First 6-core x86 Processor for 1P to 8P
World’s First Dual-Core x86 Processor
The Second Wave
World’s First 12-core x86 Processor and Direct Connect Architecture 2.0
AMD Socket F (1207) Platform: four generations of upgradeability
Anticipating needs and delivering innovation at the right time for the market
2003
2005
2007
2004
2006
2008
2009
2010

The Second Wave
The AMD Opteron™ 6100 Series processor with Direct Connect Architecture 2.0 redefines server value:
More cores and more memory for less money
Removes the “4P tax”
More performance for workloads that matter most*
*See slides 13-15 and backup on slides 23-28

Server Market Demands Are Changing
The Growth of Industry-standard Computing
Reigning in Costs, Return on Computing Investments
Scalable/Accelerated Computing
Raw Performance
TCO/Lifecycle Costs
Power Efficiency
Virtualization
Value
Cloud/Fabric
Heterogeneous
2000-2006
2010-2012
2007-2009
1990’s
2012+

Value Definition Has Changed Over Time
Over time, the criteria has changed from:
Price /performance /watt
$
Performance / watt
Raw Performance
1995
2005
2000
2010

AMD Server Platform Strategy
2011
2010
4P/8P Platforms
~5% of Market*
Performance-per-watt and
Expandability
“Magny-Cours”
8 and 12 cores
“Interlagos”
12 and 16 cores
AMD Opteron™6000 Series Platform
(codenamed ”Maranello”)
2/4 socket; 4 memory channels
Highly scalable without compromising value
2P Platforms
~75% of Market*
AMD SR5600 Series
Chipset/G34 & C32
Sockets
“Bulldozer”
Core
“Bulldozer”
Core
Platform Consistencyand Commonality
Highly Energy Efficient and Cost Optimized
AMD Opteron™4000 Series Platform
(codenamed “San Marino”and “Adelaide”)
“Valencia”
6 and 8 cores
“Lisbon”
4 and 6 cores
1P Platforms
~20% of Market*
1/2 socket; 2 memory channels
New levels of value and power efficiency
*AMD internal estimates of total server market as of Q309

2 Full-Featured Platforms for Mainstream Market
,
“AMD Opteron™ 6000 Series platform
Mainstream Market/2P Platforms
Competition offers only a “one-size-fits-all” solution for mainstream market segment
De-features many popular, low power, value processors
AMD Opteron™ 4000 Series platform
Every AMD Opteron™ processor offers full, consistent feature set

Designed To Easily Integrate
Consistent Images and Software
Same Features Across Power Bands
Same Die, Chipset and Memory enable:
No artificially limited features
Same API
Same BIOS Code
Same Drivers
Easier To Buy
No tradeoffs of performance & core functionality
Easier To Qualify
Full consistency across the entire processor stack
Easier To Manage
Seamlessly move virtual machines, easily migrate software between systems

Direct Connect Architecture 1.0Balanced and Scalable Design to Support up to 6 Cores
2 MEMORY
CHANNELS
2 MEMORY
CHANNELS
8 DIMMs per CPU
8 DIMMs per CPU
2 MEMORY
CHANNELS
2 MEMORY
CHANNELS
8 DIMMs per CPU
8 DIMMs per CPU
No front side bus
HyperTransport™ technology
Integrated memory controller
NUMA memory architecture

Direct Connect Architecture 2.0Balanced and Scalable Design to Support up to 16 Cores* per CPU
4 MEMORY
CHANNELS
4 MEMORY
CHANNELS
12 DIMMs per CPU
12 DIMMs per CPU
4 MEMORY
CHANNELS
4 MEMORY
CHANNELS
12 DIMMs per CPU
12 DIMMs per CPU
1-hop between processors
Four memory channels
Up to 50% more DIMMs
Up to 33% increase in CPU to CPU communication speed±
*Based on HyperTransport™ technology links @ up to 4.8 GT/s for Six-Core AMD Opteron™ processor vs. 6.4 GT/s for AMD Opteron™ 6100 Series processor.
±16-core configuration planned for upcoming AMD processor core codenamed “Bulldozer”.

6 channels, 18 DIMMs (not 4P scalable)
Clear Memory Advantage for Workloads
8 channels, 24 DIMMs (4P scalable)
Memory Capacity
Key for Virtualization, Database & HPC
Up to 33% more DIMMs - Up to 24 DIMMs per 2P server supports more robust VMs
96GB with affordable DIMMs up to 34% less expensive than competitive configuration¹
Scalable to 4P and 48 DIMMs – to handle peak loads with a low response time
Memory Bandwidth
Key for HPC
Record setting 2P memory bandwidth
33% more memory channels²
Intel®
Xeon™
Processor
Intel®
Xeon™
Processor
¹ Based on 48GB memory configuration for AMD Opteron™ 6000 Series platform at $2,207.88 (12 x 4GB) vs. 48GB Intel configuration at $3,353.91 (3 x 8GB + 6 x 4GB). Prices according to http://www.crucial.com/store/listmodule/DDR3/~HS~/list.html as of 3/1/10.
²Based on comparison of 4 memory channels for AMD Opteron™ 6100 Series processor vs. 3 memory channels for Intel Xeon processor codenamed “Westmere.” See http://www.anandtech.com/cpuchipsets/showdoc.aspx?i=3733

Pricing Strategy Delivers Superior Advantage over Competition
Servers
Competitive
AMD 2010 Strategy
AMD Socket F (1207)
AMD 8000/2000Series
Intel Xeon
AMD 6000/4000 Series
$3600+
$856
4P+
Enterprise
$2,649
$873
4P+
4P
$1663
$188
2P & 4P+
Scalable
$1386
$266
$1165
$174
6000
Series
2P + 4P
2P& 4P
Basic
2P
$589
$167
2P
$455
$99
1P
1P & 2P
Entry
4000
Series
1P + 2P
$269
$112
1P
1P & 2P
Value/Ultra Value
Source: Current pricing is published on AMD.com and Intel.com for 1KU as of March 16, 2010; new AMD platform pricing is expected 1KU price at launch

Up to Double the Performance for 2P
Up to 2.2x
SPEC, SPECint, and SPECfp are registered trademarks of the Standard Performance Evaluation Corporation. The results for AMD Opteron™ processor Model 6174 are based upon data submitted to Standard Performance Evaluation Corporation as of March 17, 2010. The other results stated above reflect results published on http://www.spec.org/cput2006/results as of March 17, 2010. The comparison presented above is based on the best performing two-socket servers using the specified processor model. For the latest SPECint_rate2006 and SPECfp_rate2006 results, visit http://www.spec.org/cput2006/results. For additional backup and configuration information, see backup slides 23-24.

Better Price & Performance, Low Power for 2P
SPEC, SPECint, and SPECfp are registered trademarks of the Standard Performance Evaluation Corporation. The results for AMD OpteronTM processor Model 6174 are based upon data submitted to Standard Performance Evaluation Corporation as of March 17, 2010. The results for AMD Opteron™ processor Model 6136 are estimates. The other results stated above reflect results published on http://www.spec.org/cpu2006/results/ as of March 17, 2010. The comparisons presented above are based on the best performing two-socket servers using AMD Opteron™ processor Models 2435, 6136, and 6174 and Intel Xeon processor Models X5570 and X5680. For the latest SPECint®_rate2006 and SPECfp®_rate results, visit http://www.spec.org/cpu2006/results/. Pricing reflects planned AMD 1KU tray pricing and Intel 1KU tray pricing on www.intel.com as of March 17, 2010. For additional backup and configuration information, see backup slides 25-28.

Transforming 4P Server Economics
Floating Point Throughput Performance
Integer Throughput Performance
80W
ACP
80W
ACP
130W
TDP
130W
TDP
Est.
Est.
SPEC, SPECint, and SPECfp are registered trademarks of the Standard Performance Evaluation Corporation. The results for AMD Opteron™ processors are based upon estimates as of March 17, 2010. The other results stated above reflect results published on http://www.spec.org/cput2006/results as of March 17, 2010. The comparison presented above is based on the best performing four-socket servers using AMD Opteron™ processor Model 6174 and the best performing two-socket servers using Intel Xeon processor Models X5680. For the latest SPECint_rate2006 and SPECfp_rate2006 results, visit http://www.spec.org/cput2006/results. Pricing reflects planned AMD 1kU tray pricing and Intel 1kU tray pricing on www.intel.com as of March 17, 2010. For additional backup and configuration information, see backup slide 29.

Increased Performance-per-watt withAMD Opteron™ 6000 Series Platform
PERFORMANCE
POWER
Similar power envelope with 2x the cores
Can provide a significant performance uplift
Internal measurements based on pre-production silicon. Source: AMD internal performance and power measurements using a java-based workload. Information is provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual power consumption. For detailed configurations and assumptions refer to backup slide 30.

Designed to Drive Down Power Requirements
AMD
Cool Speed technology
Low Voltage DDR-3 DIMM support
Advanced Platform Management Link (APML)*
C1E Power State
A sleep state invoked when all processor cores are idle
Reduces p-states when a temperature limit is reached
Lower memory voltage of 1.35V vs. standard memory at 1.5V
PTM - Closely monitors power/cooling RPMI - Remote monitor and control of P-state limits
*In APML-enabled platforms

OEM Customer Adoption and Partner Support
More than
25
platforms from leading OEMs

More cores and more memory for less money
Removes the “4P tax”
More performance for workloads that matter most
Up to 119% better performance with roughly same power
and same price*
Better price/performance for 2 & 4P**
Price /performance /watt
$
The AMD Opteron™ 6100 Series Processor with Direct Connect Architecture 2.0 Redefines the Server Market
Performance / watt
Raw Performance
*See slide 13 and backup on slides 23-24 **See slides 14-15 and backup on slides 25-29

Back-up

Power and Performance Bands – 6100 Series
All pricing based on planned 1KU prices at launch. *ACP stands for Average CPU Power. See www.amd.com/acp. †Using HyperTransport™ technology.

Direct Connect Architecture 2.0
Cache Size
Total Cache: 19.6MB (12 core), 17.1MB (8 core)
L1 Cache: 64KB (Data) + 64KB (Instruction) (per core)
L2 Cache: 512KB (per core)
L3 Cache: 12MB (per socket)
HyperTransportTM 3.0 technology (HT3) Links
Four x16 links @ up to 6.4GT/s per link
Memory
Integrated DDR3 memory controller – With DDR3-1333 support up to 42.7 GB/s memory bandwidth per CPU for Socket G34
Quad Channel support for DDR3 up to 1333 and LV-DDR3 up to 1333
AMD Opteron™ 6100 Series ProcessorProduct Specifications
Process Technology
45-nanometer SOI (silicon-on-insulator) technology
Die Size
346mm2 per die; 1808M transistors
Packaging
Socket G34 - 1944-pin organic Land Grid Array (LGA)

Performance Over Generations (1 of 2)
SPECint®_rate2006
61.0 using 2 x Dual-Core AMD Opteron™ processors Model 2222 in HP ProLiant DL185 G5 server, 32GB (8x4GB DDR2-667) memory, SuSE Linux® Enterprise Server 10 SP1 64-bit
http://www.spec.org/cpu2006/results/res2008q1/cpu2006-20071220-02913.html
105 using 2 x Quad-Core AMD Opteron™ processors ("Barcelona") Model 2356 in IBM BladeCenter LS22 server, 32GB (8x4GB DDR2-800) memory, SuSE Linux® Enterprise Server 10 SP1 64-bit
155 using 2 x Quad-Core AMD Opteron™ processors Model 2389 in Sun Fire X4140 server, 32GB (8 x 4GB DDR2-667) memory, Red Hat Enterprise Linux® Server release 5.3 64-bit
205 using 2 x Six-Core AMD Opteron™ processors Model 2435 in Supermicro A+ Server 1021M-UR+B server, 32GB (8x4GB DDR2-800) memory, Red Hat Enterprise Linux® Server release 5.3 64-bit
386 using 2 x AMD Opteron™ processors Model 6174 in HP ProLiant DL165 G7 server, 64GB (16 x 4GB DDR3-1333) memory, Red Hat Enterprise Linux® 5 Update 4

Performance Over Generations (2 of 2)
SPECfp®_rate2006
56.0 using 2 x Dual-Core AMD Opteron™ processors Model 2222 in HP ProLiant DL185 G5 server, 32GB (8x4GB DDR2-667) memory, SuSE Linux® Enterprise Server 10 SP1 64-bit
94.7 using 2 x Quad-Core AMD Opteron™ processors ("Barcelona") Model 2356 in IBM BladeCenter LS22 server, 32GB (8x4GB DDR2-800) memory, SuSE Linux® Enterprise Server 10 SP1 64-bit
121 using 2 x Quad-Core AMD Opteron™ processors ("Shanghai") Model 2389 in Supermicro A+ Server 1021M-UR+B server, 32GB (8x4GB DDR2-800) memory, SuSE Linux® Enterprise Server 10 SP1 64-bit
143 using 2 x Six-Core AMD Opteron™ processors Model 2435 in Supermicro A+ Server 1021M-UR+B server, 32GB (8x4GB DDR2-800) memory, Red Hat Enterprise Linux® Server release 5.3 64-bit
313 using 2 x AMD Opteron™ processors Model 6174 in HP ProLiant DL165 G7 server, 64GB (16 x 4GB DDR3-1333) memory, Red Hat Enterprise Linux® 5 Update 4

Integer Throughput (SPECint®_rate 1 of 2)
2 x Dual-Core AMD Opteron™ processors Model 2222 in HP ProLiant DL185 G5 server, 32GB (8x4GB DDR2-667) memory, SuSE Linux® Enterprise Server 10 SP1 64-bit

2 x Quad-Core AMD Opteron™ processors ("Barcelona") Model 2356 in IBM BladeCenter LS22 server, 32GB (8x4GB DDR2-800) memory, SuSE Linux® Enterprise Server 10 SP1 64-bit

2 x Quad-Core AMD Opteron™ processors ("Shanghai") Model 2389 in Sun Fire X4140 server, 32GB (8x4GB DDR2-667) memory, Red Hat Enterprise Linux® Server release 5.3 64-bit

2 x Six-Core AMD Opteron™ processors Model 2435 in Supermicro A+ Server 1021M-UR+B server, 32GB (8x4GB DDR2-800) memory, Red Hat Enterprise Linux® Server release 5.3 64-bit

Integer Throughput (SPECint®_rate 2 of 2)
2 x AMD Opteron™ processors Model 6136 in “Dinar” reference design kit, 64GB (16 x 4GB DDR3-1333) memory, Red Hat Enterprise Linux® Server release 5 Update 4 64-bit

2 x AMD Opteron™ processors Model 6174 in HP ProLiant DL165 G7 server, 64GB (16 x 4GB DDR3-1333) memory, Red Hat Enterprise Linux® Server release 5 Update 4 64-bit

2 x Intel Xeon processors Model X5570 (95W TDP) in Acer Gateway GR380 F1 server, 24GB (6 x 4GB DDR3-1333) memory, SUSE Linux® Enterprise Server 10 SP2 64-bit
2 x Intel Xeon processors Model X5680 (130W TDP) in Fujitsu PRIMERGY RX300 S6 server, 48GB (12 x 4GB DDR3-1333) memory, SUSE Linux® Enterprise Server 11 64-bit

Floating Point Throughput (SPECfp®_rate 1 of 2)
2 x Dual-Core AMD Opteron™ processors Model 2222 in HP ProLiant DL185 G5 server, 32GB (8x4GB DDR2-667) memory, SuSE Linux® Enterprise Server 10 SP1 64-bit

2 x Quad-Core AMD Opteron™ processors ("Barcelona") Model 2356 in IBM BladeCenter LS22 server, 32GB (8x4GB DDR2-800) memory, SuSE Linux® Enterprise Server 10 SP1 64-bit

2 x Quad-Core AMD Opteron™ processors ("Shanghai") Model 2389 in Supermicro A+ Server 1021M-UR+B server, 32GB (8x4GB DDR2-800) memory, SuSE Linux® Enterprise Server 10 SP1 64-bit

2 x Six-Core AMD Opteron™ processors Model 2435 in Supermicro A+ Server 1021M-UR+B server, 32GB (8x4GB DDR2-800) memory, SuSE Linux® Enterprise Server 10 SP1 64-bit

Floating Point Throughput (SPECfp®_rate 2 of 2)
2 x AMD Opteron™ processors Model 6136 in “Dinar” reference design kit, 64GB (16 x 4GB DDR3-1333) memory, Red Hat Enterprise Linux® Server release 5 Update 4 64-bit

2 x AMD Opteron™ processors Model 6174 in HP ProLiant DL165 G7 server, 64GB (16 x 4GB DDR3-1333) memory, Red Hat Enterprise Linux® Server release 5 Update 4 64-bit

2 x Intel Xeon processors Model X5570 (95W TDP) in ASUS Z8PE-D18 server motherboard, 72GB (18 x 4GB DDR3-1333) memory, SUSE Linux® Enterprise Server 10 SP2 64-bit

2 x Intel Xeon processors Model X5680 (130W TDP) in Fujitsu PRIMERGY RX300 S6 server, 48GB (12 x 4GB DDR3-1333) memory, SUSE Linux® Enterprise Server 11 64-bit

Transforming Four-Socket Server Economics
SPECint®_rate2006
381 using 2 x Intel Xeon processors Model X5680 (130W TDP) in Fujitsu PRIMERGY RX300 S6 server, 48GB (12 x 4GB DDR3-1333) memory, SUSE Linux® Enterprise Server 11 64-bit
574 (est.) using 4 x AMD Opteron™ processors Model 6136 in “Drachma” reference design kit, 128GB (32 x 4GB DDR3-1333) memory, SUSE Linux® Enterprise Server 10 SP2 64-bit
SPECfp®_rate2006
257 using 2 x Intel Xeon processors Model X5680 (130W TDP) in Fujitsu PRIMERGY RX300 S6 server, 48GB (12 x 4GB DDR3-1333) memory, SUSE Linux® Enterprise Server 11 64-bit
514 (est.) using 4 x AMD Opteron™ processors Model 6136 in “Drachma” reference design kit, 128GB (32 x 4GB DDR3-1333) memory, SUSE Linux® Enterprise Server 10 SP2 64-bit

Configuration Information (“Magny Cours ” Power Comparison)
Six-Core AMD Opteron™ processor Model 2425 HE based platform
Processor:
2x AMD Opteron™ processor Model 2425 HE
Motherboard: Tyan 2927
Memory: 4x 4GB RDDR2 667 DIMMs
Storage: 500GB SATA WD50000ABPS
Chassis: Enermax Chakra ECA5001-B
Power Supply: ThermaltakeToughpower 1200
12-Core AMD Opteron™ processor Model 6164 HE based platform
Processor:
2x AMD Opteron™ processor Model 6164 HE
Motherboard: “Dinar “ AMD Internal Validation platform
Memory: 4x 4GB RDDR3 1.5v 1333MHz DIMMs
Storage: 500GB SATA WD50000ABPS
Chassis: Enermax Chakra ECA5001-B
Power Supply: ThermaltakeToughpower 1200
Workload:
Server-side java & active idle (2 minutes resting, idle measurement taken after two minutes of system idle)
Performance based on number of business operations
Microsoft® Windows Server® 2008 R2 Enterprise Edition (64-bit) Balanced Profile Enabled
Power Measurement:
Yokogawa Electric International Pte. Ltd. Model WT210
Power data captured every 1 second over duration of workload
Thermal Environment:
Digi International Inc. Model Watchport/H temperature sensor
Power data captured at an ambient temperature of 21.2C

Forward-Looking Statement
This presentation contains forward-looking statements concerning AMD and technology partner product offerings which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," “strategy,” “roadmaps,” "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this presentation are based on current beliefs, assumptions and expectations, speak only as of the date of this presentation and involve risks and uncertainties that could cause actual results to differ materially from current expectations. With respect to AMD, risks include the possibility that Intel Corporation's pricing, marketing and rebating programs, product bundling, standard setting, new product introductions or other activities targeting AMD's business will prevent attainment of AMD's current plans; customers stop buying AMD’s products or materially reduce their operations or demand for its products; AMD will be unable to develop, launch and ramp new products and technologies in the volumes and mix required by the market and at mature yields on a timely basis; standards promulgated by open standards will be adopted at rates slower than currently projected, demand for computers and, in turn, demand for AMD’s products will be lower than currently expected; there will be unexpected variations in market growth and demand for AMD’s products and technologies in light of the product mix that it may have available at any particular time or a decline in demand; and AMD will be unable to maintain the level of investment in research and development that is required to remain competitive. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to the Annual Report on Form 10-K for the fiscal year ended December 26, 2009.
Trademark Attribution AMD, the AMD Arrow logo, AMD Opteron, AMD PowerNow!, and combinations thereof are trademarks of Advanced Micro Devices, Inc. HyperTransport is a licensed trademark of the HyperTransport Technology Consortium. Microsoft, Windows, and Windows Vista are registered trademarks of Microsoft Corporation in the United States and/or other jurisdictions. Other names are for informational purposes only and may be the trademarks of their respective owners.

©2010 Advanced Micro Devices, Inc. All rights reserved.

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AMD Opteron 6000 Series Platform Press Presentation

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AMD Opteron 6000 Series Platform Press Presentation — Presentation Transcript