Embedded Platforms Launch Press Presentation

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  • 1. Helping Drive Down Power, Footprint and Costs for High-Performance x86 Embedded Systems
    Buddy Broeker, Director, AMD Embedded Solutions
    AMD Confidential | Embargoed until 12:01 a.m. Monday, April 26, 2010
  • 2. Why AMD Embedded Solutions?
    X86 Delivers
    Direct Connect Architecture Delivers
    • Enterprise-class performance
    • 3. 64-bit capability
    • 4. Full functionality
    • 5. High-performance graphics support
    • 6. High-performance memory with low latency
    • 7. High I/O throughput
    • 8. RAS features, including ECC
    • 9. Low power, strong performance-per-watt
    • 10. Well-established software & tools and ecosystem
    • 11. Broad knowledge base among developers
    • 12. Support for multiple operating systems
    • 13. Efficient design & development cycles
    • 14. Fast time-to-market
  • AMD Continues to Advance x86 for Embedded Systems
    The AMD Geode™
    Addition of graphics and chipset options
    for comprehensive embedded solution
    AMD Geode™ NX based on AMD-K7™ architecture
    Ball Grid Array (BGA) packaging introduced to meet customer demand
    Introduction of AMD64 technology into embedded markets with AMD Opteron™ processor
    Today: 2 new
    complete-solution platforms
    Addition of AMD Turion™ and AMD Sempron™ processors
    AMD has increased performance and features,
    driven down power, area, and price barriers for x86 in embedded
  • 15. Today’s New Complete Platforms
    Improves performance and choice,
    maintains low power
    ASB2 with BGA Package
    High-Performance AM3
  • ASB2/785E BGA Platform Architecture
    14x USB 2.0
    2x USB 1.1
    Integrated Ethernet MAC
    Fully Integrated Solution
    HDCP + Audio
    HyperTransport™ 3 Technology
    Dual DVI/
    HDMI orDisplay
    Display Cache
    Two Independent
    Display Controllers
    2x8 or 1x16
    Gen 2
    6 x1
    Gen 2
    6X SATA 6GB/s
    2 x1
  • 43. Shrink the Design, Not the Performance
    Direct Connect
    Enterprise-class Features
    • Multi-core design
    • 44. Low memory latency
    • 45. DDR3 memory
    • 46. High-performance I/O with HyperTransport™ 3.0 technology
    • 47. Consistent 64-bit capability
    • 48. BGA and lidless options
    • 49. Low-z-height for small, compact form factors
    • 50. Small area footprint
    • 51. Reliability
    • 52. Low cost
    • 53. Fanless operation
    • 54. ECC
    • 55. Virtualization
    • 56. Multiple power management/ reduction features
    • 57. Enhanced Virus Protection¹
    • 58. No compromise on application performance
    • 59. Socket-compatibility for easy design upgrade
    • 60. Easy migration path to higher performance
    • 61. Chipset & graphics compatibility
    • 62. Clear roadmap progression
    ¹As part of a comprehensive security program, AMD strongly recommends enabling Enhanced Virus Protection (EVP) and using up to date third party anti-virus software.
  • 63. Ideal Applications
    Medical Imaging
    Point-of-sale (POS) &
    Kiosk Systems
    Industrial Controls
    Ruggedized, Field,
    & Military Systems
    & Networking
    Digital Signage
    Small/Home Office to Enterprise Storage
    Gaming Machines
    Single Board Computing (SBC)
  • 64. Moving Embedded x86 Forward
    • Integration of a new CPU core & the latest in graphics
    • 65. Improved overall platform performance with lower power compared to previous generation AMD platforms
    • 66. More form factor options with reduced footprint
    • 67. The technical features that matter, with an outstanding user experience
  • w
    Strong Commitment
    Long-term design support
    • Industry-standard longevity – planned 5+ years
    • 68. AMD has more than 30 years experience in embedded devices
    Enterprise-class, high-performance platforms with embedded-specific features and power
    • No compromises on the system design
    True innovation in x86 CPUs and graphics
    • Driving the capabilities of embedded systems forward
  • Forward-Looking Statement
    This presentation contains forward-looking statements concerning AMD and technology partner product offerings which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," “strategy,” “roadmaps,” "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this presentation are based on current beliefs, assumptions and expectations, speak only as of the date of this presentation and involve risks and uncertainties that could cause actual results to differ materially from current expectations. With respect to AMD, risks include the possibility that Intel Corporation's pricing, marketing and rebating programs, product bundling, standard setting, new product introductions or other activities targeting AMD's business will prevent attainment of AMD's current plans; customers stop buying AMD’s products or materially reduce their operations or demand for its products; AMD will be unable to develop, launch and ramp new products and technologies in the volumes and mix required by the market and at mature yields on a timely basis; standards promulgated by open standards will be adopted at rates slower than currently projected, demand for computers and, in turn, demand for AMD’s products will be lower than currently expected; there will be unexpected variations in market growth and demand for AMD’s products and technologies in light of the product mix that it may have available at any particular time or a decline in demand; and AMD will be unable to maintain the level of investment in research and development that is required to remain competitive. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to the Annual Report on Form 10-K for the fiscal year ended December 26, 2009.
    Trademark Attribution AMD, the AMD Arrow logo, AMD Athlon, AMD-K7, AMD Opteron, AMD Phenom,, AMD Sempron, AMD Turion, Geode, Radeon and combinations thereof are trademarks of Advanced Micro Devices, Inc.  HyperTransport is a licensed trademark of the HyperTransport Technology Consortium.  Microsoft, Windows, Windows Vista, and DirectX are registered trademarks of Microsoft Corporation in the United States and/or other jurisdictions. Other names are for informational purposes only and may be the trademarks of their respective owners.
    ©2010 Advanced Micro Devices, Inc. All rights reserved.