Six-Core AMD Opteron™ Processor with AMD Chipset Platform<br />
Six-Core AMD Opteron™ Processor with AMD Chipset Platform <br />Unified server platforms with AMD on AMD – benefits of pro...
Key Benefits<br />Choice ofChipsets<br />KeyTechnologies<br />Consistent Feature Set<br /><ul><li>AMD-P
AMD-V™
PCI Express® 2.0
HyperTransport™ 3.0 Technology</li></ul>SR5690<br />SR5650<br />SR5670<br />Benefits<br />Range and flexibilityof chipsets...
TYAN S8208: Energy Efficient Server Platform<br />TYAN S8208 Overview<br />AMD and TYAN Collaboration<br />TYAN S8208 = Si...
Optimized for HE& EE
Energy Efficient AMD Chipset
AMD-P Technology
Platform-level power management support
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Six Core AMD Opteron Processor With AMD Chipset Platform

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Six Core AMD Opteron Processor With AMD Chipset Platform

  1. 1. Six-Core AMD Opteron™ Processor with AMD Chipset Platform<br />
  2. 2. Six-Core AMD Opteron™ Processor with AMD Chipset Platform <br />Unified server platforms with AMD on AMD – benefits of processor + chipset<br />Enhanced platforms with chipset choices and key technologies<br />Ultra power efficient platform designed for cloud and dense deployments (using AMD Opteron™ EE processor and S5650 chipset)<br />First 4P x86 Platform with PCI Express® 2.0 for HPC applications<br />Three chipset solutions to optimize workloads<br />Extends AMD Virtualization™ (AMD-V™) technology and AMD-P suite of features<br />Wide availability from ODMs; OEMs are expected to introduce new chipsets as part of AMD’s 2010 processor lineup<br />
  3. 3. Key Benefits<br />Choice ofChipsets<br />KeyTechnologies<br />Consistent Feature Set<br /><ul><li>AMD-P
  4. 4. AMD-V™
  5. 5. PCI Express® 2.0
  6. 6. HyperTransport™ 3.0 Technology</li></ul>SR5690<br />SR5650<br />SR5670<br />Benefits<br />Range and flexibilityof chipsets(from high bandwidth to power efficient)to meet the demandsof your workloads<br />Power efficiency beyond the processor<br />Exceptional Virtualization capabilities<br />Only 4P x86 solution with Tagged TLB, RVI and I/O Virtualization<br />Increased performance and throughput<br />(up to 2x for PCI Express® 2.0 vs. PCI Express® 1.0) <br />
  7. 7. TYAN S8208: Energy Efficient Server Platform<br />TYAN S8208 Overview<br />AMD and TYAN Collaboration<br />TYAN S8208 = Six-Core AMD Opteron™ EE + new AMD SR5650 & SP5100 server chipset <br />Energy Efficient<br /><ul><li>Designed for the Cloud
  8. 8. Optimized for HE& EE
  9. 9. Energy Efficient AMD Chipset
  10. 10. AMD-P Technology
  11. 11. Platform-level power management support
  12. 12. Expected Nov. 09</li></ul>Ultra power efficient twin form-factor platform designed for cloud and density deployments<br />
  13. 13. HPC University Implementation with PRACE<br />Solution<br />Challenge<br />Customer: Swedish National Infrastructure for Computing (SNIC), Royal Institute of Technology (KTH), Sweden, jointly with the Partnership for Advanced Computing in Europe (PRACE)<br />Need: A general purpose HPC cluster for energy efficiency and compute density using standard components <br /> Buying Criteria: <br />Superior performance/watt/density and ability to control energy consumption depending on workload and performance based on flop/s and GB/s <br />x86 Platform<br />Latest technology chipset supporting PCI Express® 2.0   <br />Collaborative effort between Supermicro UK office and AMD<br /> AMD product: Six-Core AMD Opteron™ HE processor with new AMD SR5670 chipset using HyperTransport™ 3 technology and HT assist<br /> Infrastructure: <br /><ul><li>SuperMicro Highly dense 7U enclosure (with 10x 4P Blade Model) BHQIE
  14. 14. QDR Switch incorporated inside the blade enclosure
  15. 15. Management per node including KVM/IP
  16. 16. Redundant PSU’s capable of operating at ultra high power efficiency</li></ul> Quantity: 720 processors; 4320 cores     <br />
  17. 17. OTOY and AMD Fusion Render Cloud<br />Solution<br />Challenge<br />Customer: OTOY<br />Need: The ability to deliver large scale computational power to service the needs of many end users who rely on central computing in lieu of graphics cards in their own devices.<br /> Buying Criteria: <br /><ul><li>FLOP/S capabilities in a small server form factor
  18. 18. PCI Express® 2.0 chipset to drive high end graphics
  19. 19. Maximum number of GPU's in a single server
  20. 20. Highly dense solution of servers and GPU's                                                </li></ul>AMD product: Six-Core AMD Opteron™ processor with Dual AMD 5690 chipsets and 4 AMD FireStream™ cards per node<br /> Infrastructure: : Supermicro 2P with dual 5690’s and 2 HyperTransport™ technology links per socket<br /> Quantity: 5 Racks; 120 nodes; 240 CPU’s and 480 GPU’s<br />                                               <br />
  21. 21. Tyan Planned Availability<br />
  22. 22. Supermicro Planned Availability<br />
  23. 23. AMD Server Platforms: A Look Ahead<br />Six-Core AMD Opteron™ Processor <br />Virtualizationdrives the need for more cores and greater scalability<br />AMD Opteron™ 6000 series platform<br />Performance/<br />Expandability<br />Quad-Core AMD Opteron™ Processor<br />Cloud computing and <br />dense deployments drivethe need for greater energy efficiency<br />AMD Opteron™ 4000 series platform<br />Power/ Cost Efficiency<br />Driving performance, consistency and value to the market<br />
  24. 24. Unified server platforms with AMD on AMD – benefits of processor and chipset<br />AMD continues to execute the strategy to provide enhanced platforms to the market <br />Range and flexibility of chipsets to meet varied demands of key workloads<br />Six-Core AMD Opteron™ processor with AMD chipset furthers AMD’s goal to drive performance, consistency and value in the market<br />Platform Benefits<br />
  25. 25. Disclaimer & Attribution<br />DISCLAIMER<br />The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors.<br />The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to product and roadmap changes, component and motherboard version changes, new model and/or product releases, product differences between differing manufacturers, software changes, BIOS flashes, firmware upgrades, or the like. AMD assumes no obligation to update or otherwise correct or revise this information. However, AMD reserves the right to revise this information and to make changes from time to time to the content hereof without obligation of AMD to notify any person of such revisions or changes.<br />AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION.<br />AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.<br />ATTRIBUTION<br />© 2009 Advanced Micro Devices, Inc.  All rights reserved.  AMD, the AMD Arrow logo, ATI, the ATI logo, AMD Opteron, AMD Virtualization, AMD-V, FireStream, and combinations thereof are trademarks of Advanced Micro Devices, Inc.  HyperTransport is a licensed trademark of the HyperTransport Technology Consortium. Microsoft, Windows, and Windows Vista are registered trademarks of Microsoft Corporation in the United States and/or other jurisdictions. OpenCL is a trademark of Apple Inc. used under license to the Khronos Group Inc. Other names are for informational purposes only and may be trademarks of their respective owners.<br />

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