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  • The real change this industry has gone through in the last 3 years is quite startling in fact. USER LIFESTYLE CHANGES: touch, mobile lifestyle, always-on/always connected (the disappearance of downtime) – social media and casual gaming, on-the-go content capture(creation)/manipulation/sharing
  • On this slide, you should inform the customer that…The amazing graphics IP that does so much will be available in the mobile devices driving much of today’s interest and volume in the retail market.AMD is committed to ensuring the best visual experience on these form factorsAMD’s strategy is focused on being #1 in new client devices, taking the best of smart phone / tablets devices and the best of traditional PC devices and the best form consoles, to offer unique and differentiated solutions for new client devices available from a broad range of OEMs. For these form factors, AMD delivers the world’s best visual capabilities and an uncompromised Window 8 / 8.1 experience.
  • Configuration:AMD "Larne" reference platform system with the Mullins quad-core APU, as well as the Temash-based AMD A6-1450 quad-core APU with AMD Radeon™ HD 8250 Graphics, 2x2GB of DDR3-1333MHz RAM (running at 1066MHz for the A6-1450), Windows 8 and the unreleased reference driver for Mullins, the 13.200.11.0 - 03-Sep-2013 driver for the A6-1450. AMD "Larne" reference platform system with the Beema quad-core APU, as well as the Kabini-based AMD A6-5200 quad-core APU with AMD Radeon™ HD 8400 Graphics, 2x2GB of DDR3-1600MHz RAM, Windows 8 and the unreleased reference driver for Beema, the 13.200.11.0 - 03-Sep-2013 driver for the A6-5200.
  • The new low-power APUs join the previously disclosed, high-performance notebook APU, “Kaveri”, in AMD’s 2014 mobile line-up.
  • AMD Wireless DisplayArchitectural definition of Windows 8.1 support for Miracast technology and implementation to enable AMD Wireless Display across a broad range of AMD-based PCsEcosystem support to enable solid inoperability and performance backed by recommendations, support tools and test cases available from both AMD and MicrosoftAMD low latency support enablement designed to provide a responsive user experience even when interacting with performance hungry, graphically intense applications such as in high end gamesPerformanceWe are seeing an overall uplift in performance on the same hardware when going from Windows 8 to Windows 8.1 with our new driver as result of our optimization work with MicrosoftOverall we are seeing solid performance across our product stack versus competitive products
  • Trends driving the need for higher security standards: mobility, cloud computing, consumerization of IT, advanced persistent threatsTo address this growing need, AMD is a part of an open-source community of companies dedicated to making the computing environment more secureAMD has licensed ARM Cortex-A5 technology to design a PSP with ARM TrustZone technology; Beema and Mullins will be the first client products to implement this solutionThe PSP is an AMD-designed component that resides on the SoCAmong other things, it:Identifies different data types and funnels them through the correct “side” of the processor – normal (GPU/CPU) vs secure (Cortex-A5)Is the first thing to boot when the system is turned on and cycles through a variety of actions to ensure the environment is secureWorks with 3rd party components – fingerprint readers, webcams, etc. – to ensure hardware security

Transcript

  • 1. AMD 2014 MOBILITY UPDATE NOVEMBER 13, 2013
  • 2. IN THIS DECK MARKET OVERVIEW AMD’S POSITION & FOCUS 2014 MOBILITY APU ROADMAP ADDITIONS NEW FEATURES & BENEFITS 2 | 2014 AMD MOBILITY APU LINEUP ANNOUNCEMENT | NOVEMBER 2013
  • 3. THE AMD MISSION To be the leading designer and integrator of innovative, tailored technology solutions that empower people to push the boundaries of what is possible. 3 | 2014 AMD MOBILITY APU LINEUP ANNOUNCEMENT | NOVEMBER 2013
  • 4. THE EVOLVING CLIENT MARKET OLD WINDOWS ECOSYSTEM ANDROID/IOS ECOSYSTEM THE NEW  Big screens  X86 performance focus  Work devices CLIENT ECOSYSTEM  Small screens  Good enough performance  Communication devices  Productivity  Content creation  Best gaming  Beautiful displays  App-based consumption  Browsing/entertainment  DT towers  Thick notebooks  Slow boot, bad battery life  Thin & light phones/tablets  Able to go virtually everywhere  Fast boot times, long battery life 4 | 2014 AMD MOBILITY APU LINEUP ANNOUNCEMENT | NOVEMBER 2013
  • 5. AMD’S MOBILITY FOCUS BRIDGING THE GAP BETWEEN TABLETS AND NOTEBOOKS PERFORMANCE TABLETS Productivity, more immersive experiences 2-in-1s CONVERTIBLES NOTEBOOKS Tablet & productivity notebook Full featured notebook first, converts to touch tablet 13–15” content creation and new compute experiences CONSUMPTION PRODUCTIVITY DELIVERING SURROUND COMPUTE EXPERIENCES ACROSS FORM FACTORS ENHANCED MEDIA NATURAL USER INTERFACES 5 | 2014 AMD MOBILITY APU LINEUP ANNOUNCEMENT | NOVEMBER 2013 GAMING CONTENT ANYWHERE
  • 6. AMD’S 2013 MOBILITY LINEUP IN ACTION SMALL SCREEN TOUCH NOTEBOOKS TABLETS & 2-in-1s VIZIO 11.6” Tablet PC MSI W20 3M Tablet Toshiba Satellite® Click HP Pavilion13 x2 6 | 2014 AMD MOBILITY APU LINEUP ANNOUNCEMENT | NOVEMBER 2013 HP Pavilion11 TouchSmart MSI S12T Notebook Acer Aspire V5-122P MAINSTREAM & PERFORMANCE NOTEBOOKS Acer Aspire V5-552 HP ENVY15 TouchSmart Samsung ATIV Book 9 Lite
  • 7. AMD 2013-2014 MOBILITY ROADMAP 2013 “Richland” APU “Kaveri” APU 2-4 “Piledriver” CPU Cores 2nd Generation DX®11 GPU Cores 17W-35W Performance Mainstream 2014 2-4 “Steamroller” CPU Cores GCN Graphics Compute Units HSA Features AMD TrueAudio 15W-35W 28nm 32nm “Kabini” APU 2-4 “Jaguar” CPU Cores GCN Graphics Compute Units 15W-25W Low-Power Essential 28nm “Beema ” APU 2-4 “Puma” CPU Cores GCN Graphics Compute Units AMD Security Processor 10W-25W 28nm SoC SoC “Temash” APU 2-4 “Jaguar” CPU Cores GCN Graphics Compute Units 3W-4W SDP Ultra-Low Power 28nm SoC “Mullins ” APU 2-4 “Puma”” CPU Cores GCN Graphics Compute Units AMD Security Processor ~2W SDP 28nm SoC AMD roadmaps are subject to change without notice or obligations to notify of changes. Placement of boxes intended to represent first year of production shipments. 7 | 2014 AMD MOBILITY APU LINEUP ANNOUNCEMENT | NOVEMBER 2013
  • 8. 2014 AMD MOBILITY ROADMAP ADDITIONS “MULLINS” Outstanding performance in an SOC designed for fanless tablets, 2-in-1s, and notebooks "Temash" 4C “BEEMA” More performance and the latest features for a better experience in mainstream & entry 2-in-1S AND NOTEBOOKS "Mullins" 4C 300% "Kabini" 4C 250% 250% 250% 200% 200% 200% 200% 150% 150% 150% 150% 100% 100% 100% 100% 50% 50% 50% 50% 0% 0% 0% "Beema" 4C 250% 0% 3DMark11 - Performance Normalized PCMark 8 - Home Normalized More than 2X the performance per watt of the previous generation1 3DMark11 - Performance Normalized PCMark 8 - Home Normalized  AMD Radeon™ graphics: The world's best graphics technology that is found in all the latest game consoles AND in PCs that deliver richer more lifelike videos, movies, photos and the best gaming experience  AMD DockPort technology support  Microsoft 8.1 optimizations and Microsoft InstantGo2 for faster wake times and to ensure data, such as e-mail, actively refreshes in standby  Platform security processor based on the ARM Cortex™-A5 processor featuring ARM TrustZone® technology for enhanced data security 8 | 2014 AMD MOBILITY APU LINEUP ANNOUNCEMENT | NOVEMBER 2013 See backup for footnotes
  • 9. AMD DOCKPORT TECHNOLOGY ONE CONNECTION, VIRTUALLY LIMITLESS POSSIBILITIES Use AMD DockPort to connect:  Up to four monitors*  Mouse/keyboard  External HDD DP HDMI VGA  Optical drive  Printers  Virtually any other device or peripheral that supports DP1.2 standard Up to USB 3.0 speed* Charging power 9 | 2014 AMD MOBILITY APU LINEUP ANNOUNCEMENT | NOVEMBER 2013 DP HDMI VGA DP HDMI VGA Dock DP 1.2 USB 3.0 Powers Notebook HDD KBD & Mouse Smart Phone DVD/Blu-ray * Use of 4 1920x1200 external monitors does not support simultaneous USB 3.0 speed. BPU support required.
  • 10. AMD AND MICROSOFT COLLABORATION – WINDOWS 8.1 AMD Wireless Display Enabling great experiences for end users with AMD Wireless Display3 built on top of Windows 8.1 support for Miracast technology Performance Optimizations in both Windows 8.1 as well as in the AMD driver4 to streamline performance Accelerated Experiences Internet Explorer 11 includes support for WebGL™ to enable acceleration for better online experiences when using AMD APUs and GPUs 10 | 2014 AMD MOBILITY APU LINEUP ANNOUNCEMENT | NOVEMBER 2013
  • 11. MICROSOFT INSTANTGO* WITH INSTANTGO, YOUR WINDOWS DEVICE IS RESPONSIVE AND ALWAYS READY INSTANTLY AVAILABLE ALWAYS CURRENT Your device wakes up the moment you need it Your apps and data are already up to date when your screen lights up Your experience can last all day with extended battery life  Go from standby mode to "on" in under 500 milliseconds  Maintains network connectivity* and syncs automatically while your device sleeps  Battery can last all-day while working or up to 14 days in standby mode  Allows Live Tiles, Windows Store apps, news, and data to refresh even when device is in standby  Designed for thin, light, and connected devices  Get back to what you were doing in the blink of an eye 11 | 2014 AMD MOBILITY APU LINEUP ANNOUNCEMENT | NOVEMBER 2013 * Material provided by Microsoft. Microsoft testing not independently verified by AMD. For full details please contact Microsoft directly.
  • 12. AMD-DESIGNED PLATFORM SECURITY PROCESSOR WITH ARM TRUSTZONE  Provides a Trusted Execution Environment (TEE) AMD SOC ‒ Protects against software attack from open/rich OS side of system ‒ Provides scalable environment for secure applications like user authentication, anti-malware, content management, online payments, etc.  Delivers two separate domains, normal and secure TrustZone API Secure OS in TEE Secure Monitor Secure Boot 12 | 2014 AMD MOBILITY APU LINEUP ANNOUNCEMENT | NOVEMBER 2013 Trusted App Trusted App Trusted App Secure World Isolated Apps Isolated Apps ‒ Processing data path ‒ On/off-chip memory ‒ I/O and display Normal World Isolated Apps ‒ Extends across entire system ‒ Beyond simply the processor/SOC ‒ Can deliver secure PSP (ARM Cortex-A5)
  • 13. IN SUMMARY THE CHANGING CLIENT MARKET CREATES A HUGE OPPORTUNITY, CENTERED AROUND CONVERGENCE FORM-FACTORS And AMD is uniquely positioned to succeed 13 | 2014 AMD MOBILITY APU LINEUP ANNOUNCEMENT | NOVEMBER 2013 GRAPHICS-INTENSIVE WORKLOADS SURROUND COMPUTING New additions to the 2014 Mobility Roadmap focus on delivering exceptional performance and important features for this new era
  • 14. Thank You Find us online: AMD.COM TWITTER FACEBOOK G+ LINKEDIN PINTEREST INSTAGRAM
  • 15. FOOTNOTES 1. Slide 8: Testing conducted by AMD Performance Labs on optimized AMD reference systems. PC manufacturers may vary configuration yielding different results. ‒ PCMark 8 - Home score divided by TDP(W) is used to simulate productivity performance per watt; the Mullins platform (4.5W) scored 1809 while the Temash platform(8W) scored 1343. MUN-3 AMD "Larne" reference platform system used for both APUs. Temash-based AMD A6-1450 quad-core APU with AMD Radeon™ HD 8250 Graphics, 2x2GB of DDR3-1333MHz RAM (running at 1066MHz), Windows 8.1, 13.200.11.0 - 03-Sep-2013 driver. Pre-production engineering sample of “Mullins” quad-core APU with next generation AMD Radeon graphics (model number TBD), 2x2GB DDR3-1333MHz RAM, Windows 8.1, and unreleased reference driver. ‒ 3DMark 11 score divided by TDP(W) is used to simulate graphics performance per watt; the Mullins (4.5W) platform scored 570 while the Temash (8W) platform scored 468. MUN-4 AMD "Larne" reference platform system used for both APUs. Temash-based AMD A6-1450 quad-core APU with AMD Radeon™ HD 8250 Graphics, 2x2GB of DDR3-1333MHz RAM (running at 1066MHz), Windows 8.1, 13.200.11.0 - 03-Sep-2013 driver. Pre-production engineering sample of “Mullins” quad-core APU with next generation AMD Radeon graphics (model number TBD), 2x2GB DDR3-1333MHz RAM, Windows 8.1, and unreleased reference driver. ‒ PCMark 8 - Home score divided by TDP(W) is used to simulate productivity performance per watt; the Beema platform (15W) scored 2312 while the Kabini platform(25W) scored 1861. BMN-3 AMD "Larne" reference platform system used for both APUs. Kabini-based AMD A6-5200 quad-core APU with AMD Radeon™ HD 8400 Graphics, 2x2GB of DDR3-1600MHz RAM, Windows 8.1, 13.200.11.0 - 03-Sep-2013 driver. Pre-production engineering sample of “Beema” quad-core APU with next generation AMD Radeon graphics (model number TBD), 2x2GB DDR3-1600MHz RAM, Windows 8.1, and unreleased reference driver. ‒ 3DMark 11 score divided by TDP(W) is used to simulate graphics performance per watt; the Beema (15W) platform scored 823 while the Kabini (25W) platform scored 685. BMN-4 Home score divided by TDP(W) is used to simulate productivity performance per watt; the Beema platform (15W) scored 2312 while the Kabini platform(25W) scored 1861. BMN-3 AMD "Larne" reference platform system used for both APUs. Kabini-based AMD A6-5200 quadcore APU with AMD Radeon™ HD 8400 Graphics, 2x2GB of DDR3-1600MHz RAM, Windows 8.1, 13.200.11.0 - 03-Sep-2013 driver. Pre-production engineering sample of “Beema” quad-core APU with next generation AMD Radeon graphics (model number TBD), 2x2GB DDR3-1600MHz RAM, Windows 8.1, and unreleased reference driver. 2. Slide 8: Material provided by Microsoft. Microsoft testing not independently verified by AMD. For full details please contact Microsoft directly. 3. Slide 9: AMD Wireless Display technology provides the ability to wirelessly display local screen content onto a remote screen with low latency and automatic upscaling of video and graphics. AMD Wireless Display technology is enabled on select systems with AMD APUs and requires Windows 8 and Wi-Fi certified Miracast™ receiver equipment. Confirm capabilities with system manufacturer before purchase. 4. AMD Catalyst™ 13.11 Beta Driver for Windows® (http://support.amd.com/en-us/kb-articles/Pages/latest-catalyst-windows-beta.aspx). 15 | 2014 AMD MOBILITY APU LINEUP ANNOUNCEMENT | NOVEMBER 2013
  • 16. DISCLAIMER & ATTRIBUTION The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors. The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to product and roadmap changes, component and motherboard version changes, new model and/or product releases, product differences between differing manufacturers, software changes, BIOS flashes, firmware upgrades, or the like. AMD assumes no obligation to update or otherwise correct or revise this information. However, AMD reserves the right to revise this information and to make changes from time to time to the content hereof without obligation of AMD to notify any person of such revisions or changes. AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION. ATTRIBUTION © 2013 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo and combinations thereof are trademarks of Advanced Micro Devices, Inc. in the United States and/or other jurisdictions. 16 | 2014 AMD MOBILITY APU LINEUP ANNOUNCEMENT | NOVEMBER 2013
  • 17. CAUTIONARY STATEMENT This Presentation contains forward-looking statements concerning Advanced Micro Devices, Inc. (“AMD” or the “Company”) including, among other things, AMD’s 2014 mobile Accelerated Processing Unit (APU) product roadmap, AMD’s future products including strategy, the timing , availability, features and functionality of such future products, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects," and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this presentation are based on current beliefs, assumptions and expectations, speak only as of the date of this presentation and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Risks include the possibility that that Intel Corporation’s pricing, marketing and rebating programs, product bundling, standard setting, new product introductions or other activities may negatively impact the Company’s plans; that the Company will require additional funding and may be unable to raise sufficient capital on favorable terms, or at all; that customers stop buying the Company’s products or materially reduce their operations or demand for its products; that the Company may be unable to develop, launch and ramp new products and technologies in the volumes that are required by the market at mature yields on a timely basis; that the company’s third-party foundry suppliers will be unable to transition the Company’s products to advanced manufacturing process technologies in a timely and effective way or to manufacture the Company’s products on a timely basis in sufficient quantities and using competitive process technologies; that the Company will be unable to obtain sufficient manufacturing capacity or components to meet demand for its products or will not fully utilize the Company’s projected manufacturing capacity needs at GLOBALFOUNDRIES Inc. (GF) microprocessor manufacturing facilities; that the Company’s requirements for wafers will be less than the fixed number of wafers that we agreed to purchase from GF or GF encounters problems that significantly reduce the number of functional die the Company receives from each wafer; that the Company is unable to successfully implement its long-term business strategy; that the Company inaccurately estimates the quantity or type of products that its customers will want in the future or will ultimately end up purchasing, resulting in excess or obsolete inventory; that the Company is unable to manage the risks related to the use of its third-party distributors and add-in-board (AIB) partners or offer the appropriate incentives to focus them on the sale of the Company’s products; that the Company may be unable to maintain the level of investment in research and development that is required to remain competitive; that there may be unexpected variations in market growth and demand for the Company’s products and technologies in light of the product mix that it may have available at any particular time; that global business and economic conditions, including consumer PC market conditions, will not improve or will worsen; and the effect of political or economic instability, domestically or internationally, on our sales or supply chain. Investors are urged to review in detail the risks and uncertainties in the Company's Securities and Exchange Commission filings, including but not limited to the Quarterly Report on Form 10-Q for the quarter ended September 28, 2013. 17 | 2014 AMD MOBILITY APU LINEUP ANNOUNCEMENT | NOVEMBER 2013