Helping Drive Down Power, Footprint and Costs for High-Performance x86 Embedded Systems<br />Buddy Broeker, Director, AMD ...
Why AMD Embedded Solutions?<br />X86 Delivers<br />Direct Connect Architecture Delivers<br /><ul><li>Enterprise-class perf...
64-bit capability
Full functionality
High-performance graphics support
High-performance memory with low latency
High I/O throughput
RAS features, including ECC
Low power, strong performance-per-watt
Well-established software & tools and ecosystem
Upcoming SlideShare
Loading in...5

Embedded Platforms Launch Press Presentation


Published on

Published in: Technology
  • Be the first to comment

  • Be the first to like this

No Downloads
Total Views
On Slideshare
From Embeds
Number of Embeds
Embeds 0
No embeds

No notes for slide

Embedded Platforms Launch Press Presentation

  1. 1. Helping Drive Down Power, Footprint and Costs for High-Performance x86 Embedded Systems<br />Buddy Broeker, Director, AMD Embedded Solutions<br />AMD Confidential | Embargoed until 12:01 a.m. Monday, April 26, 2010<br />
  2. 2. Why AMD Embedded Solutions?<br />X86 Delivers<br />Direct Connect Architecture Delivers<br /><ul><li>Enterprise-class performance
  3. 3. 64-bit capability
  4. 4. Full functionality
  5. 5. High-performance graphics support
  6. 6. High-performance memory with low latency
  7. 7. High I/O throughput
  8. 8. RAS features, including ECC
  9. 9. Low power, strong performance-per-watt
  10. 10. Well-established software & tools and ecosystem
  11. 11. Broad knowledge base among developers
  12. 12. Support for multiple operating systems
  13. 13. Efficient design & development cycles
  14. 14. Fast time-to-market</li></li></ul><li>AMD Continues to Advance x86 for Embedded Systems<br />The AMD Geode™<br />processor<br />Addition of graphics and chipset options<br />for comprehensive embedded solution <br />High-performance<br />AMD Geode™ NX based on AMD-K7™ architecture<br />Ball Grid Array (BGA) packaging introduced to meet customer demand <br />Introduction of AMD64 technology into embedded markets with AMD Opteron™ processor<br />Today: 2 new<br /> complete-solution platforms<br />Addition of AMD Turion™ and AMD Sempron™ processors<br />AMD has increased performance and features,<br /> driven down power, area, and price barriers for x86 in embedded<br />2003<br />2005<br />2007<br />2004<br />2006<br />2008<br />2009<br />2010<br />
  15. 15. Today’s New Complete Platforms<br />Improves performance and choice,<br /> maintains low power<br />ASB2 with BGA Package<br />High-Performance AM3<br /><ul><li>PCI Express® 2.0
  16. 16. DDR3
  17. 17. HT3
  18. 18. 25W
  19. 19. Dual-Core
  20. 20. 2.2GHz
  21. 21. DDR3
  22. 22. HyperTransport™ 3 (HT3) technology
  23. 23. 65W
  24. 24. Quad-Core
  25. 25. 2.2GHz
  26. 26. DDR3
  27. 27. HT3
  28. 28. DirectX® 10.1
  29. 29. Full 1080p resolution
  30. 30. Drive up to 4 displays
  31. 31. HDMI
  32. 32. UVD support
  33. 33. 8W, 12W, 15W
  34. 34. Single- or Dual-Core options
  35. 35. 1.0 – 1.5 GHz
  36. 36. DDR3
  37. 37. HT1 or HT3
  38. 38. 25W, 45W
  39. 39. Dual-Core
  40. 40. 2.0 – 2.8GHz
  41. 41. DDR2 or DDR3
  42. 42. HT3</li></li></ul><li>ASB2/785E BGA Platform Architecture<br />14x USB 2.0<br />2x USB 1.1 <br />Integrated Ethernet MAC<br />Fully Integrated Solution <br />HDCP + Audio<br />HyperTransport™ 3 Technology<br />Dual DVI/<br />HDMI orDisplay<br />Port<br />Display Cache<br />Two Independent<br />Display Controllers<br />2x8 or 1x16<br />Gen 2<br />LVDS<br />6 x1<br />VGA<br />Gen 2<br />6X SATA 6GB/s<br />2 x1<br />Audio<br />SB850M<br />
  43. 43. Shrink the Design, Not the Performance <br />Direct Connect<br />Architecture<br />Scalability<br />Enterprise-class Features<br />Packaging<br /><ul><li>Multi-core design
  44. 44. Low memory latency
  45. 45. DDR3 memory
  46. 46. High-performance I/O with HyperTransport™ 3.0 technology
  47. 47. Consistent 64-bit capability
  48. 48. BGA and lidless options
  49. 49. Low-z-height for small, compact form factors
  50. 50. Small area footprint
  51. 51. Reliability
  52. 52. Low cost
  53. 53. Fanless operation
  54. 54. ECC
  55. 55. Virtualization
  56. 56. Multiple power management/ reduction features
  57. 57. Enhanced Virus Protection¹
  58. 58. No compromise on application performance
  59. 59. Socket-compatibility for easy design upgrade
  60. 60. Easy migration path to higher performance
  61. 61. Chipset & graphics compatibility
  62. 62. Clear roadmap progression</li></ul>¹As part of a comprehensive security program, AMD strongly recommends enabling Enhanced Virus Protection (EVP) and using up to date third party anti-virus software.<br />
  63. 63. Ideal Applications<br />Thin-clients<br />Medical Imaging<br />Point-of-sale (POS) &<br />Kiosk Systems<br />Industrial Controls<br />Ruggedized, Field, <br />& Military Systems<br />Telecommunications<br />& Networking<br />Digital Signage<br />Small/Home Office to Enterprise Storage<br />Gaming Machines<br />Single Board Computing (SBC)<br />
  64. 64. Moving Embedded x86 Forward<br /><ul><li>Integration of a new CPU core & the latest in graphics
  65. 65. Improved overall platform performance with lower power compared to previous generation AMD platforms
  66. 66. More form factor options with reduced footprint
  67. 67. The technical features that matter, with an outstanding user experience </li></li></ul><li>w<br />Strong Commitment <br />Long-term design support<br /><ul><li>Industry-standard longevity – planned 5+ years
  68. 68. AMD has more than 30 years experience in embedded devices</li></ul>Enterprise-class, high-performance platforms with embedded-specific features and power<br /><ul><li>No compromises on the system design</li></ul>True innovation in x86 CPUs and graphics<br /><ul><li>Driving the capabilities of embedded systems forward</li></li></ul><li>Forward-Looking Statement<br />This presentation contains forward-looking statements concerning AMD and technology partner product offerings which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," “strategy,” “roadmaps,” "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this presentation are based on current beliefs, assumptions and expectations, speak only as of the date of this presentation and involve risks and uncertainties that could cause actual results to differ materially from current expectations. With respect to AMD, risks include the possibility that Intel Corporation's pricing, marketing and rebating programs, product bundling, standard setting, new product introductions or other activities targeting AMD's business will prevent attainment of AMD's current plans; customers stop buying AMD’s products or materially reduce their operations or demand for its products; AMD will be unable to develop, launch and ramp new products and technologies in the volumes and mix required by the market and at mature yields on a timely basis; standards promulgated by open standards will be adopted at rates slower than currently projected, demand for computers and, in turn, demand for AMD’s products will be lower than currently expected; there will be unexpected variations in market growth and demand for AMD’s products and technologies in light of the product mix that it may have available at any particular time or a decline in demand; and AMD will be unable to maintain the level of investment in research and development that is required to remain competitive. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to the Annual Report on Form 10-K for the fiscal year ended December 26, 2009.<br /> Trademark Attribution AMD, the AMD Arrow logo, AMD Athlon, AMD-K7, AMD Opteron, AMD Phenom,, AMD Sempron, AMD Turion, Geode, Radeon and combinations thereof are trademarks of Advanced Micro Devices, Inc.  HyperTransport is a licensed trademark of the HyperTransport Technology Consortium.  Microsoft, Windows, Windows Vista, and DirectX are registered trademarks of Microsoft Corporation in the United States and/or other jurisdictions. Other names are for informational purposes only and may be the trademarks of their respective owners.<br /> <br />©2010 Advanced Micro Devices, Inc. All rights reserved.<br />
  1. A particular slide catching your eye?

    Clipping is a handy way to collect important slides you want to go back to later.